The present invention provides: a polyimide composite powder which includes 1-30 wt % of a fluorine-based resin filler, and has excellent low dielectric properties; and a production method using water as a dispersion medium. Also provided are a molded body including the polyimide composite powder, and a method for producing same.

A polyamic acid solution includes a dianhydride and a diamine. The dianhydride includes pyromellitic dianhydride, the diamine includes a benzimidazole, the molar ratio of dianhydride monomer to diamine monomer is in a range of from 0.85:1 to 0.99:1, and the polyamic acid solution has a solids content in a range of from 10 to 25 weight percent and a viscosity in a range of from 300 to 3000 poise.

A polyimide composition, comprising a functionalized polyimide prepared from a substituted or unsubstituted C.sub.4-40 bisanhydride; a substituted or unsubstituted C.sub.1-40 organic diamine; and optionally an organic compound comprising at least two functional groups per molecule, wherein a first functional group is reactive with an anhydride group, an amine group, or a combination thereof, and the first functional group is different from a second functional group, wherein the functionalized polyimide comprises a reactive end group of the formula (C.sub.1-40 hydrocarbylene)-NH.sub.2, (C.sub.1-40 hydrocarbylene)-OH, (C.sub.1-40 hydrocarbylene)-SH, (C.sub.4-40 hydrocarbylene)-G, or a combination thereof, wherein G is an anhydride group, a carboxylic acid, a carboxylic ester, or a combination thereof, wherein the functionalized polyimide has a total reactive end group concentration of 50-1,500 μeq/g of the functionalized polyimide, and wherein the polyimide composition has 0.05-1,000 ppm of residual organic diamine, wherein the functionalized polyimide is obtained by precipitation from a solution using an organic anti-solvent or by devolatilization.

The present invention relates to polyetherimide polymers which can for example be used in lithographic processes for the photofabrication of three-dimensional (3D) articles. The invention further relates to compositions including these polyetherimide polymers. Still further, the invention relates to lithographic methods to form 3D articles or objects that incorporate the aforementioned polymer compositions.

The resin composition according to one aspect is a resin composition containing a polyamic acid and a solvent, wherein the polyamic acid has a repeating unit represented by the following general formula (1) in a molecular chain, and the molecular chain has a structure represented by the following general formula (2) at one end or both ends. The proportion of the structure represented by the following general formula (2) relative to 1 mol of the repeating unit represented by the following general formula (1) is 0.001 mol or more and 0.1 mol or less. In the following general formulas, R.sup.1 is a tetravalent organic group; R.sup.2 is a divalent organic group; and R.sup.3 is an organic group having 15 or less carbon atoms.

##STR00001##

The present disclosure relates to a polyimide precursor and flexible polyimide obtained by imidization of the polyimide precursor and having high transparency, high glass transition temperature and low coefficient of thermal expansion.

In a first aspect, a polymer film includes a polyimide. The polyimide includes one or more dianhydrides and one or more diamines. Each of the dianhydrides and diamines is selected from the group consisting of crankshaft monomers, flexible monomers, rigid rotational monomers, rigid non-rotational monomers, and rotational inhibitor monomers. The polymer film has a D.sub.f of 0.005 or less, a water absorption of 2.0% or less and a water vapor transport rate of 50 (g×mil)/(m.sup.2×day) or less. In a second aspect, a metal-clad laminate includes the polymer film of first aspect and a first metal layer adhered to a first outer surface of the polymer film. In a third aspect, an electronic device includes the polymer film of the first aspect.

A resin composition includes a prepolymer and an additive, wherein: the prepolymer is prepared from a mixture subjected to a prepolymerization reaction, and the mixture includes 100 parts by weight of a maleimide resin, 15 to 30 parts by weight of a siloxane compound and 4 to 16 parts by weight of a diamine compound; the maleimide resin includes bisphenol A diphenyl ether bismaleimide, 3,3′-dimethyl-5,5′-diethyl-4,4′-diphenylmethane bismaleimide or a combination thereof; the siloxane compound includes a compound of Formula (I), wherein n is an integer of 5 to 40; and the diamine compound includes a compound of Formula (II) or Formula (III). The resin composition is made by using a preparation method. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board. ##STR00001##

A display panel includes the following elements: a substrate including a first base layer, wherein the first base layer includes a transparent polyimide resin; a first pixel circuit and a second pixel circuit over the substrate, spaced from each other with the transmission area between the first pixel circuit and the second pixel circuit, and each including transistors and a storage capacitor; a first display element electrically connected to the first pixel circuit; and a second display element electrically connected to the second pixel circuit.

Provided is a layered product that uses a high temperature-resistant transparent film having sufficient heat resistance, and that is capable of being mechanically released from an inorganic substrate after various processes are performed on the inorganic substrate since the adhesive strength between the high temperature-resistant transparent film and the inorganic substrate is appropriately weak, and that is less warped along with the inorganic substrate. In this layered product, no adhesive is used between the high temperature-resistant transparent film and the inorganic substrate, the release strength between the high temperature-resistant transparent film and the inorganic substrate is at most 0.3 N/cm, and the warpage amount of the layered product when heated at 300° C. is at most 400 .Math.m.