Patent classifications
C08G73/1082
SOLVENT FOR RESIN SYNTHESIS AND METHOD FOR PRODUCING SYNTHETIC RESIN USING SAID SOLVENT
To provide: a solvent used for synthesizing a synthetic resin such as a polyimide resin and a polyurethane resin, the solvent capable of synthesizing a polymer having a high molecular weight in a short time, causing no clouding of a reaction solution during and after reaction, and having high transparency and storage stability; and a method for producing the synthetic resin using the solvent. A solvent (C) for resin synthesis, containing: 10 to 99.9999 mass % of an amide-based solvent (A); and 0.0001 to 5 mass % of a reaction accelerator (B), in which the reaction accelerator (B) is an aliphatic or aromatic tertiary amine compound having one or more tertiary amino groups in a molecule of the reaction accelerator (B).
Polymer composition, molded part and processes for production thereof
The present invention relates to a polymer composition, consisting of (A) 30-90 wt. % of at least one thermoplastic polymer comprising at least a semi-crystalline semi-aromatic polyamide (SSPA-1) in an amount in the range of 30-90 wt. %; (B) 10-70 wt. % of at least one reinforcing agent, and (C) 0-25 wt. % of one or more other components; wherein the SSPA-1 consists of (A-1-a) 90-100 wt. % of repeat units derived from (i) an aromatic dicarboxylic acid and (ii) diamines, and (A-1-b) 0-10 wt. % of repeat units derived from other monomers; the diamines (ii) consist of 80-95 mole % of a linear aliphatic diamine, 5-20 mole % of 2-methyl-pentamethylene diamine, and 0-10 mole % of other diamines; and the SSPA-1 has a melting temperature (Tm) of at least 300 C. The invention further relates to a molded part made of the composition, a process for making the composition and a process for making the molded part.
Polyimide resin and polyimide resin composition
A polyimide resin including a structural unit A derived from a tetracarboxylic dianhydride and a structural unit B derived from a diamine compound, wherein the structural unit A includes a structural unit (A-1) derived from a compound represented by the following formula (a-1), and the structural unit B includes a structural unit (B-1) derived from a compound represented by the following formula (b-1): ##STR00001## wherein m and n in the formula (b-1) each independently are an integer of 0 or 1.
ALKALI-SOLUBLE RESIN, PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE SHEET, CURED FILM, INTERLAYER INSULATING FILM OR SEMICONDUCTOR PROTECTIVE FILM, PRODUCTION METHOD FOR RELIEF PATTERN OF CURED FILM, AND ELECTRONIC COMPONENT OR SEMICONDUCTOR DEVICE
The present invention provides an alkali-soluble resin with which a cured film having high extensibility, reduced stress, high adhesion to a metal, and high heat resistance can be obtained, and a photosensitive resin composition containing the alkali-soluble resin, and the present invention is an alkali-soluble resin (A) including a structure represented by a general formula (1) wherein X.sup.1 represents a divalent organic group having 2 to 100 carbon atoms, Y.sup.1 and Y.sup.2 each represent a divalent to hexavalent organic group having 2 to 100 carbon atoms, X.sup.2 represents a tetravalent organic group having 2 to 100 carbon atoms, p and q each represent an integer in a range of 0 to 4, and n.sup.1 and n.sup.2 each represent an integer in a range of 5 to 100,000, wherein (I) and (II) described below are satisfied: (I) an organic group having an aliphatic chain having 8 to 30 carbon atoms is contained as X.sup.1 of the general formula (1) at a content of 30 to 70 mol % based on 100 mol % of a total of X.sup.1 and X.sup.2, and (II) an organic group having a diphenyl ether structure is contained as Y.sup.1 of the general formula (1) at a content of 1 to 30 mol % based on 100 mol % of a total of Y.sup.1 and Y.sup.2.
TEMPORARY BONDING COMPOSITION, TEMPORARY BONDING FILM, COMPOSITE FILM, METHOD FOR TEMPORARY BONDING WORKPIECE AND SEMICONDUCTOR WAFER PACKAGING
A temporary bonding composition is provided. The temporary bonding composition includes a polyfunctional crosslinker, a polymer and a solvent. The polyfunctional crosslinker includes a compound containing at least two functional groups selected from the group of blocked isocyanate groups, alkenyl ether groups, and alkoxyhydrocarbyl groups. Each of the blocked isocyanate groups is an isocyanate group protected by a blocking agent. The polymer has a functional group reacting to the polyfunctional crosslinker.
Intrinsically microporous ladder-type Tröger's base polymers
Embodiments of the present disclosure feature an intrinsically microporous ladder-type Trger's base polymer including a repeat unit based on a combination of W-shaped CANAL-type and V-shaped Trger's base building blocks, methods of making the intrinsically microporous ladder-type Trger's base polymer, and methods of using the intrinsically microporous ladder-type Trger's base polymer to separate a chemical species from a fluid composition including a mixture of chemical species. Embodiments of the present disclosure further include ladder-type diamine monomers for reacting to form a Trger's base in situ, and methods of making the ladder-type diamine monomers using catalytic arene-norbornene annulation.
SEPARATION MEMBRANE COMPRISING COATING LAYER, METHOD OF PREPARING SAME, AND BATTERY USING SAME
Disclosed herein is a high thermal resistant polyolefin-based separator including a coating layer containing polyamic acid.
Specifically, the separator includes a polyolefin-based substrate film, and a coating layer containing polyamic acid formed on one or both surfaces of the polyolefin-based substrate film, wherein the polyamic acid contains one or more functional groups selected from the group consisting of a sulfone group, a trifluoromethyl group, an alkyl group, and a phenyl ether group.
Also, disclosed herein is an electrochemical battery having improved thermal stability by using the separator including a coating layer containing polyamic acid.
POLYIMIDE-BASED POLYMER FILM, SUBSTRATE FOR DISPLAY DEVICE, AND OPTICAL DEVICE USING THE SAME
The present disclosure relates to a polyimide-based resin film which is synthesized by the reaction of an acid anhydride compound and a diamine compound having a specific structure, thereby capable of ensuring excellent flatness even under high temperature heat treatment conditions, and stably maintaining flatness even during further heat treatment, a substrate for display device, and an optical device using the same.
POLYIMIDE-BASED POLYMER FILM, SUBSTRATE FOR DISPLAY DEVICE, AND OPTICAL DEVICE USING THE SAME
The present disclosure relates to a polyimide-based resin film which is synthesized by the reaction of an acid anhydride compound and a diamine compound having a specific structure, a substrate for display device, and an optical device using the same.
Alignment film and liquid crystal display device
The present invention aims to provide an alignment film capable of sufficiently reducing image sticking and stain in a liquid crystal display device, and a liquid crystal display device including a photo-alignment film and sufficiently reducing image sticking and stain. The alignment film of the present invention contains a polymer containing a nitrogen radical-containing group, and a photo-functional group. The nitrogen radical-containing group is preferably a hydrazyl radical-containing group represented by the following formula (I) or (II): ##STR00001##
wherein R.sup.1 is a direct bond or a divalent organic group; Me is a methyl group; and Bu is a butyl group.