The present invention aims to provide a pressure sensitive adhesive having high pressure sensitive adhesiveness and heat resistance and serves to makes it possible to transfer and mount a large number of semiconductor elements at once even when the process involves a step for applying heat to the semiconductor elements. It provides a pressure sensitive adhesive including a polyimide copolymer (A) having at least an acid dianhydride residue and a diamine residue and also comprising a dimer acid epoxy resin (B), wherein the diamine residue has a diamine residue (A1) as represented by the formula (1) in which n is a natural number of 1 or more and 15 or less (hereinafter referred to as the diamine residue (A1)), a diamine residue (A2) as represented by the formula (1) in which n is a natural number of 16 or more and 50 or less (hereinafter referred to as the diamine residue (A2)), and a diamine residue (A3) having a phenolic hydroxyl group (hereinafter referred to as the diamine residue (A3)) and also wherein the diamine residue (A1) accounts for 50.0 mol % or more and 95.0 mol % or less, the diamine residue (A2) accounting for 1.0 mol % or more and 40.0 mol % or less, and the diamine residue (A3) accounting for 1.0 mol % or more and 30.0 mol % or less, of all diamine residues, which account for 100.0 mol %, in the polyimide copolymer (A).

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A composition for forming a film for a semiconductor includes: an aliphatic diamine (A) that includes at least one of a primary amino group or a secondary amino group, and a main chain including a carbon atom, in which, in the aliphatic diamine (A), the total number of primary amino groups and secondary amino groups is 2 or greater, the number of carbon atoms of the main chain is from 2 to 180; and a cross-linking agent (D) that includes three or more C(O)OX groups in a molecule thereof (X representing a hydrogen atom or an alkyl group having from 1 to 6 carbon atoms), in which from one to six of the three or more C(O)OX groups are C(O)OH groups, and the cross-linking agent (D) has a weight average molecular weight of from 200 to 2000. Applications of the composition are also disclosed.

The disclosure provides a positive photoresist composition, comprising: a (A) polyimide resin, a (B) photo active compound and a (C) solvent. The (A) polyimide resin is obtained by a polymerization reaction of a (a) diamine and a (b) tetracarboxylic dianhydride, and has a structural unit of formula (1); wherein, Ar.sup.1 in the formula (1) is a tetravalent organic group, Ar.sup.2 is a bivalent organic group, and Ar.sup.1 is a group of formula (B-1), formula (B-2), formula (B-3) or a combination thereof, and Ar.sup.2 is at least a group of formula (A-1), formula (A-2) or a combination thereof. Furthermore, Ar.sup.2 can further be a group of formula (A-3), formula (A-4), formula (A-5) or a combination thereof. The present disclosure further provides a negative photoresist pattern lithography process method and a photoresist pattern thereof.

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A thermoplastic composition includes a poly(etherimide-siloxane) copolymer having a siloxane content of more than 0 to less than 50 weight percent based on the total weight of the poly(etherimide-siloxane) copolymer; an aromatic polyketone; and a mineral filler having a particle diameter of 0.1-2 micrometers. The thermoplastic composition has a lower toxicity index than the same composition without the aromatic polyketone, the mineral filler, or both, as determined in accordance with EN53505.

A photo-aligning liquid crystal aligning agent for forming a liquid crystal alignment layer capable of materializing a liquid crystal display device, which has a high transmittance while maintaining a liquid crystal aligning property, a voltage holding ratio and the like, and in which flickering is inhibited from being caused after operating for a long time. The photo-aligning liquid crystal aligning agent contains [A] polyamic acid or a derivative thereof which is synthesized by reacting tetracarboxylic acid dianhydride and diamine, and [B] polyamic acid or a derivative thereof obtained by reacting tetracarboxylic acid dianhydride having no photoreactive structure and diamine having no photoreactive structure.

A poly(siloxane-etherimide) composition comprising, based on the total weight of the composition, 70 to 90 wt % of a poly(siloxane-etherimide); and an additive comprising a polyester, a filler, or a combination thereof; wherein the filler comprises talc, calcium carbonate, or a combination comprising at least one of the foregoing; and wherein the composition has a number of drops to tracking at 250 volts of greater than or equal to 50 drops determined according to ASTM D-3638-85.

This invention discloses a membrane composition, a method of making, and applications for a new type of high selectivity, high plasticization-resistant and solvent-resistant, both chemically and UV cross-linked polyimide membranes. Gas permeation tests on these membranes demonstrated that they not only showed high selectivities, but also showed extremely high CO.sub.2 plasticization resistance under CO.sub.2 pressure up to 4923 kPa (700 psig). This new type of high selectivity, high plasticization-resistant and solvent-resistant, both chemically and UV cross-linked polyimide membranes can be used for a wide range of gas separations such as separations of H.sub.2/CH.sub.4, He/CH.sub.4, CO.sub.2/CH.sub.4, CO.sub.2/N.sub.2, olefin/paraffin separations (e.g. propylene/propane separation), O.sub.2/N.sub.2, iso/normal paraffins, polar molecules such as H.sub.2O, H.sub.2S, and NH.sub.3 mixtures with CH.sub.4, N.sub.2, H.sub.2, and other light gases separations. The membranes can also be used for liquid separations such as in the removal of organic compounds from water.

An electrode binder, a cathode electrode material and a lithium ion battery are disclosed. The cathode electrode material includes the cathode binder. The cathode binder includes a polymer obtained by polymerizing a dianhydride monomer with a diamine monomer. At least one of the dianhydride monomer and the diamine monomer includes a silicon-containing monomer. The lithium ion battery includes an anode electrode, an electrolyte, a separator, and the cathode electrode, the cathode electrode includes a cathode active material, a conducting agent, and the cathode binder.

A resin composition containing (A) a polyimide having acidic functional groups and (B) a compound having functional groups that react with the acidic functional groups, where (a) a solution rate in 3 mass % aqueous sodium hydroxide at 45 C. is 0.95 or more after a heat history of 90 C. for 10 minutes with the solution rate before the heat history assumed to be 1, (b) the solution rate in 3 mass % aqueous sodium hydroxide at 45 C. ranges from 0.001 m/sec to 0.02 m/sec after the heat history of 180 C. for 60 minutes, (c) a bleed-out amount is 50 mg/m.sup.2 or less in storing at 40 C. for 2 weeks after the heat history of 180 C. for 60 minutes, and (d) a thermogravimetric decrease at 260 C. is 2.0% or less in measuring on a temperature rising condition of 10 C./min from 40 C. by thermogravimetric analysis (TG). When a multilayer flexible wiring board is manufactured using the resin composition, it is possible to obtain the resin layer excellent in alkali processability, embeddability in press, heat resistance, bendability, insulation reliability, and adhesion to the conductive layer.

An anode electrode material and a lithium ion battery are disclosed. The anode electrode material includes an anode binder. The anode binder includes a polymer obtained by polymerizing a dianhydride monomer with a diamine monomer. At least one of the dianhydride monomer and the diamine monomer includes a silicon-containing monomer. The lithium ion battery includes an anode electrode, an electrolyte, a separator, and the cathode electrode, the anode electrode includes an anode active material, a conducting agent, and the anode binder.