Provided are a self-welding high dielectric silicone rubber composition and a self-welding high dielectric tape. The self-welding high dielectric silicone rubber composition comprises: (A) 100 parts by mass of an organopolysiloxane represented by an average composition formula (1) and having, in a molecule, at least two alkenyl groups bonded to silicon atoms, R.sup.1.sub.nSiO.sub.(4-n)/2 (1), (in the formula, R.sup.1 represents the same or different, unsubstituted or substituted monovalent hydrocarbon group and n is a positive number of 1.95 to 2.04); (B) 10 to 100 parts by mass of hydrophobic fumed silica having a specific surface area obtained by the BET adsorption method of 50 m.sup.2/g or larger; (C) 100 to 300 parts by mass of a conductive complex oxide; (D) 0.1 to 50 parts by mass of a boric acid or a boric acid compound; (E) 1 to 10 parts by mass of a diorganopolysiloxane capped at both molecular terminals with alkoxy groups; and (F) 0.01 to 10 parts by mass of a curing agent comprising an acyl organic peroxide. The self-welding high dielectric silicone rubber composition can be hot-air vulcanized under normal pressure by extrusion molding or roll forming with calender rolls.

Provided are a self-welding high dielectric silicone rubber composition and a self-welding high dielectric tape. The self-welding high dielectric silicone rubber composition comprises: (A) 100 parts by mass of an organopolysiloxane represented by an average composition formula (1) and having, in a molecule, at least two alkenyl groups bonded to silicon atoms, R.sup.1.sub.nSiO.sub.(4-n)/2 (1), (in the formula, R.sup.1 represents the same or different, unsubstituted or substituted monovalent hydrocarbon group and n is a positive number of 1.95 to 2.04); (B) 10 to 100 parts by mass of hydrophobic fumed silica having a specific surface area obtained by the BET adsorption method of 50 m.sup.2/g or larger; (C) 100 to 300 parts by mass of a conductive complex oxide; (D) 0.1 to 50 parts by mass of a boric acid or a boric acid compound; (E) 1 to 10 parts by mass of a diorganopolysiloxane capped at both molecular terminals with alkoxy groups; and (F) 0.01 to 10 parts by mass of a curing agent comprising an acyl organic peroxide. The self-welding high dielectric silicone rubber composition can be hot-air vulcanized under normal pressure by extrusion molding or roll forming with calender rolls.

Hydrogel polymers for use, for example, in contact lenses, drug delivery systems and/or stimulating devices. In some embodiments, the hydrogel formulations comprise diluent(s) to improve the dehydration characteristics and mechanical properties of a hydrogel polymer formulation compared to those without diluent(s). The diluent(s) include, for example, water and hydrophilic diluent(s) such as humectants.

Hydrogel polymers for use, for example, in contact lenses, drug delivery systems and/or stimulating devices. In some embodiments, the hydrogel formulations comprise diluent(s) to improve the dehydration characteristics and mechanical properties of a hydrogel polymer formulation compared to those without diluent(s). The diluent(s) include, for example, water and hydrophilic diluent(s) such as humectants.

A method for preparing a silicon oxide powder filler is disclosed. The method may include providing a polysiloxane powder by dispersing a high-dielectric-constant powder in an aqueous solution and adding R.sub.1SiX.sub.3 to the aqueous solution for a hydrolysis condensation reaction, the polysiloxane powder being polysiloxane containing the high-dielectric-constant powder and comprising a T unit, and a particle size of the high-dielectric-constant powder being less than that of the polysiloxane. The method may further include calcining the polysiloxane powder in an oxygen-containing atmosphere, where the calcining temperature may be between 850 degrees and 1200 degrees, to obtain a silicon oxide powder filler containing the high-dielectric-constant powder inside.

A method for preparing a silicon oxide powder filler is disclosed. The method may include providing a polysiloxane powder by dispersing a high-dielectric-constant powder in an aqueous solution and adding R.sub.1SiX.sub.3 to the aqueous solution for a hydrolysis condensation reaction, the polysiloxane powder being polysiloxane containing the high-dielectric-constant powder and comprising a T unit, and a particle size of the high-dielectric-constant powder being less than that of the polysiloxane. The method may further include calcining the polysiloxane powder in an oxygen-containing atmosphere, where the calcining temperature may be between 850 degrees and 1200 degrees, to obtain a silicon oxide powder filler containing the high-dielectric-constant powder inside.

The present invention provides a barrier material formation composition comprising a silane oligomer, at least a part of the silane oligomer being modified with a metal alkoxide.

The present invention provides a barrier material formation composition comprising a silane oligomer, at least a part of the silane oligomer being modified with a metal alkoxide.

The present invention relates to a hydrosilylation-curable silicone composition comprising: a maleate compound, and a hydrosilylation inhibitor other than the maleate compound, wherein the content of the maleate compound is in an amount of 50 to 6,000 ppm and the content of the hydrosilylation inhibitor is in an amount of 200 to 20,000 ppm, with respect to the present composition in terms of mass units, respectively. The hydrosilylation-curable silicone composition exhibits good storage stability, and can be cured to form a cured product that suffers no surface wrinkling.

A hydrophobic, self-healing coating includes a vitrimer film having a silicone polymer network crosslinked with dynamic covalent bonds including a boronic ester, where the vitrimer film has a thickness of less than 1000 nm, and where the dynamic covalent bonds provide a mechanism for self-healing of the vitrimer film.