The present disclosure provides a modified allyl compound, and a modified bismaleimide prepolymer. The modified allyl compound is represented by formula (1), has a cyclopentadiene structure represented by formula (2), and contains a benzene ring or a benzene ring substituted with a linear alkane of lower polarity.

The present invention relates to a resin composition containing a phosphate ester-based flame retardant (A) having an aromatic hydrocarbon group containing two or more aromatic ring structures and a polyphenylene ether derivative (B) having an ethylenically unsaturated bond-containing group at both ends.

The present invention provides a thermosetting resin composition characterized by comprising a bismaleimide compound and a triazine compound having a diaminotriazine structure.

A negative-type photosensitive resin composition that has a satisfactory imidization rate and can yield a resin layer with high chemical resistance, even under low-temperature curing conditions of 200° C. or below, the negative-type photosensitive resin composition containing a photopolymerization initiator (B) in a proportion of 0.1 part by mass to 2.0 parts by mass with respect to 100 parts by mass of a polyimide precursor (A), the polyimide precursor (A) being a polyamic acid ester or polyarnic acid salt with a specific structure, and the weight-average molecular weight (Mw) of the polyimide precursor (A) being 3,000 or greater and less than 16,000, in terms of polystyrene, according to gel permeation chromatography (GPC)

In order to provide an imide oligomer or the like which can give a cured product exhibiting excellent thermal oxidative stability, an imide oligomer is obtained by reacting together an aromatic tetracarboxylic acid component, an aromatic diamine component, and a terminal capping agent. The imide oligomer contains, in a specified proportion: a compound containing a phenylethynyl group; and a compound containing no carbon-carbon unsaturated bond capable of an addition reaction. One or each of the aromatic tetracarboxylic acid component and the aromatic diamine component contains a component having an asymmetrical and non-planar structure.

A polyimidc-based solution for inkjet printing includes an α,ω-Bismaleimide(BMI) terminated oligomer, wherein said α,ω-Bismaleimide terminated oligomer is delined by formula (I), wherein R represents an aliphatic, an aromatic or mixed aliphatic and aromatic groups. ##STR00001##

A negative-type photosensitive resin composition that has a satisfactory imidization rate and can yield a resin layer with high chemical resistance, even under low-temperature curing conditions of 200° C. or below, the negative-type photosensitive resin composition containing a photopolymerization initiator (B) in a proportion of 0.1 part by mass to 20 parts by mass with respect to 100 parts by mass of a polyimide precursor (A), the polyimide precursor (A) being a polyamic acid ester or polyamic acid salt with a specific structure, and the weight-average molecular weight (Mw) of the polyimide precursor (A) being 3,000 or greater and less than 16,000, in terms of polystyrene, according to gel permeation chromatography (GPC).

Bismaleimide (BMI) and cyanate ester (CE) thermosets were developed for use as high temperature encapsulants and adhesives. These materials must withstand prolonged exposures to large thermal gradients while maintaining good structural integrity, minimal mass losses and outgassing. Bismaleimide and cyanate ester thermosets exhibit superior thermal performance compared to most epoxies and can often tolerate long exposures to temperatures >200° C. without undergoing significant degradation. In addition to excellent stability at elevated temperatures, uncured resins can have good processing attributes, such as, low viscosities and long working times. In particular, specific combinations of BMI and CE resins can provide significantly better thermal performance than the current standard epoxy system in addition to having excellent processing capabilities.

A modified bismaleimide resin, a method for preparing the same, a prepreg, a copper clad laminate, and a printed circuit board are provided. The modified bismaleimide resin is formed by reacting a diamine having a specific structure with maleic anhydride, and has greater amounts of non-polar and hydrophobic groups in the molecular structure thereof.

A method for producing an aqueous polyimide precursor solution composition includes forming a polyamic acid by the reaction of a tetracarboxylic acid component and a diamine component in an aqueous solvent together with an imidazole in an amount of 1.6 mole or more per mole of the tetracarboxylic acid component of the polyamic acid.