A resin composition of the present invention contains: a maleimide compound (A) having a maleimide functional group equivalent of 300 g/eq. or more, and a transmittance of 1% or more at a wavelength of 405 nm (h-line); a maleimide compound (B) having a maleimide functional group equivalent of less than 300 g/eq.; and a photo initiator (C) having an absorbance of 0.1 or more at a wavelength of 405 nm (h-line).

An object of the present invention is to provide: a compound containing an imide group which is not only cured under film formation conditions of inert gas as well as air and has excellent heat resistance and properties of filling and planarizing a pattern formed on a substrate, but can also form an organic underlayer film with favorable adhesion to a substrate, and a material for forming an organic film containing the compound. A material for forming an organic film, including: (A) a compound for forming an organic film shown by the following general formula (1A); and (B) an organic solvent,

##STR00001## noting that in the general formula (1B), when W.sub.1 represents

##STR00002##

R.sub.1 does not represent any of

##STR00003##

Embodiments in accordance with the present invention encompass photosensitive compositions containing a variety of soluble polyimide polymers and various additives including photoacid generator, photo radical generator and one or more photo crosslinking agents which are useful for forming films that can be patterned to create structures for microelectronic devices, microelectronic packaging, microelectromechanical systems, optoelectronic devices and displays. In some embodiments the compositions of this invention are shown to feature excellent hitherto unachievable mechanical properties. The negative images formed therefrom can be readily cured at lower temperatures than the conventional polyimides and exhibit improved thermo-mechanical properties, among other property enhancements.

A photosensitive resin composition which enables the achievement of a cured body that is further decreased in dielectric constant and dielectric loss tangent; a method for producing a cured relief pattern with use of this photosensitive resin composition; and a semiconductor device which is provided with this cured relief pattern. A negative photosensitive resin composition which contains 100 parts by mass of (A) a polyimide precursor that has a specific unit structure; and 0.1 to 20 parts by mass of (B) a radical photopolymerization initiator.

Aliphatic polyimides are synthesized by a reaction of 2 moles of an unsaturated monoanhydride or an unsaturated diacid with both one mole of a diamine and one mole of a monoamine. Imidization of intermediates so formed from those reactions resolve to 6 possible bicyclic imidic structures bridged by monoamidic or saturated hydrocarbon spans, more likely the latter. Bio-derived monomers are particularly useful in the synthesis of the aliphatic polyimides.

The disclosure provides a thermosetting polyimide resin and a manufacturing method thereof, a composition, a prepolymer, a film, an adhesive, and a use thereof. The composition includes at least: (a) a maleimide compound and (b) the thermosetting polyimide resin. The disclosure provides the thermosetting polyimide resin and the prepolymer, for manufacturing a film, an adhesive sheet, a cover film, a redistribution layer, a build-up board, a prepreg sheet, a high-frequency substrate, an integrated circuits carrier board, an adhesive for copper foil, a semiconductor packaging material, a radome, a substrate for server, a substrate for base station, a substrate for vehicle, etc.

The invention generally relates to shape memory films that are tri-functionally crosslinked and that comprise multiple, non-terminal, phenylethynyl moieties. In addition, the present invention relates methods of fabricating such films. Due to the improved properties of such SMPS, the SMP designer can program in to the SMP mechanical property enhancements that make the SMP suitable, among other things, for advanced sensors, high temperature actuators, responder matrix materials and heat responsive packaging.

The invention generally relates to shape memory films that are tri-functionally crosslinked and that comprise multiple, non-terminal, phenylethynyl moieties. In addition, the present invention relates methods of fabricating such films. Due to the improved properties of such SMPs, the SMP designer can program in to the SMP thermomechanical property enhancements that make the SMP suitable, among other things, for advanced sensors, high temperature actuators, responder matrix materials and heat responsive packaging.

The present invention relates to a resin composition comprising an (A) maleimide compound having a saturated or unsaturated divalent hydrocarbon group, and a thermoplastic resin.

Provided is a resin composition that has a low viscosity before curing, and is capable of being turned into a cured product having superior dielectric properties (low relative permittivity and low dielectric tangent), a low elastic modulus and also an excellent heat resistance. The resin composition is a heat-curable citraconimide resin composition containing: (A) a citraconimide compound having a saturated or unsaturated divalent hydrocarbon group(s) having 6 to 100 carbon atoms; (B) an epoxy resin having at least two epoxy groups in one molecule; and (C) a reaction promoter,
wherein a mass ratio between the components (A) and (B) is (A):(B)=99:1 to 1:99.