There is provided a curable compound having good solvent solubility and being capable of forming a cured material having super heat resistance. The curable compound according to the present invention is represented by the following formula (1). In the formula (1), R.sup.1 and R.sup.2 each represent a curable functional group; D.sup.1 and D.sup.2 each represent a single bond or a linking group; and L represents a divalent group having a repeating unit containing a structure represented by the following formula (I) and a structure represented by the following formula (II) (wherein Ar.sup.1 to Ar.sup.3 each represent a group made by eliminating two hydrogen atoms from a structural formula of an aromatic ring or a group made by eliminating two hydrogen atoms from a structural formula in which two or more aromatic rings are bound through a single bond or a linking group; X represents CO, S or SO.sub.2; each Y represents S, SO.sub.2, O, CO, COO or CONH; and n represents an integer of 0 or more):

##STR00001##

An object of the present invention is to provide a novel photosensitive resin precursor that can be developed with an alkali and ring-closed even at low temperatures, and preferably has excellent thermal properties and excellent electric properties after curing, and also to provide a use application thereof. As means for achieving the object, disclosed are a bismaleimide compound comprising, in one molecule, two partial structures in each of which a carbon atom having a substituent represented by the following formula (A) (wherein Y represents a direct bond or a divalent linking group), and a carbon atom having a hydroxy group are directly bonded to each other, a polymer which is a self-polymer of the bismaleimide compound, and a benzoxazole which is an intramolecular dehydrated ring-closed product of the polymer. ##STR00001##

A thermosetting resin composition containing: (A) an addition reaction product of a maleimide compound having at least two N-substituted maleimide groups in one molecule (a1) and an amine compound having at least two primary amino groups in one molecule (a2), (B) a thermoplastic elastomer, and (C) a copolymer resin having a structural unit derived from an aromatic vinyl compound and a structural unit derived from a carboxylic acid anhydride.

Aliphatic polyimides are synthesized by a 2:1 molar ratio reaction of an unsaturated monoanhydride or an unsaturated diacid with a diamine. Bio-derived monomers are particularly useful in the synthesis of the aliphatic polyimides.

Disclosed herein is a hydrogel that eradicates biofilm bacteria from wounds and accelerates diabetic wound healing. Also disclosed herein are methods of manufacture and use of said hydrogel.

The present invention aims to provide a curable resin composition capable of forming a film which, even when made thick, is less likely to crack at high temperature under a nitrogen atmosphere, a cured film formed using the curable resin composition, a stack including the cured film, an imaging device including the stack, an semiconductor device including the stack, a method for producing the stack, and a method for producing an element including a bonding electrode for use in production of the stack. Provided is a curable resin composition containing: a polyimide; and a silsesquioxane, the polyimide being contained in an amount of 0.5 parts by weight or more and 50 parts by weight or less relative to 100 parts by weight of the silsesquioxane.

The present invention aims to provide a curable resin composition that can planarize bonding surfaces and connect elements without leaving surface voids even when the elements have irregularities on the surface, thus imparting high bonding reliability between the elements, a cured film formed using the curable resin composition, a stack including the cured film, an imaging device including the stack, an semiconductor device including the stack, a method for producing the stack, and a method for producing an element including a bonding electrode for use in production of the stack. Provided is a curable resin composition containing: an organosilicon compound; and a solvent, the curable resin composition having a viscosity at 25 C. of 2,000 cP or less, the solvent being contained in an amount of 50% by weight or less in the curable resin composition, the curable resin composition having an adhesion of a score of 0 to 2 as measured by a cross-cut method in conformity with JIS K5600-5-6 using a measurement sample obtained by spin-coating a silicon wafer with the composition, evaporating the solvent, and then heat curing at 300 C. for one hour to form a film.

Disclosed is a polyimide precursor composition for the production of a flexible board of a photoelectronic device. The polyimide precursor composition includes a polyimide precursor derived from a diamine or acid dianhydride including a structure of Formula 1:

##STR00001##

wherein R.sub.1 to R.sub.8, m1, m2, and m3 are as defined in the specification. Also disclosed is a polyimide film produced from the polyimide precursor composition. The polyimide film is obtained by applying the precursor composition to a substrate and curing the composition. The polyimide film has high transparency and good heat resistance. In addition, the polyimide film exhibits good dimensional stability because the substrate does not undergo an increase in stress even during high-temperature heat treatment.

Aliphatic polyimides are synthesized by a 2:1 molar ratio reaction of an unsaturated monoanhydride or an unsaturated diacid with a diamine. Bio-derived monomers are particularly useful in the synthesis of the aliphatic polyimides.

Aliphatic polyimides are synthesized by a reaction of 2 moles of an unsaturated monoanhydride or an unsaturated diacid with both one mole of a diamine and one mole of a monoamine. Imidization of intermediates so formed from those reactions resolve to 6 possible bicyclic imidic structures bridged by monoamidic or saturated hydrocarbon spans, more likely the latter. Bio-derived monomers are particularly useful in the synthesis of the aliphatic polyimides.