The present invention provides a siloxane compound having a novel structure, the compound not being reactive with a polyamic acid which is a polyimide precursor. In addition, provided is a polyimide precursor composition having improved storage stability by adding the siloxane compound as an enhancer for adhesion between a polyimide and a substrate made of an inorganic material. According to the present invention, provided is a multifunctional polyimide film having improved adhesiveness with a substrate made of an inorganic material while having improved optically isotropic characteristics and reduced residual stress characteristics with respect to a substrate.

To provide a negative photosensitive resin composition which exhibits satisfactory resolution even when shifts occur in focus depth, and which has satisfactory adhesion to a mold resin and exhibits a low dielectric constant; a method for producing a polyimide using the photosensitive resin composition; a method for producing a cured relief pattern; and a semiconductor device including the cured relief pattern.

Disclosed is a negative photosensitive resin composition including a polyimide precursor having a structure represented by general formula (A1), (B) a photopolymerization initiator, and (C) a solvent.

##STR00001##

A resin composition includes 60 parts by weight of a maleimide resin; 10 parts by weight to 30 parts by weight of an epoxy resin of Formula (I), wherein n represents an integer of 0 to 10: and 2 parts by weight to 40 parts by weight of a methylenebis (diethylaniline). Moreover, an article may be made from the resin composition, including a prepreg, a resin film, a laminate or a printed circuit board. ##STR00001##

Provided is a thermosetting resin composition which exhibits low water absorption and excellent reflow resistance properties without compromising heat resistance or moldability. This thermosetting resin composition contains a polyalkenylphenol compound (A), a polymaleimide compound (B), a liquid polybutadiene compound (C) and a radical initiator (D). The liquid polybutadiene compound (C) has structural units represented by formula (1)-1 and, optionally, structural units represented by formula (l)-2 and, optionally, structural units other than the structural units represented by formula (1)-1 and formula (1)-2. If the average number of structural units represented by formula (1)-1 per molecule is denoted by m, the average number of structural units represented by formula (1)-2 per molecule is denoted by n and the average number of structural units other than the structural units represented by formula (1)-1 and formula (1)-2 is denoted by w, the value of m/(m+n+w) is 0.15-1.

##STR00001##

A resin composition includes 80 parts by weight to 160 parts by weight of a vinyl-containing resin, 0.1 part by weight to 1.0 part by weight of a first compound and 0.1 part by weight to 2.0 parts by weight of a second compound; wherein the vinyl-containing resin includes a vinyl-containing polyphenylene ether resin, a maleimide resin, a bis(vinylphenyl)ethane, a triallyl isocyanurate, a vinyl-containing polyolefin resin or a combination thereof, the first compound includes a structure of Formula (1) to Formula (3) or a combination thereof, and the second compound includes a structure of Formula (4) to Formula (6) or a combination thereof. Moreover, an article may be made from the resin composition, including a prepreg, a resin film, a laminate or a printed circuit board.

Provided is a maleimide resin with superior solution stability. Also provided is a cured product with a superior dielectric characteristic that is obtained by curing a curable resin composition in which said maleimide resin is used. The maleimide resin expressed in formula (1). (In formula (1), each of the plurality of Rs independently represents a C1-5 alkyl group, n is the number of repetitions, and the average value thereof is 1<n<5.)

The present disclosure relates to a poly(amide-imide) copolymer in which at least one of an imide repeating unit and an amide repeating unit is substituted with a specific functional group, and a composition and a polymer film comprising the same.

A flexible electronic device containing a polyimide film exhibiting excellent C-V characteristics. The polyimide film is a film that shows a maximum gradient of 0.005N or more in a capacitance-voltage measurement of a laminate in which a polyimide film having a film thickness of 0.75 μm is formed on a silicon wafer having a resistance value of 4 Ωcm; the maximum gradient meaning a maximum value of an absolute value of a gradient in a normalized capacity-voltage curve during a third scan of forward direction scans; a capacity-voltage curve being measured by applying a direct current voltage is to the polyimide film with respect to the silicon wafer between a lowest voltage V1 and a highest voltage V2, and measuring capacitance while the direct current voltage is scanned in a forward direction and scanned in a negative direction; the normalized capacity-voltage curve is being normalized so that the capacity at the lowest voltage V1 is 1.

Provided is a maleimide resin with superior solution stability. Also provided is a cured product with a superior dielectric characteristic that is obtained by curing a curable resin composition in which said maleimide resin is used. The maleimide resin expressed in formula (1), wherein the N,N′-(phenylene-di-(2,2,-propylidene)-di-p-phenylene) bismaleimide content is 90 area % or less. (In formula (1), n is the number of repetitions, and 1<n<5.)

The present invention provides a siloxane compound having a novel structure, the compound not being reactive with a polyamic acid which is a polyimide precursor. In addition, provided is a polyimide precursor composition having improved storage stability by adding the siloxane compound as an enhancer for adhesion between a polyimide and a substrate made of an inorganic material. According to the present invention, provided is a multifunctional polyimide film having improved adhesiveness with a substrate made of an inorganic material while having improved optically isotropic characteristics and reduced residual stress characteristics with respect to a substrate.