Elastic Parylene films produced via chemical vapor deposition polymerization (CVDP) on a substrate are disclosed.

A flexible implantable electrode arrangement includes an electrically insulating carrier structure of a first polymer material, an electrically conductive layer, and an electrically insulating cover layer of a second polymer material. The electrically conductive layer includes an electrically conductive carbon fiber layer. The electrically conductive layer integrally forms an implantable electrode, a conductor track connected to the implantable electrode, and a contact pad. The electrically insulating cover layer at least partially covers the electrically conductive layer.

If at least one terpene-phenol resin is used as tackifying resin for pressure-sensitive adhesives based on polar framework polymers, wherein the at least one terpene-phenol resin in gel permeation chromatography analysis shows a multimodal molar mass distribution wherein the low molecular weight peak has its maximum within a range above 260 g/mol, it is possible, even at elevated temperatures, to achieve elevated storage stability of the terpene-phenol resins, apparent from a distinct reduction in increases in softening points over time.

A method for reducing the level difference (iso-dense bias) (reverse bump) of a resist underlayer film formed on a semiconductor substrate having a stepped portion and a non-stepped portion by 5 nm or more, which comprises a step of applying the composition to an upper surface of the semiconductor substrate having a stepped portion and a non-stepped portion. A method for reducing the level difference (iso-dense bias) of a resist underlayer film, comprising the steps of adding a fluorine-containing surfactant to a resist underlayer film-forming composition containing a polymer and a solvent and applying the composition containing the fluorine-containing surfactant to an upper surface of a semiconductor substrate having a stepped portion and a non-stepped portion. The level difference of a resist underlayer film formed on a semiconductor substrate between a stepped portion and a non-stepped portion (i.e., reverse bump) is reduced by 5 nm or more.

A method for depositing Parylene onto a substrate includes operating a first pyrolysis chamber at a first set of parameters to cause cracking of dimers into monomers at the first set of parameters and operating a second pyrolysis chamber at a second set of parameters to cause cracking of dimers into monomers at the second set of parameters. The method includes mixing the monomers at the first set of parameters with monomers at the second set of parameters together and polymerizing the mixture as a protective coating.

Provided are an anion exchange resin being capable of producing an electrolyte membrane and the like, which have improved chemical properties (durability). For example, used is an anion exchange resin comprising a hydrophobic unit being composed of a plurality of divalent hydrophobic groups repeated via carbon-carbon bond, the divalent hydrophobic group having a plurality of aromatic rings which are connected to each other via a divalent fluorine-containing group; and a hydrophilic unit being composed of a plurality of hydrophilic groups repeated via carbon-carbon bond, the hydrophilic groups being composed of a plurality of aromatic rings which are connected to each other via a divalent hydrocarbon group and/or carbon-carbon bond, and the hydrophilic groups containing an anion exchange group-containing group including a quaternary ammonium salt having a piperidine ring, and wherein the hydrophobic unit and the hydrophilic unit are connected via carbon-carbon bond.

The present invention provides a selective bonding method of polymer substrates. The present invention allows selective interfacial bonding between a polymer substrate and a parylene layer by using a mask pattern and plasma treatment, and enables the formation of a three-dimensional structure by injecting a fluid into a non-bonded area.

Provided herein is a hot melt pressure sensitive adhesive comprising one or more styrene block copolymers, a tackifier, and polyisobutylene plasticizer, wherein the adhesive contains less than 1 wt % of a plasticizer oil. The adhesive can be used in a label construction along with a facestock such as a polyethylene facestock, wherein the swelling factor of the facestock is reduced as compared to the swelling factor of the facestock in labels that include a plasticizer oil. Also provided are methods for producing and using the hot melt adhesive, and articles labeled with the hot melt adhesive.

A resin composition according to the present invention contains a cyanate compound (A). Further, the resin composition according to the present invention contains a maleimide compound (B) and/or an epoxy resin (C); and primary hexagonal boron nitride particles (D) having an average aspect ratio of 4 to 10.

The present invention addresses the problem of providing a fluorine-containing aromatic polymer; a method for producing the fluorine-containing aromatic polymer; etc. The problem can be solved by: a polymer having a monomer unit represented by formula (1) (wherein R.sup.1 in each occurrence is independently a halogen atom, NR.sup.11R.sup.12 (wherein R.sup.11 and R.sup.12 are independently a hydrogen atom or an organic group), or an organic group; n1 is an integer of 0 to 4; two R.sup.1s that can be present in the ortho-positions may form a ring together with two carbon atoms on the adjacent benzene ring, wherein the formed ring may have an organic group as a substituent; and L.sup.1 is a single bond, an oxygen atom, a sulfur atom, -L.sup.11-O—, —O-L.sup.12-O—, -L.sup.13-S—, or —S-L.sup.14-S— (wherein L.sup.11 to L.sup.14 are each independently an alkylene group optionally having one or more substituents); etc.