Aerogels comprising a hydrophobic polyimide moiety, including hydrophobic polyimide aerogels, as well as methods of manufacture and applications thereof, are generally described.

##STR00001##

A polyimide oligomer of formula (1a), (1b), a copolymer thereof, or a combination thereof ##STR00001##
wherein each G.sup.1 is independently the same or different, and is a cation group; each G.sup.2 is independently the same or different, and is an anion group; each D is independently the same or different, and is a single bond or C.sub.1-20 divalent hydrocarbon group; each V is independently the same or different, and is a tetravalent C.sub.4-40 hydrocarbon group; each R is independently the same or different, and is a C.sub.1-20 divalent hydrocarbon group; each n is independently the same or different, and is 1 to 1000, provided that the total of all values of n is greater than 4; and t is 2 to 1000.

A black matte polyimide film is provided, the black matte polyimide film includes polyimide, carbon black and polyimide fine powder. The polyimide component is obtained by polymerization of a dianhydride and a diamine, followed by chemical cyclization, in which the dianhydride is pyromellitic dianhydride, and the diamine comprises 5˜15 mol % of p-phenylenediamine and 95˜85 mol % of 4,4′-diaminodiphenyl ether; the carbon black is present in an amount of 2 to 8 wt % of the polyimide film; and the polyimide fine powder is present in an amount of 5 to 10 wt % of the polyimide film, such that the black matte polyimide film has a glossiness between 5 and 30 and a thermal expansion coefficient of less than 41 ppm/° C.

The present invention provides a polyimide composite having a structural formula of PI/Fe.sub.3O.sub.4-(β-CD-Ada)x, wherein x=3-5. One aspect of the invention provides a polyimide composite. By introducing Fe.sub.3O.sub.4 as a host material of an electromagnetic wave absorption material and introducing a guest material, a repairing property of the material itself is imparted by an interaction between the host material and the guest material. Therefore, the polyimide composite has an electromagnetic radiation shielding property and a self-repairing property.

An amide compound and a nitrogen-containing heterocyclic ring-containing compound which have a specific repeating unit and a crosslinking site represented by Formula (2):

—C≡CX.sup.1

at a molecular end.

The present invention provides a random or block polyimide-siloxane copolymer, which may be prepared from a hard amine monomer, a dianhydride monomer, and a soft amine monomer, may have mechanical properties, flexibility, and thermal properties adjusted through the control of soft amine content, and may exhibits high thermal stability, corrosion resistance, transparency and flexibility, and a method for preparing the same. The random or block polyimide-siloxane copolymer, which may be flexible and thermally stable and may exhibits adjustable mechanical properties and skin-like sensory functions, may be applied to flexible electronic devices.

An anhydride compound, polyimide, and thin film are provided. The anhydride compound has a chemical structure of

##STR00001##

wherein R.sup.1 is

##STR00002##

each of R.sup.4 is independently C.sub.1-6 alkylene group, m is an integer of 0 to 10, and m′ is an integer of 1 to 10; n is an integer of 1 to 10, each of R.sup.2 is independently hydrogen, saturated or unsaturated C.sub.1-6 hydrocarbon group, CF.sub.3, silanol group, silyl group, or Al(OH).sub.3; and R.sup.3 is

##STR00003##

silanol group, silyl group, or Al(OH).sub.3. The anhydride compound can be reacted with a diamine compound to form a polyimide.

The invention generally relates to polymer nanocomposite films that possess shape memory properties at elevated temperatures. Such films can absorb microwaves, are thermally conductive, are electrically conductive and have increased mechanical strength. In addition, the present invention relates to methods of fabricating such films into 3D objects. Due to the improved properties of such films more advanced sensors and microwave shields can be constructed.

A diamine monomer compound with reduced dielectric losses for better integrity and stability in digital transmissions is represented by a structural formula of

##STR00001##

wherein n.sub.1 is an integer greater than 1. A method for preparing the diamine monomer compound and a polyimide resin developed therefrom are disclosed. The diamine monomer compound introduces a long even numbered carbon chain and a liquid crystal unit structure, the long even numbered carbon chain giving flexibility, which reduces the regularity and rigidity of the molecular chain and facilitates film-forming processing. Dimensional stability is improved, and the coefficient of thermal expansion of the materials is reduced, the materials have good mechanical and heat-tolerant thermal properties, the loss factor and the coefficient of thermal expansion of the materials being reduced. A flexible film of the resin and an electronic device are also disclosed.

Disclosed herein are delamination resistant glass pharmaceutical containers which may include a glass body having a Class HGA1 hydrolytic resistance when tested according to the ISO 720:1985 testing standard. The glass body may have an interior surface and an exterior surface. The interior surface of the glass body does not comprise a boron-rich layer when the glass body is in an as-formed condition. A heat-tolerant coating may be bonded to at least a portion of the exterior surface of the glass body. The heat-tolerant coating may have a coefficient of friction of less than about 0.7 and is thermally stable at a temperature of at least 250° C. for 30 minutes.