Patent classifications
C08G73/1082
Binder composition for secondary battery
A purpose of the present invention is to provide a binder composition for a secondary battery which can impart excellent battery characteristics, even when the heat treatment temperature is low. The binder composition for a secondary battery according to the present invention is characterized by comprising a polyamic acid comprising a repeating unit represented by chemical formula (1) and an aromatic compound comprising an electron donating group and an organic acid group, ##STR00001##
wherein A is a tetravalent group obtained by removing acid anhydride groups from a tetracarboxylic dianhydride, B is a divalent group obtained by removing amino groups from a diamine, and at least one of A and B is an aliphatic group.
PREPARATION METHOD OF ZEOLITE/POLYIMIDE COMPOSITE MEMBRANE AND APPLICATIONS THEREOF
A preparation method of a zeolite/polyimide composite membrane includes: synthesizing a zeolite-doped polyamic acid precursor casting solution by condensation polymerization synthesis; coating a substrate with the obtained casting solution, and obtaining a zeolite/polyamic acid composite porous membrane by non-solvent induced phase separation; and obtaining the zeolite/polyimide composite membrane by performing thermal imidization on the zeolite/polyamic acid composite porous membrane through gradient heating.
SINGLE LAYER POLYMER FILMS AND ELECTRONIC DEVICES
In one aspect, a single layer polymer film includes 25 to 97.5 wt % of a polyimide having a refractive index of 1.74 or less, 0.5 to 20 wt % of a matting agent and 1 to 30 wt % of a black colorant. On an air side, the single layer polymer film has an L* color of 33 or less and a 60° gloss of 10 or less. In another aspect, a single layer polymer film includes 80 to 99 wt % of a polyimide having a refractive index of 1.74 or less and 1 to 30 wt % of a black colorant. A surface of the single layer polymer film has been textured and has a maximum roughness (S.sub.pv) of 7 μm or more, an L* of 33 or less and a 60° gloss of 10 or less.
Polyimide resin and metal-clad laminate comprising the same
The present disclosure provides a polyimide resin having at least two glass transition temperatures measured by dynamic mechanical analysis (DMA). Also, a metal-clad laminate including the polyimide resin.
DIAMINE COMPOUND, METHOD OF PREPARING DIAMINE COMPOUND, AND POLYIMIDE
A diamine compound represented by H.sub.2NH.sub.2C-Ro.sup.2-CH.sub.2NH.sub.2, wherein Ro.sup.2 represents a residue of a resin acid dimer.
Poly(etherimide-siloxane)/poly(phthalamide) compositions, articles prepared therefrom, and methods for the manufacture thereof
A thermoplastic composition includes a poly(phthalamide), a poly(etherimide-siloxane), and optionally, an additive composition. The respective amounts of each component are further described herein. A method for the manufacture of the composition includes melt-mixing the components of the composition, and optionally, extruding the composition. Articles including the thermoplastic composition are also described.
MANUFACTURING METHOD OF CONTINUOUS TRANSPARENT POLYIMIDE FILM FOR DISPLAY
A manufacturing method of a continuous transparent polyimide film for a display includes the following steps providing a roll-to-roll polyimide film; providing a polyimide precursor, which is coated on the polyimide film; and baking the polyimide precursor at a baking temperature that is at least 20° C. higher than a glass transition temperature of the transparent polyimide film, such that the transparent polyimide film has an optical transmittance of greater than 85%, a chromaticity (b*) of less than 2, and a standard deviation of three axial refractive indices of the transparent polyimide film is less than 0.0012. Thus, the transparent polyimide film with reduced light leakage can be obtained.
POLYIMIDE RESIN COMPOSITION
A polyimide resin composition obtained by blending a polyimide resin (A) and glass fiber (B), the polyimide resin (A) containing a repeating structural unit represented by the following formula (1) and a repeating structural unit represented by the following formula (2), a content ratio of the repeating structural unit of the formula (1) with respect to the total of the repeating structural unit of the formula (1) and the repeating structural unit of the formula (2) being 20 to 70 mol %, wherein R.sub.1 represents a divalent group having from 6 to 22 carbon atoms containing at least one alicyclic hydrocarbon structure; R.sub.2 represents a divalent chain aliphatic group having from 5 to 16 carbon atoms; and X.sub.1 and X.sub.2 each independently represent a tetravalent group having from 6 to 22 carbon atoms containing at least one aromatic ring.
##STR00001##
Polyimide Based Film and Display Device Comprising the Same
Provided are a polyimide-based film and a display device including the same. More particularly, a polyimide-based film having an excellent press characteristic and a display device including the same are provided. As an exemplary embodiment, a polyimide-based film is provided, wherein when a load is applied to a surface of the film with an Erichsen pen, a maximum load satisfies the following Relation 1:
wherein
F.sub.e is a maximum load (N) at which when a load is applied to the surface of the polyimide-based film with the Erichsen pen, the surface is not scratched, and T.sub.e is a thickness (μm) of the polyimide-based film.
RESIN COMPOSITION, RESIN SHEET, CURED FILM, METHOD FOR PRODUCING CURED FILM, SEMICONDUCTOR DEVICE, AND DISPLAY DEVICE
Provided is a resin composition which makes it possible to improve the resistance to a flux to be used in soldering and the resistance to reflow, and which, when used as a photosensitive resin composition, can be cured into a film capable of being imparted with such thick film processability that the film can be processed with high sensitivity even when the thickness of the film is as high as 15 m or more. A resin composition comprising (A) a resin having a structural unit represented by general formula (1) and/or general formula (2), (B) a phenolic resin and (C) an antioxidant agent, wherein the phenolic resin (B) contains a structure represented by general formula (3).