In one embodiment, a powder composition can comprise polyimide particles, wherein the polyimide particles can have a glass transition temperature of not greater than 200° C. and a crystallinity of not greater than 20%. The powder composition can be adapted for forming a three-dimensional polyimide-based body in a powder-based additive manufacturing process. In one aspect, the polyimide particles can have an average particle size (D50) of at least 20 microns and not greater than 120 microns, an amount of the polyimide particles can be at least 60 wt % based on the total weight of the powder composition; and a material of the polyimide particles is a polymerization product of at least one diamine monomer and at least one dianhydride monomer.

The present invention relates to a resin composition containing a compound having a maleimido group, a divalent group having at least two imido bonds and a saturated or unsaturated divalent hydrocarbon group.

Provided herein are polyimide dispersants, as well as methods for producing polyimide dispersants. The polyimides can be defined by the formula below ##STR00001##
wherein A, individually for each occurrence, represents a cyclic diimide moiety represented by the structure below ##STR00002##
where B represents a cyclic moiety substituted with a first cyclic imide group and a second cyclic imide group; Y, individually for each occurrence, represents a bivalent linking group; L, individually for each occurrence, is absent or represents a cyclic imide group; R, individually for each occurrence, represents a polymeric tail; and n is an integer from 1 to 20.

The present invention provides an alkali-soluble resin with which a cured film having high extensibility, reduced stress, high adhesion to a metal, and high heat resistance can be obtained, and a photosensitive resin composition containing the alkali-soluble resin, and the present invention is an alkali-soluble resin (A) including a structure represented by a general formula (1) wherein X.sup.1 represents a divalent organic group having 2 to 100 carbon atoms, Y.sup.1 and Y.sup.2 each represent a divalent to hexavalent organic group having 2 to 100 carbon atoms, X.sup.2 represents a tetravalent organic group having 2 to 100 carbon atoms, p and q each represent an integer in a range of 0 to 4, and n.sup.1 and n.sup.2 each represent an integer in a range of 5 to 100,000, wherein (I) and (II) described below are satisfied: (I) an organic group having an aliphatic chain having 8 to 30 carbon atoms is contained as X.sup.1 of the general formula (1) at a content of 30 to 70 mol % based on 100 mol % of a total of X.sup.1 and X.sup.2, and (II) an organic group having a diphenyl ether structure is contained as Y.sup.1 of the general formula (1) at a content of 1 to 30 mol % based on 100 mol % of a total of Y.sup.1 and Y.sup.2.

The present invention addresses the problem of providing a flexible electronic element substrate comprising a polyimide layer that has both low ultraviolet transmittance and high visible light transmittance and that is capable of suppressing ultraviolet degradation without any reduction in the performance of an electronic element. In order to solve this problem, the flexible electronic element substrate comprises a polyimide layer that satisfies all of (1) through (3) below: (1) maximum transmittance at a wavelength of 400±5 nm is 70% or higher at a thickness of 5 μm; (2) the b* value in an L*a*b* color system is 5 or less at a thickness of 5 μm; and (3) transmittance of light at a wavelength of 350 nm is 10% or less at a thickness of 5 μm.

A polymer film comprising at least two properties selected from (i) a thickness of not greater than 100 μm; (ii) a tensile modulus according to ASTM D882 of at least 5 GPa; (iii) a first optical transparency according to ASTM D1746-15 at 380 nm of less than 50%; (iii) a Yellowing Index according to ASTM E313-15e1 of not greater than 2.5; (iv) a haze as determined according to ASTM D1003-13 of not greater than 1.5%; (v) a pencil hardness of greater than 1H; (vi) a coefficient of moisture expansion (‘CME’) as determined according to ASTM D5229/D5229M-14 of not greater than 50 ppm; (vii) an elongation at break as determined according to ASTM D5034-09 (2017) of at least 10%; or (viii) a folding endurance as determined according to ASTM D2176-16 at a radius of 1 mm of at least 10,000 folds.

The present invention provides curable, high molecular weight (>20,000 Daltons) polyimide compounds. The polyimides, once cured, possess a wide range of glass transition temperatures, have high tensile strength and high elongation. Furthermore, the cured polyimides are hydrophobic, have high glass transition temperatures, low coefficient of thermal expansion, very low dielectric constant and very low dielectric dissipation factor.

Aspects of the present disclosure provide for bridgehead-substituted triptycene-based diamines and methods of making bridgehead-substituted triptycene-based diamines.

Provided is an interlayer insulating material that can enhance the adhesion between an insulating layer and a metal layer, and can reduce the surface roughness on a surface of the insulating layer. The present invention is an interlayer insulating material used for a multilayer printed wiring board, which contains an epoxy compound, a curing agent, a silica, and a polyimide, and in which the polymide is a reactant of a tetracarboxylic anhydride and a dimer acid diamine, a content of the silica is 30% by weight or more and 90% by weight or less in 100% by weight of components excluding a solvent in the interlayer insulating material, and the total content of the epoxy compound and the curing agent in 100% by weight of components excluding the silica and a solvent in the interlayer insulating material is 65% by weight or more.

Provided is a polyimide powder composition containing a thermoplastic polyimide resin powder (A) and silica particles (B) having a volume average particle size D50 of 90 nm or less.