The present specification relates to a binder resin, a photosensitive resin composition, an insulating film and a semiconductor device.

An aerogel that includes an open-cell structured polymer matrix is disclosed. The aerogel includes 5 wt. % to 50 wt. % of a polyamic amide polymer, based on the total weight of the aerogel, pores and at least 90% of the pore volume of the aerogel is made up of macropores, a porosity of at least 50%, as measure according to ASTM D4404-10, a density of 0.01 g/cm.sup.3 to 0.5 g/cm.sup.3, and the aerogel is thermally stable to resist browning at 330° C.

Aerogel compositions that include polyamic amides, methods for preparing the aerogel compositions, and articles of manufacture that include or manufactured from the aerogel compositions are described.

Novel aromatic polyimides, both thermoplastic and thermosettable, are disclosed based on use of asymmetric diamines and symmetric dianhydrides with either a functional endcap for further thermosetting or a non-functional endcap for retention of thermoplastic properties. Both aromatic polyimides have sufficient physical properties to be useful in 3D printing.

Embodiments of the present disclosure provide for an aromatic dianhydride, a method of making an aromatic dianhydride, an aromatic dianhydride-based polyimide, a method of making an aromatic dianhydride-based polyimide, and the like.

An insulated electric wire includes a rectangular conductor and an insulation film disposed on the periphery of the rectangular conductor. The insulation film is characterized by: the provision of a resin containing an imide structure within a molecule; and a peak value of less than 1.0 for the loss tangent tan δ, which is represented by the ratio between the loss elastic modulus and the storage elastic modulus, as measured in the 50 DEG C. to 400 DEG C. range.

A polymer dispersion is disclosed. The polymer dispersion includes a liquid crystal polymer powder, a polyamide acid, and a solvent. A solid content of the polymer dispersion includes the liquid crystal polymer powder and the polyamide acid. The liquid crystal polymer powder has a mass ratio of 20% to 30% in the solid content. The polyamide acid has a mass ratio of 70% to 80% in the solid content. The polyamide acid is obtained by mixing two kinds of diamines and two kinds of dianhydrides together, causing the diamines and the dianhydrides to be polymerized with each other. Both two kinds of diamines and two kinds of dianhydrides comprise a liquid crystal structure and a flexible structure respectively. A method of preparing the polymer dispersion, and a method for preparing a polymer composite film using the polymer dispersion are also disclosed.

The present invention provides a polyimide solution which does not require a ring-closing process at a high temperature for obtaining a heat-resistant polyimide non-woven fabric and which is hardly affected by atmosphere humidity in fiber production by electrospinning, so that a fiber with a stable diameter can be obtained in any circumstance.

A polyimide solution including: (a) a resin containing 50 mol % or more, based on the total amount of the resin, of a structural unit represented by the general formula (1); and (b) a solvent.

##STR00001##

A hybrid thermoplastic-thermosettable resin composition may include a polymeric backbone formed from a thermoplastic unit, and at least one crosslinkable group bonded to the thermoplastic. A method of forming a hybrid thermoplastic-thermosettable resin composition may include reacting a thermoplastic to introduce a cross-linkable group to form the thermoplastic-thermosettable resin composition. A method of forming a hybrid thermoplastic-thermoset resin may include providing a hybrid thermoplastic-thermosettable resin composition comprising a polymeric backbone formed from a thermoplastic unit, and at least one crosslinkable group bonded to the thermoplastic; and curing the hybrid thermoplastic-thermosettable resin composition by an external stimulus to form the hybrid thermoplastic-thermoset resin.

Disclosed herein are delamination resistant glass pharmaceutical containers which may include an aluminosilicate glass having a Class HGA 1 hydrolytic resistance when tested according to ISO 720-1985 testing standard. The glass containers may also have a compressive stress layer with a depth of layer of greater than 25 μm. A surface compressive stress of the glass containers may be greater than or equal to 350 MPa. The delamination resistant glass pharmaceutical containers may be ion exchange strengthened and the ion exchange strengthening may include treating the delamination resistant glass pharmaceutical container in a molten salt bath for a time less than or equal to 5 hours at a temperature less than or equal to 450° C.