A modified bismaleimide resin, a method for preparing the same, a prepreg, a copper clad laminate, and a printed circuit board are provided. The modified bismaleimide resin is formed by reacting a diamine having a specific structure with maleic anhydride, and has greater amounts of non-polar and hydrophobic groups in the molecular structure thereof.

Formulations usable in additive manufacturing, 3D inkjet printing in particular, of a three-dimensional object that contains a polyimide material, and additive manufacturing utilizing same are provided. The formulations contain a polyimide precursor (e.g., a bismaleimide) and an additional curable material, which is a multifunctional curable material, and are devoid of an organic solvent.

A method for operating in a borehole comprises disposing in a downhole environment an article comprising a bismaleimide composite which comprises a polybismaleimide and a disintegrating agent; exposing the article to an aqueous fluid at a temperature of about 25 C. to about 300 C.; and disintegrating the article.

A polyimide precursor solution includes a polyimide precursor having a weight average molecular weight within a range of 20000 to 80000, particles, and an aqueous solvent. The aqueous solvent contains an organic amine compound (A) (excluding a water-soluble organic solvent (B) described below), a water-soluble organic solvent (B) containing at least one selected from the group consisting of N-methyl-2-pyrrolidone, 1,3-dimethyl-2-imidazolidinone, N,N-dimethylformamide, and N,N-dimethylacetamide, and water (C). A content ratio [(A):(B):(C)] of (A), (B), and (C) is within a range of 0.02 to 0.07:0.02 to 0.05:0.88 to 0.96 in terms of mass ratio.

Provided are a photosensitive resin composition in which the progress of cyclization reaction is fast and storage stability over time is excellent, a heterocyclic ring-containing polymer precursor, a cured film, a laminate, a method for producing a cured film, and a semiconductor device, using the photosensitive resin composition. The photosensitive resin composition includes a heterocyclic ring-containing polymer precursor selected from a polyimide precursor and a polybenzoxazole precursor, and a solvent, in which a solid content of the photosensitive resin composition has an amine value of 0.0002 to 0.0200 mmol/g.

A method of additive manufacturing of a three-dimensional object, comprises: dispensing from a first array of nozzles a modeling material formulation containing a polyimide precursor to form a layer in a configured pattern corresponding to a shape of a slice of the object; applying to the layer ultraviolet radiation and infrared radiation from two different radiation sources; and repeating the dispensing and the application of radiation to form a plurality of layers in configured patterns corresponding to shapes of other slices of the object. Optionally, an additional modeling material formulation or a support material formulation is dispensed from a second array of nozzles.

A compound represented by the following formula (0).

##STR00001##

(In the above formula (0), R.sup.X represents a 2n.sup.A-valent group having 1 to 70 carbon atoms or a single bond; each R.sup.1A independently represents any of an alkyl group having 1 to 30 carbon atoms and optionally having a substituent, an aryl group having 6 to 30 carbon atoms and optionally having a substituent, a crosslinkable group having 2 to 30 carbon atoms and optionally having a substituent, an alkoxy group having 1 to 30 carbon atoms and optionally having a substituent, a maleamic acid group having 4 to 30 carbon atoms and optionally having a substituent, a maleimide group having 4 to 30 carbon atoms and optionally having a substituent, a halogen atom, a nitro group, an amino group having 0 to 30 carbon atoms and optionally having a substituent, a carboxyl group, a thiol group and a hydroxy group, wherein, when R.sup.1A is any of the alkyl group, the aryl group, the crosslinkable group and the alkoxy group, at least one bond selected from the group consisting of an ether bond, a ketone bond and an ester bond is optionally contained, and at least one R.sup.1A is any of a maleamic acid group having 4 to 30 carbon atoms and optionally having a substituent and a maleimide group having 4 to 30 carbon atoms and optionally having a substituent; X represents an oxygen atom or a sulfur atom, or is optionally not present; each R independently represents any of a benzene ring, a naphthalene ring and an anthracene ring; each m is independently an integer of 0 to 9, wherein at least one m is an integer of 1 to 9; and n.sup.A is an integer of 1 to 4.)

A polyimide precursor resin composition for forming a flexible device substrate, including a polyamic acid having a structure obtained from a tetracarboxylic acid component including at least one of 3,3,4,4-biphenyltetracarboxylic dianhydride and pyromellitic dianhydride, a diamine component including at least one of paraphenylene diamine and 4,4-diaminodiphenyl ether, and a carboxylic acid monoanhydride, the polyamic acid satisfying equations (1) and (2) below:

0.97X/Y<1.00Equation (1)

0.5(Z/2)/(YX)1.05Equation (2)

in which X represents a number of moles of tetracarboxylic acid component, Y represents a number of moles of diamine component, and Z represents a number of moles of the carboxylic acid monoanhydride.

A low-dielectric heat dissipation film composition contains: (A) a maleimide resin composition containing (A1) a maleimide resin containing at least two or more maleimide groups per molecule and (A2) a polymerization initiator; and (B) boron nitride particles. The component (A1) has a maleimide equivalent of not more than 0.1 mol/100 g, and a cured material of the component (A) has a relative dielectric constant of 3.5 or less at a frequency of 10 GHz. Thus, the present invention provides a film composition for forming a film having low dielectric constant and high heat dissipation.

Provided are a slurry composition having a low thixotropy and a superior handling property; a cured product of this slurry composition; and a substrate, film and prepreg using such cured product, the substrate, film and prepreg exhibiting excellent mechanical properties and a low relative permittivity and dielectric tangent. The slurry composition has a thixotropic ratio of not higher than 3.0, and comprises: (A) a cyclic imide compound having, per molecule, at least one dimer acid backbone, at least one linear alkylene group having not less than 6 carbon atoms, and at least two cyclic imide groups; (B) spherical silica fine particles and/or alumina fine particles having an average particle size of 0.05 to 20 m when measured by a laser diffraction method; (C) a silane coupling agent capable of reacting with the components (A) and (B); and (D) an organic solvent.