A preparation method of an oligomer additive including the following steps is provided. A compound (A) having a secondary amine and a basic compound (B) are reacted. Next, a product of the reaction and a compound (C) having an unsaturated carbon-carbon double bond are reacted in a solvent. When the oligomer additive prepared by the method is applied in the cathode of a lithium battery, the cathode electrode core structure can be effectively protected from an environment condition such as high temperature, droppage, or deformation by external force. Moreover, the lithium battery cycle life can be maintained.

Provided is photosensitive resin composition that has low dielectric characteristics, low water vapor permeability, and good chemical resistance and can form a cured relief pattern at high resolution. This photosensitive resin composition includes 100 parts by mass of a polyimide precursor resin, 0.5-10 parts by mass of a photopolymerization initiator, and 50-500 parts by mass of a solvent. The polyimide precursor resin includes at least one terminal structure selected from the group consisting of general formulas (1)-(3). The total value for the aliphatic hydrocarbon group concentration T of the polyimide precursor resin is 4-35 wt %.

To provide a maleimide resin composition which is curable by a curing process equivalent to that of an epoxy resin and can achieve moldability (curability) at 200 C. or less, heat resistance of 250 C. or more, retention of high thermal stability and high elastic modulus at 250 C., and low dielectric constant/low dielectric loss tangent. A maleimide resin composition including a maleimide compound (A) and a sulfonyl compound (B) containing, in the molecule, a structure represented by the following formula (1):

##STR00001##

(wherein each of the plurality of R's independently represents an alkenyl group, an alkenyl ether group, a hydrogen tom, a halogen atom, an alkyl group having a carbon number of 1 to 10, a fluoroalkyl group having a carbon number of 1 to 4, a hydroxyl group, an allyloxy group, an amino group, a cyano group, a nitro group, an acyl group, an acyloxy group, a carboxyl group, a tertiary carbon structure-containing group, a cyclic alkyl group, or a glycidyl group; at least one R is an alkenyl group or an alkenyl ether group; and a represents an integer of 1 to 4).

Provided is a resin composition that has a low viscosity before curing, and is capable of being turned into a cured product having superior dielectric properties (low relative permittivity and low dielectric tangent), a low elastic modulus and also an excellent heat resistance. The resin composition is a heat-curable citraconimide resin composition containing: (A) a citraconimide compound having a saturated or unsaturated divalent hydrocarbon group(s) having 6 to 100 carbon atoms; (B) an epoxy resin having at least two epoxy groups in one molecule; and (C) a reaction promoter,
wherein a mass ratio between the components (A) and (B) is (A):(B)=99:1 to 1:99.

Highly reliable interconnections for microelectronic packaging. In one embodiment, dielectric layers in a build-up interconnect have a gradation in glass transition temperature; and the later applied dielectric layers are laminated at temperatures lower than the glass transition temperatures of the earlier applied dielectric layers. In one embodiment, the glass transition temperatures of earlier applied dielectric films in a build-up interconnect are increased through a thermosetting process to exceed the temperature for laminating the later applied dielectric films. In one embodiment, a polyimide material is formed with embedded catalysts to promote cross-linking after a film of the polyimide material is laminated (e.g., through photo-chemical or thermal degradation of the encapsulant of the catalysts). In one embodiment, the solder resist opening walls have a wettable layer generated through laser assisted seeding so that there is no gap between the solder resist opening walls and no underfill in the solder resist opening.

Aliphatic polyimides are synthesized by a 2:1 molar ratio reaction of an unsaturated monoanhydride or an unsaturated diacid with a diamine. Bio-derived monomers are particularly useful in the synthesis of the aliphatic polyimides.

Provided is a multilayered transmission line plate including one pair of ground layers, a differential wiring layer disposed between one ground layer and the other ground layer of the one pair of ground layers, a first insulating portion disposed between the differential wiring layer and the one ground layer, and a second insulating portion disposed between the differential wiring layer and the other ground layer, wherein the first insulating portion has a resin layer, the first insulating portion or the second insulating portion has a fiber base material layer including a fiber base material, and a thickness of the first insulating portion is equal to or thinner than a thickness of the second insulating portion.

A polymer of a polyimide precursor which includes a structural unit represented by the following general formula (7),

##STR00001##

where X.sub.1 represents a tetravalent organic group, X.sub.2 represents a divalent organic group, and R.sub.1 represents a group represented by the following general formula (2),

##STR00002##

where the dotted line represents a bonding, Y.sub.1 represents an organic group with a valency of k+1, Rs represents a group containing at least one silicon atom, k represents 1, 2 or 3, and n represents 0 or 1.

Amine-substituted copolymers that may include an amine-substituted pyrrolidine-2,5-dione moiety. Polyamic acids and polyimides, which may be formed by contacting an amine substituted copolymer with a dianhydride, or a dianhydride and a diamine. Articles, such as wires, having a surface on which a polyimide is disposed. Methods for forming polymers.

The present invention provides a tetracarboxylic acid diester compound represented by the following general formula (1),

##STR00001## wherein, X.sub.1 represents a tetravalent organic group, and R.sub.1 represents a group represented by the following general formula (2),

##STR00002## wherein, the dotted line represents a bonding, Y.sub.1 represents an organic group with a valency of k+1, Rs represents a group containing at least one silicon atom, k represents 1, 2 or 3, and n represents 0 or 1. There can be provided a tetracarboxylic acid diester compound which can lead a polymer of a polyimide precursor capable of using a base resin of a negative photosensitive resin composition which is capable of forming a fine pattern and giving high resolution, a polymer of a polyimide precursor obtained by using the tetracarboxylic acid diester compound and a method for producing the same.