Patent classifications
C08J2325/10
CUSHION AND SHOE
Provided is a cushion partially or entirely composed of a foam, wherein the foam is composed of: a hydrocarbon-based oil including ethylene and α-olefin as constituent units; and a polymer composition including one or a plurality of polymers.
RECYCLED RUBBER
Recycled rubber is provided, which is formed by depolymerizing 100 parts by weight of rubber and 0.5 to 10 parts by weight of modifier, wherein the modifier is formed by reacting (a) R.sup.1-M, (b) double bond monomer, (c) ethylene sulfide, and (d) polymerization terminator, wherein R.sup.1 is C.sub.4-C.sub.16 alkyl group, M is Li, Na, K, Ba, or Mg and (b) double bond monomer is 1,3-butadiene, isoprene, 1,3-pentadiene, 2,3-dimethyl-1,3-butadiene, 2-methyl-1,3-pentadiene, 2,3-dimethyl-1,3-pentadiene, 2-phenyl-1,3-butadiene, 4,5-diethyl-1,3-octadiene, styrene, 1-ethylene naphthalene, 3-methylstyrene, 3,5-diethylstyrene, 4-propylstyrene, 2,4,6-trimethylstyrene, 4-dodecylstyrene, 3-methyl-5-n-hexylstyrene, 4-phenylstyrene, 2-ethyl-4-benzylstyrene, 3,5-diphenylstyrene, 2,3,4,5-tetraethyl styrene, 3-ethyl-1-vinylnaphthalene, 6-isopropyl-1-vinylnaphthalene, 6-cyclohexyl-1-vinylnaphthalene, 7-dodecyl-2-vinylnaphthalene, α-methyl styrene, or a combination thereof.
Silane-functionalized hydrocarbon polymer modifiers for elastomeric compositions
An elastomeric composition and method incorporating a hydrocarbon polymer modifier with improved permanence. The composition comprises elastomer, filler and silane-functionalized hydrocarbon polymer modifier (Si-HPM) made in a pre-reaction adapted to couple the Si-HPM to the elastomer, filler or both, wherein the Si-HPM comprises an interpolymer of monomers chosen from piperylenes, cyclic pentadienes, aromatics, limonenes, pinenes, amylenes, and combinations thereof.
Thermally conductive polymer resin composition based on styrenics with low density
Thermally conductive polymer (TCP) resin compositions are described, comprising components (X) and (Y): 90 to 99.9% component (X) comprising components (I) and (II): 60 to 85% matrix polymer (I) comprising styrenic polymers (F) selected from: ABS resins, ASA resins, and elastomeric block copolymers of the structure (S(B/S)).sub.nS; 15 to 40% thermally conductive filler material (II) (D.sub.50 1 to 200 ), consisting of a ceramic material and/or graphite; 0.1 to 10% chemical foaming agent (Y). Shaped articles made thereof can be used for automotive applications, as a heat sink for high performance electronics, LED sockets or electrical and electronic housings.
Process for modifying polymer particles of an aqueous polymer dispersion, an aqueous polymer dispersion obtainable by said process, a redispersible polymer powder, and a composition comprising the redispersible polymer powder
The invention relates to a process for modifying polymer particles of an aqueous polymer dispersion in which positively or negatively charged polymer particles are provided with an inorganic salt shell. The inorganic shell leads to an improved drying ability and storage stability of the latex and improves the storage stability of the resulting polymer powder. The obtained polymer powder exhibits an improved viscosity and faster skin-forming time in the final application and is therefore particularly useful in a building material composition.
THERMOSETTING RESIN COMPOSITION, AND PREPREG AND METAL FOIL CLAD LAMINATE MADE THEREFROM
Thermosetting resin composition, prepreg and metal foil clad laminate made therefrom. The thermosetting resin composition comprises (A): a solvent-soluble multifunctional vinyl aromatic copolymer, wherein same is a multifunctional vinyl aromatic copolymer having structural units from monomers comprising a divinyl aromatic compound (a) and ethyl vinyl aromatic compound (b); and (B), wherein same is selected from olefin resins having a number-average molecular weight of 500-10,000 and containing 10%-50% by weight of a styrene structure, and the molecules thereof contain a 1,2-addition butadiene structure. The prepreg and copper foil clad laminate made from the thermosetting resin composition of the present invention have a good toughness, and maintain a high glass transition temperature, a low water absorption, excellent dielectric properties and damp heat resistance thereof, and are suitable for use in the field of high frequency and high speed printed circuit boards, and are also suitable for processing multilayer printed circuit boards.
Resin Composition, Prepreg, Metal Foil-Clad Laminate, Resin Sheet, and Printed Wiring Board
A resin composition contains a maleimide compound (A), a cyanate ester compound (B), a polyphenylene ether compound (C) with a number average molecular weight of not lower than 1000 and not higher than 7000 and represented by Formula (1), and a block copolymer (D) having a styrene backbone. In Formula (1), X represents an aryl group; (YO)n.sub.2- represents a polyphenylene ether moiety; R.sub.1, R.sub.2, and R.sub.3 each independently represent a hydrogen atom, an alkyl group, an alkenyl group, or an alkynyl group; n.sub.2 represents an integer of from 1 to 100; n.sub.1 represents an integer of from 1 to 6; and n.sub.3 represents an integer of from 1 to 4.
##STR00001##
MOLDING COMPOSITION AND ARTICLES FORMED THEREOF
Articles having improved properties are disclosed. The articles are formed from a composition obtained by dry blending: a) 70-95 wt. % of a polyolefin polymer selected from polypropylene homopolymers, polypropylene copolymers, polypropylene impact copolymers, and mixtures thereof; and b) 5 to 30 wt. % of a free-flowing styrenic block copolymer coated with a functional dusting agent having a maximum particle size of 100 microns. The free-flowing styrenic block copolymer requires less than 400 lbs/ft.sup.2 of force to break in a blocking test. The molded article has improved impact strength and haze.
Resin composition and pre-preg and laminate using the composition
Copper clad laminates and a resin composition and a pre-preg and a laminate using the composition. The resin composition contains: (A) a prepolymer of vinyl thermosetting polyphenylene ether and a bifunctional maleimide or a multifunctional maleimide; and, (B) a polyolefin resin. Employing the prepolymer of vinyl thermosetting polyphenylene ether and the bifunctional maleimide or the multifunctional maleimide, solves the problem of incompatibility of the bifunctional maleimide or the multifunctional maleimide with the vinyl thermosetting polyphenylene ether and the polyolefin resin. An aqueous glue solution so mixed is uniform and consistent, the prepreg has a uniform expression, and a substrate resin area is free of a phase-separation problem.
Molding Compositions and Foam Molded Articles Made Thereof
A foamed article formed by foam injection molding or foam extrusion of a composition is disclosed. The article is formed from a molding composition consisting essentially of: 100 phr of at least two different hydrogenated styrenic block copolymers (HSBC), a first HSBC and a second HSBC, having different molecular weights, a molecular weight ratio of at least 1.2:1, respectively; and a weight ratio of ranging from 5:95 to 95:5, respectively; 10-55 phr of a polypropylene having a melt flow of at least 2 g10/min; and optionally up to 55 phr of a plasticizer, selected from hydrocarbon based oils, fatty acids, triglyceride oils, and mixtures thereof. The composition has a melt flow rate of 2-50 g/10 min, a Shore A hardness of 60-90, a melt strength (F) of at least 0.010 N, and a melt strength (V) of at least 10.