C08G73/1082

RESIN COMPOSITION, RESIN FILM, LAMINATE, MULTILAYER PRINTED WIRING BOARD AND METHOD FOR PRODUCING MULTILAYER PRINTED WIRING BOARD

The present invention relates to a resin composition comprising a maleimide compound having a saturated or unsaturated divalent hydrocarbon group and a divalent group having at least two imido bonds; and a catalyst comprising at least one selected from the group consisting of an imidazole compound, a phosphorus compound, an azo compound and an organic peroxide.

Liquid crystal display device

The subject is to show a liquid crystal display device that has characteristics such as a short response time, a large voltage holding ratio, a low threshold voltage, a large contrast ratio, a long service life and a small flicker rate. The disclosure relates to a liquid crystal display device including an electrode group formed on one or both of a pair of substrates that are opposed to each other, and a plurality of active devices connected to the electrode group, and a liquid crystal alignment film formed on the opposing surfaces of the pair of substrates, and a liquid crystal composition sandwiched in between the pair of substrates, and the liquid crystal composition includes at least one compound selected from the group of compounds represented by formula (1) as a first component. ##STR00001##

Piezoelectric element having polymer coating, piezoelectric actuator using said piezoelectric element, and head suspension using said piezoelectric actuator
10431245 · 2019-10-01 · ·

A piezoelectric element easily and surely forms polymer coatings on peripheral end faces of the piezoelectric element without deteriorating a yield of the piezoelectric element. The piezoelectric element is manufactured by a method including steps of cutting a piezoelectric element out from a base piezoelectric material plate so that peripheral end faces are formed to define a peripheral shape of the piezoelectric element, and forming polymer coatings on at least objective areas of the peripheral end faces of the piezoelectric element by vapor deposition polymerization.

Substrate for display, color filter using the same and method for the production thereof, organic EL element and method for the production thereof, and flexible organic EL display

The present invention is a substrate for a display, the substrate having a film B including a polysiloxane resin on at least one surface of a film A including a polyimide resin, wherein the film B contains inorganic oxide particles therein, and the present invention has an object to provide a substrate for a display: being able to be applied to a color filter, an organic EL element, or the like without the need to carry out any complex operations; allowing high-definition displays to be manufactured; and being provided with a low CTE, a low birefringence, and flexibility.

PURIFICATION OF OXYDIPHTHALIC ANHYDRIDES

A process for the purification of an oxydiphthalic anhydride includes contacting a mixture of an oxydiphthalic anhydride and at least one of the corresponding oxydiphthalic diacid, a corresponding oxydiphthalic tetraacid, a halophthalic anhydride, and a catalyst with a solvent to provide a slurry. The solvent is capable of solubilizing the corresponding oxydiphthalic diacid, the corresponding oxydiphthalic tetraacid, the halophthalic anhydride, and the catalyst at a temperature of 15 to 50 C., and the oxydiphthalic anhydride is substantially insoluble in the solvent at this temperature. The oxydiphthalic anhydride can be isolated from the slurry. A purified oxydiphthalic anhydride and a polyetherimide prepared therefrom are also disclosed.

LAMINATE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

Provided is a laminate that can be implemented with a wide processing margin and without adhesive residue or damage to a semiconductor element in the transfer of the semiconductor element using laser light of various wavelengths. The laminate is obtained by laminating a substrate 1 having laser permeability, a resin film 1 and a resin film 2 in this order, wherein the light absorbance of the resin film 1 calculated for a film thickness of 1.0 ?m at any wavelength of 200 nm to 1100 nm is 0.4-5.0, and the adhesive strength of the surface of the resin film 2 on the side opposite that of the resin film 1 side is 0.02-0.3 N/cm.

Copolyesterimides derived from N,N′-bis-(hydroxyalkyl)-benzophenone-3,3′,4,4′-tetracarboxylic diimide and films made therefrom

A copolyester includes repeating units derived from an aliphatic glycol, terephthalic acid, and the monomer of formula (I): ##STR00001##
wherein n=2, 3 or 4; Z is CO; comonomer (I) constitutes a proportion of the glycol fraction of the copolyester and is present in a range of from about 5 to about 15 mol % of the glycol fraction of the copolyester; wherein said copolyester is semi-crystalline. A process tor making the copolyester includes annealing a copolyester of formula (I) at 20-80 C. below the crystalline melting point (Tm) and above the glass transition temperature (Tg).

COVER FILM AND APPLICATION THEREOF
20190244927 · 2019-08-08 ·

A cover film includes a release layer and a polyimide layer disposed on the release layer. The polyimide layer includes an inner surface and an outer surface opposite to the inner surface. The outer surface is exposed to the atmosphere, and the polyimide layer is formed from a reaction of a polyimide composition made of diamine monomer and tetracarboxylic dianhydride monomer. The polyimide layer further includes a cross-linker and an initiator. The diamine monomer is an aliphatic diamine monomer with a number of carbon greater than or equal to 36. A lowest viscosity of the polyimide layer is less than 20000 Pa.Math.s when polyimide layer is under a temperature in a range of 60 C. to 160 C.

POLYMER COMPOSITION, MOLDED PART AND PROCESSES FOR PRODUCTION THEREOF
20190225760 · 2019-07-25 ·

The present invention relates to a polymer composition, consisting of (A) 30-90 wt. % of at least one thermoplastic polymer comprising at least a semi-crystalline semi-aromatic polyamide (SSPA-1) in an amount in the range of 30-90 wt. %; (B) 10-70 wt. % of at least one reinforcing agent, and (C) 0-25 wt. % of one or more other components; wherein the SSPA-1 consists of (A-1-a) 90-100 wt. % of repeat units derived from (i) an aromatic dicarboxylic acid and (ii) diamines, and (A-1-b) 0-10 wt. % of repeat units derived from other monomers; the diamines (ii) consist of 80-95 mole % of a linear aliphatic diamine, 5-20 mole % of 2-methyl-pentamethylene diamine, and 0-10 mole % of other diamines; and the SSPA-1 has a melting temperature (Tm) of at least 300 C. The invention further relates to a molded part made of the composition, a process for making the composition and a process for making the molded part.

Block polyimide, block polyamide acid imide and use thereof

Provided are a block polyamide acid imide having an appropriate solubility in aqueous alkaline solutions, and block polyimides that are obtained using same and have high transparency and a low coefficient of linear thermal expansion (low CTE). The block polyimide comprises blocks configured from repeating structural units represented by defined formula (1A) and blocks configured from repeating structural units represented by defined formula (1B).