A flame-retardant polyimide molding material containing a semi-aromatic polyimide resin (A) and further containing 15 to 80 mass % of either of the following component (B1) or component (B2): (B1) graphite (B2) a combination of two or more selected from the group consisting of graphite, a fluorine resin, and carbon fiber; and a molded article including the same.

A resin film according to one aspect of the present invention contains polyimide, and satisfies the condition “the electric charge change in film after irradiation with a light having a wavelength of 470 nm and an intensity of 4.0 μW/cm.sup.2 for 30 minutes relative to before irradiation with the light is 1.0×10.sup.16 cm.sup.−3 or less.” Such a resin film can be used as a substrate for a semiconductor element to form an electronic device including the resin film, and a semiconductor element formed on the resin film.

A film for a metal layer laminate board and a metal layer laminate board have excellent stiffness, while capable of suppressing fluctuation of a dielectric constant before and after pressing. The film for a metal layer laminate board includes a porous resin layer having a tensile elastic modulus at 25° C. of 800 MPa or more and 2000 MPa or less.

A porous polyimide film is provided to suppress an increase in a dielectric loss tangent even when immersed in water. In the porous polyimide film, a difference between a dielectric loss tangent T1 after being left to stand for 24 hours under an atmosphere of 25° C. and relative humidity of 50% and a dielectric loss tangent T2 after immersion in water for 24 hours under an atmosphere of 25° C. is 0.0030 or less.

A polyimide resin composition containing a polyimide resin (A) and a polyetherimide sulfone resin (B), wherein the polyimide resin (A) contains a repeating structural unit represented by the following formula (1) and a repeating structural unit represented by the following formula (2), and a content ratio of the repeating structural unit of the formula (1) with respect to the total of the repeating structural unit of the formula (1) and the repeating structural unit of the formula (2) is 20 to 70 mol %; and a molded article containing the same.

##STR00001##

(R.sub.1 represents a divalent group having from 6 to 22 carbon atoms containing at least one alicyclic hydrocarbon structure; R.sub.2 represents a divalent chain aliphatic group having from 5 to 16 carbon atoms; and X.sub.1 and X.sub.2 each independently represent a tetravalent group having from 6 to 22 carbon atoms containing at least one aromatic ring.)

The present application provides a flexible substrate and a method of manufacturing the same. The flexible substrate includes a base substrate, the flexible substrate is a polyimide film, wherein the polyimide film comprises polyimide having a structural formula of ##STR00001##
and the polyimide has a rigid segment and a flexible segment. The polyimide film is divided into rigid regions and a flexible region, wherein the rigid region is mainly constituted by the rigid segment, and the flexible region is mainly constituted by the flexible segment. Because the polyimide has the rigid segment and the flexible segment, it is used in flexible substrates.

Curable polyimides and compositions thereof with very good dielectric properties are provided. Prepregs of these compositions laminated with copper foil to prepare copper clad laminates having Tg>150 C and Df<0.0025 are also provided.

In a first aspect, a polyimide corn position has a glass transition temperature of less than 300° C. and includes a polyimide derived from a dianhydride, a fluorinated aromatic diamine and an aliphatic diamine. A polyimide film made from the polyimide composition has a b* of less than one for a film thickness of at least 30 microns.

A dual-cure method for forming a solid polymeric structure is provided. An end-capped, imide-terminated prepolymer is combined with at least one photopolymerisable olefinic monomer, at least one photoinitiator, and a diamine, to form a curable resin composition, which, in a first step, is irradiated under conditions effective to polymerize the at least one olefinic monomer, thus forming a scaffold composed of the prepolymer and the polyolefin with the diamine trapped therein. The irradiated composition is then thermally treated at a temperature effective to cause a transimidization reaction to occur between the prepolymer and the diamine, thereby releasing the end caps of the prepolymer and providing the solid polymeric structure. A curable resin composition comprising an end-capped, imide-terminated prepolymer, at least one photopolymerisable olefinic monomer, at least one photoinitiator, and a diamine, is also provided, as are related methods of use.

A polymer of intrinsic microporosity having a repeating subunit including both a spirobisindane imide moiety and an amido (lactam) moiety.

##STR00001##