An object of the invention is to provide a cured film which is high in sensitivity, capable of forming a pattern in a low-taper shape, capable of the change in pattern opening width between before and after thermal curing, an excellent in light-blocking property, and a photosensitive resin composition that forms the film. The photosensitive resin composition contains an (A) alkali-soluble resin, a (C) photosensitive agent, a (Da) black colorant, and a (F) a cross-linking agent, where the (A) alkali-soluble resin contains a (A1) first resin including one or more selected from the group consisting of: a specific (A1-1) polyimide; a (A1-2) polyimide precursor; a (A1-3) polybenzoxazole; and a (A1-4) polybenzoxazole precursor, and contains a structural unit having a fluorine atom at a specific ratio, the content ratio of the (Da) black colorant is a specific ratio, and the (F) cross-linking agent contains an epoxy compound that has a specific structure, and/or an epoxy resin that has a specific structural unit.

Provided are a slurry composition having a low thixotropy and a superior handling property; a cured product of this slurry composition; and a substrate, film and prepreg using such cured product, the substrate, film and prepreg exhibiting excellent mechanical properties and a low relative permittivity and dielectric tangent. The slurry composition has a thixotropic ratio of not higher than 3.0, and comprises: (A) a cyclic imide compound having, per molecule, at least one dimer acid backbone, at least one linear alkylene group having not less than 6 carbon atoms, and at least two cyclic imide groups; (B) spherical silica fine particles and/or alumina fine particles having an average particle size of 0.05 to 20 m when measured by a laser diffraction method; (C) a silane coupling agent capable of reacting with the components (A) and (B); and (D) an organic solvent.

A dual-cure method for forming a solid polymeric structure is provided. An end-capped, imide-terminated prepolymer is combined with at least one photopolymerizable olefinic monomer, at least one photoinitiator, and a diamine, to form a curable resin composition, which, in a first step, is irradiated under conditions effective to polymerize the at least one olefinic monomer, thus forming a scaffold composed of the prepolymer and the polyolefin with the diamine trapped therein. The irradiated composition is then thermally treated at a temperature effective to cause a transimidization reaction to occur between the prepolymer and the diamine, thereby releasing the end caps of the prepolymer and providing the solid polymeric structure. A curable resin composition comprising an end-capped, imide-terminated prepolymer, at least one photopolymerizable olefinic monomer, at least one photoinitiator, and a diamine, is also provided, as are related methods of use.

In a first aspect, a polyimide film includes a dianhydride, a fluorinated aromatic diamine and an aliphatic diamine. The polyimide film has a b* of less than one for a film thickness of at least 30 microns and a glass transition temperature of less than 300 C. In a second aspect, an electronic device includes the polyimide film of the first aspect.

A process for the purification of an oxydiphthalic anhydride includes contacting a mixture of an oxydiphthalic anhydride and at least one of the corresponding oxydiphthalic diacid, a corresponding oxydiphthalic tetraacid, a halophthalic anhydride, and a catalyst with a solvent to provide a slurry. The solvent is capable of solubilizing the corresponding oxydiphthalic diacid, the corresponding oxydiphthalic tetraacid, the halophthalic anhydride, and the catalyst at a temperature of 15 to 50 C., and the oxydiphthalic anhydride is substantially insoluble in the solvent at this temperature. The oxydiphthalic anhydride can be isolated from the slurry. A purified oxydiphthalic anhydride and a polyetherimide prepared therefrom are also disclosed.

The invention relates to a process for producing aromatic polyimides, comprising the following steps: (a) preparation of one or more solid salt(s) by reacting one or more aromatic tetracarboxylic acid(s) and one or more diamine(s) according to a mole ratio ranging from 0.95 to 1.05; (b) drying of the solid salt(s), (c) addition, to the dry salt resulting from step (b), of one or more compound(s) (C) comprising one or more group(s) chosen from a carboxylic acid group, an anhydride group, an ester group and an acyl chloride group; (d) solid-state polymerization of said solid salt(s) in the presence of the compound(s) (C).

A fast-response thermoplastic shape-memory polyimide and a preparation method thereof, related to a polyimide and a preparation method thereof. The present invention aims to solve the problem in high-temperature conditions of slow shape recovery poor stability, and poor mechanical properties of a shape-memory polymer prepared by utilizing an existing method. The structural formula of the polyamide of the present invention is as represented by formula (I). The preparation method is: 1. preparation of a diamine solution; 2. preparation of an anhydride-terminated high molecular weight polyamic acid; 3. preparation of a viscous sol-gel; and, 4. preparation of the thermoplastic shape-memory polyimide. The thermoplastic shape-memory polyimide prepared per the present invention is provided with a very fast shape recovery rate and improved shape-memory effect. The present invention is applicable in the field of polyimide preparation.

The present disclosure provides novel polyimides having a high aliphatic monomer-content and improved optical properties and solubility relative to conventional polyimides. Also provided are methods of making the polyimides, articles of manufacture incorporating the polyimides and methods for making these, as well as methods of using the polyimides.

A method for producing an aqueous polyimide precursor solution composition includes forming a polyamic acid by the reaction of a tetracarboxylic acid component and a diamine component in an aqueous solvent together with an imidazole in an amount of 1.6 mole or more per mole of the tetracarboxylic acid component of the polyamic acid.

A resin composition comprising (a) at least one resin selected from polyimides and polyimide precursors, and (b) a solvent, wherein the loss tangent (tan ), represented by the following formula (I) and determined by a dynamic viscoelasticity measurement under the conditions of a temperature of 22 C. and an angular frequency of 10 rad/s, is 150 or more and less than 550, provides a resin composition which has no defects such as rupture of the film when the coated film is dried under reduced pressure, and has good film thickness uniformity and mechanical properties when formed into a film.

tan =G/G(I)

(wherein G represents the storage elastic modulus of the resin composition, and G represents the loss elastic modulus of the resin composition.)