Provided are a heat-curable maleimide resin composition capable of yielding a cured product with a high glass-transition temperature, excellent dielectric properties and a superior adhesiveness to a metal foil, and being evenly cured with no curing unevenness at the time of curing due to its favorable compatibility with other resins; and an adhesive agent, substrate material, primer, coating material and semiconductor device containing such composition. This heat-curable maleimide resin composition contains (A) a maleimide compound and (B) a reaction promoter.

Phenolic-terminated and phenolic pendent curable polyimides with very good dielectric properties have been prepared. These materials in combination with epoxy resins and other co-curable resins are ideal for being transformed into flexible films that are ready to be laminated for example between copper foils for applications such as copper-clad laminates for a variety of electronics applications.

The present invention provides a laminate with good adhesion, which includes a transparent substrate, an adhesive layer formed by an adhesive composition, and a metal layer. The adhesive composition contains a resin, an adhesion promoter selected from a triazole compound represented by formula (1), a thiadiazole compound represented by formula (2), a benzotriazole compound represented by formula (3) or a phosphate oligomer; and an antioxidant, in which R.sup.1˜R.sup.5 are as defined herein.

##STR00001##

A dual-cure method for forming a solid polymeric structure is provided. An end-capped, imide-terminated prepolymer is combined with at least one photopolymerizable olefinic monomer, at least one photoinitiator, and a diamine, to form a curable resin composition, which, in a first step, is irradiated under conditions effective to polymerize the at least one olefinic monomer, thus forming a scaffold composed of the prepolymer and the polyolefin with the diamine trapped therein. The irradiated composition is then thermally treated at a temperature effective to cause a transimidization reaction to occur between the prepolymer and the diamine, thereby releasing the end caps of the prepolymer and providing the solid polymeric structure. A curable resin composition comprising an end-capped, imide-terminated prepolymer, at least one photopolymerizable olefinic monomer, at least one photoinitiator, and a diamine, is also provided, as are related methods of use.

In a first aspect, a polyimide film includes a dianhydride, a fluorinated aromatic diamine and an aliphatic diamine. The polyimide film has a b* of less than one for a film thickness of at least 30 microns and a glass transition temperature of less than 300° C. In a second aspect, an electronic device includes the polyimide film of the first aspect.

The present specification relates to a polyimide resin, a positive-type photosensitive resin composition, an insulating film and a semiconductor device.

The present invention aims to provide an adhesive composition that is easily separable by irradiation with light even after high-temperature processing at 300° C. or higher with an adherend fixed thereon, an adhesive tape including an adhesive layer formed of the adhesive composition, and a method for processing an electronic component. The present invention is an adhesive composition including: a reactive resin having an imide backbone and containing a double bond-containing functional group in a side chain or at an end; and a silicone compound or a fluorine compound.

A polyimide-based binder for power storage device having a repeated breaking energy retention ratio of 70% or more. The use of the binder enables improvement of a power storage device having a high capacity.

The present invention relates to an optical film comprising a polyimide-based resin having a constitutional unit derived from an aliphatic diamine, wherein the optical film has a glass transition temperature of 165° C. or higher and an optical transmittance at 350 nm of 10% or less.

The present invention relates to a resin composition comprising a maleimide compound having a saturated or unsaturated divalent hydrocarbon group and a divalent group having at least two imido bonds; and a catalyst comprising at least one selected from the group consisting of an imidazole compound, a phosphorus compound, an azo compound and an organic peroxide.