A polyimide-based composition includes a polyimide precursor and a solvent, in which the polyimide precursor includes repeating units represented by Chemical Formula 1 to 3. A polyimide film is also made from the composition.

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A polyetherimide composition is disclosed including a polyetherimide sulfone having a glass transition temperature of 240 to 320 C, preferably 245 to 312 C, and a particulate, thermally conductive filler composition. A layer of the polyetherimide composition resists deformation as determined by IPC method TM-650 when subjected to a lead-free solder reflow process at a temperature of greater than or equal to 260 C, preferably 260 to 350 C. A layer including the polyetherimide composition further has a thermal conductivity of 2.5 to 15 W/mK, preferably 3 to 12 W/mK, as determined in accordance with ISO 22007-2:2008.

The present invention provides a multilayer body of an inorganic substrate and a highly heat-resistant transparent film which has sufficient heat resistance and is able to be mechanically separated from the inorganic substrate after being subjected to various processes on the inorganic substrate since the adhesion between the highly heat-resistant transparent film and the inorganic substance is adequately weak. A multilayer body of a highly heat-resistant transparent film and an inorganic substrate, wherein: an adhesive is not substantially used; the peel strength between the highly heat-resistant transparent film and the inorganic substrate is 0.3 N/cm or less; and the CTE of the highly heat-resistant transparent film is 50 ppm/K or less.

A gas separation asymmetric membrane includes a porous layer having gas permeability; and a compact layer having gas separation capability which is formed on the porous layer in which the gas separation asymmetric membrane is formed using a polyimide compound which has a structural unit represented by Formula (I) and at least one structural unit selected from a structural unit represented by Formula (II) or a structural unit represented by Formula (III) and in which the viscosity, at 25° C., of a solution obtained by dissolving the polyimide compound in N-methylpyrrolidone at a concentration of 5% by mass is in a range of 2.2 to 22.0 mPa.Math.sec,

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in the formula, X.sup.1 represents a group having a structure represented by Formula (I-a) or (I-b).

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Provided is a resin capable of producing a photosensitive resin composition having high sensitivity and heat resistance. Disclosed is a resin having a structure represented by general formula (1) or (2) as a main component, wherein R.sup.2 has an organic group represented by general formula (3) and an organic group represented by general formula (4).

A poly(etherimide) includes repeating units derived from polymerization of a biphenol dianhydride and an organic diamine. A method of making the poly(etherimide) includes contacting the biphenol dianhydride and the organic diamine under conditions effective to provide a poly(etherimide). The poly(etherimide) can be useful in a variety of articles, for example in an optoelectronic component.

A polyimide precursor comprising at least one repeating unit represented by the following chemical formula (5): ##STR00001##
in which A.sub.3 is a divalent group of an aromatic diamine or an aliphatic diamine, from which amino groups have been removed; and X.sub.3 and Y.sub.3 are each independently hydrogen, an alkyl group having 1 to 6 carbon atoms, or an alkylsilyl group having 3 to 9 carbon atoms, and/or at least one repeating unit represented by the following chemical formula (6): ##STR00002##
in which A.sub.3 is a divalent group of an aromatic diamine or an aliphatic diamine, from which amino groups have been removed; and X.sub.4 and Y.sub.4 are each independently hydrogen, an alkyl group having 1 to 6 carbon atoms, or an alkylsilyl group having 3 to 9 carbon atoms.

A polymer, a composition, and a polysiloxane-polyimide material thereof are provided. The polymer includes a first repeat unit and a second repeat unit. The first repeat unit has a structure represented by Formula (I) and the second repeat unit has a structure represented by Formula (II) ##STR00001##
wherein A.sup.1 and A.sup.3 are independently tetravalent moiety; A.sup.2 is a divalent moiety; n≥1; m≥1; R.sup.1 is independently hydrogen, C.sub.1-8 alkyl, C.sub.1-8 fluoroalkyl, C.sub.1-8 alkoxy, or C.sub.6-12 aryl; and R.sup.2 is independently hydrogen, C.sub.1-8 alkyl, C.sub.1-8 fluoroalkyl, C.sub.1-8 alkoxy, C.sub.6-12 aryl, or a reactive functional group.

There is provided a polyimide precursor which can alter the hydrophilicity/hydrophobicity of the surface of a cured film formed readily even by a low level of ultraviolet ray irradiation; and a polyimide produced from the polyimide precursor. The polyimide precursor having a structure represented by the following formula (1): ##STR00001##
where A represents a tetravalent organic group; B represents a bivalent organic group having a thiol ester bond in its main chain; R.sup.1 and R.sup.2 independently represent a hydrogen atom or a univalent organic group; and n represents a natural number.

Provided are a liquid crystal alignment agent, a liquid crystal alignment film and a liquid crystal display element. The liquid crystal alignment agent at least comprises one of a polyamic acid solution and a polyimide solution. The polyamic acid solution is obtained by means of a polymerization reaction of diamine compound component A and dianhydride compound component B in a solvent, and the polyimide solution is obtained from the polyamic acid solution via a dehydration imidization treatment. The diamine component A at least comprises one of the diamine compounds represented by “formula 1”. The obtained liquid crystal alignment agent has a better liquid crystal alignment capability, an excellent effect on image sticking, and the effect that decomposition products resulting from light alignment are easy to remove. ##STR00001##