A method of additive manufacturing of a three-dimensional object, comprises: dispensing from a first array of nozzles a modeling material formulation containing a polyimide precursor to form a layer in a configured pattern corresponding to a shape of a slice of the object; applying to the layer ultraviolet radiation and infrared radiation from two different radiation sources; and repeating the dispensing and the application of radiation to form a plurality of layers in configured patterns corresponding to shapes of other slices of the object. Optionally, an additional modeling material formulation or a support material formulation is dispensed from a second array of nozzles.

The present disclosure provides a modified allyl compound, and a modified bismaleimide prepolymer. The modified allyl compound is represented by formula (1), has a cyclopentadiene structure represented by formula (2), and contains a benzene ring or a benzene ring substituted with a linear alkane of lower polarity.

Wet-strippable underlayer compositions comprising one or more silicon-containing polymers comprising a backbone comprising SiO linkages, one or more organic blend polymers, and a cure catalyst are provided. These compositions are useful in the manufacture of various electronic devices.

A gas separation membrane has a gas separation layer containing a poly(benzoxazole-imide) compound in which the poly(benzoxazole-imide) compound having structural units represented by General formulae (I) and (II), or structural units represented by General formulae (I), (II) and (III) satisfies a specific molar quantity condition.

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In the formulae, X and Y each represent a single bond or a specific divalent linking group; L represents a specific divalent linking group including a phenylene group; and R represents a specific group. A gas separation module and a gas separation method use the gas separation membrane. A gas separation apparatus includes the gas separation module.

A thermosetting resin composition has particular applications in three dimensional (3-D) printing. The thermosetting resin composition exhibits high performance and is characterized by a high temperature two stage cure resin composition. The thermosetting resin composition comprises cyanate esters and other high temperature resins, photo curable monomers, photo initiator, metal catalyst or ionic liquid catalyst. The thermosetting resin composition cures at room temperature to form 3-D objects and upon further post cure these objects exhibit high temperature properties enabling use at temperatures exceeding 150 C.

Disclosed herein is a degradable polyimide substrate that may be reliably used as an electronic substrate in flexible electronics. The degradable polyimide substrate is formed via thiol-ene click chemistry reactions between diallyl imide or other alkene monomers and thiol monomers, that can be activated by photoirradiation at relatively low temperatures (e.g., about 80 C.). As a result, the degradable polyimide substrates disclosed herein may be cured using a simple, energy efficient curing process that allows for streamlined manufacturing of circuits including multilayered circuits. In some instances, epoxy monomers may be added to the monomer resin used to form the polyimide substrate, wherein selective curing may yield polymer substrates with varying degrees of flexibility and rigidity.

A lithium ion battery includes an anode electrode, an electrolyte, a separator, and a cathode electrode. The cathode electrode includes a cathode active material, a conducting agent, and a cathode binder. The cathode binder includes a polymer obtained by polymerizing a maleimide type monomer with an organic diamine type compound.

A thermosetting resin composition has particular applications in three dimensional (3-D) printing. The thermosetting resin composition exhibits high performance and is characterized by a high temperature two stage cure resin composition. The thermosetting resin composition comprises cyanate esters and other high temperature resins, photo curable monomers, photo initiator, metal catalyst or ionic liquid catalyst. The thermosetting resin composition cures at room temperature to form 3-D objects and upon further post cure these objects exhibit high temperature properties enabling use at temperatures exceeding 150 C.

The present disclosure relates to a curable precursor of an adhesive composition, the curable precursor comprising a maleimide-terminated polyamide-imide polymer. The present disclosure further relates to an adhesive composition comprising a cured adhesive, wherein the cured adhesive is the reaction product of said curable precursor, and to a process for making said curable precursor of an adhesive composition, the process comprising reacting an amine-terminated polyamide with a bis-maleimide by a poly-Michael-Addition.

There is provided a resin composition containing a polyimide or a polyimide precursor, where a cured substance obtained from the resin composition satisfies all of the following conditions (i) to (iv), and are provided a cured substance, a laminate, a manufacturing method for a cured substance, a manufacturing method for a laminate, a manufacturing method for a semiconductor device, and a semiconductor device; condition (i): a Young's modulus of the cured substance is 3.5 GPa or more, condition (ii): a coefficient of thermal expansion of the cured substance in a temperature range of 25 C. to 125 C. is less than 50 ppm/ C., condition (iii): a Tg of the cured substance is 240 C. or higher, and condition (iv): a breaking elongation of the cured substance is 40% or more.