The present invention relates to a method for degradation of a phenolic resin-containing material, characterized in that the phenolic resin-containing material is subjected to an aminolysis with a reagent containing at least one amino group, as well as a method for synthesis and degradation of a phenolic resin-containing material, characterized in that the phenolic resin-containing material is created by curing the starting components at a temperature of less than 140 C. and is subjected to aminolysis with a reagent containing at least one amino group for the purpose of degradation.

Provided is an adhesive that effectively utilizes bark and demonstrates superior adhesion performance. The adhesive of the present invention comprises at least one adhesive resin (A) selected from the group consisting of phenolic resin, urea resin, and melamine resin, and finely pulverized bark (B) comprising cellulose nanofibers.

Soft, heat activated sealant compositions heat stabilized through the addition of a phenolic resin to provide a uniform volume expansion over a wide range of temperatures are disclosed.

Fiber-reinforced organic polymer aerogels, articles of manufacture and uses thereof are described. The reinforced aerogels include a fiber-reinforced organic polymer matrix having an at least bimodal pore size distribution with a first mode of pores having an average pore size of less than or equal to 50 nanometers (nm) and a second mode of pores having an average pore size of greater than 50 nm and a thermal conductivity of less than or equal to 30 mW/m.Math.K at a temperature of 20 C.

Provided is a phenolic resin foam laminate board in which a flexible surface material is arranged on at least upper and lower surfaces of a phenolic resin foam. The phenolic resin foam contains HCFO-1224yd(Z), has a density of not less than 20 kg/m.sup.3 and not more than 55 kg/m.sup.3, a closed cell ratio of 80% or more, an average cell diameter of not less than 60 ?m and not more than 200 ?m, a percentage of an area seeping out from the surface material is 30% or less, and content of HCFO-1224yd(Z) per space volume of 22.4?10.sup.?3 m.sup.3 in the phenolic resin foam is not less than 0.06 mol and not more than 0.35 mol.

A thermal insulating phenolic foam and method of manufacture thereof is provided. A phenolic foam is formed by foaming and curing a phenolic resin composition that comprises a phenolic resin, an acid catalyst, a blowing agent comprising a hydrocarbon having 6 carbon atoms or less, and an alkoxy alcohol. The resulting foam has low thermal conductivity and has excellent long term thermal stability.

Processes for preparing polystyrene-phenolic foam composites and precursor compositions are described. The processes yield composites having advantageous properties particularly useful in insulation and fire resisting applications.

Methods, apparatuses, and systems for making prepregs are disclosed. A method may include depositing a resin material onto a surface of a fiber bed and forming a number of discrete resin regions thereon. A distance between the resin regions may be measured to provide desired exposed portions of the surface to facilitate permeation of air through the exposed portions of the surface in a direction perpendicular to a plane of the fiber bed during a curing process of the prepreg.

A method of producing a phenolic resin foam is provided. The method includes foaming and curing, on a surface material, a foamable phenolic resin composition containing a phenolic resin, a surfactant, a curing catalyst, and at least one selected from the group consisting of a chlorinated hydrofluoroolefin, a non-chlorinated hydrofluoroolefin, and a halogenated hydrocarbon. The phenolic resin has a weight average molecular weight Mw of at least 400 and no greater than 3,000 as determined by gel permeation chromatography. The phenolic resin has a viscosity at 40 C. of at least 1,000 mPa.Math.s and no greater than 100,000 mPa.Math.s. The phenolic resin has a viscosity increase rate constant of at least 0.05 (1/min) and no greater than 0.5 (1/min).

A filler-containing film that can be precisely pressed to an electronic component with lower thrust is a film having a filler distributed layer in which fillers are regularly disposed in a resin layer, wherein an area occupancy rate of the fillers in a plan view is 25% or less, a ratio La/D between a layer thickness La of the resin layer and a particle diameter D of the fillers is 0.3 or more and 1.3 or less, and a proportion by number of the fillers present in a non-contact state with each other is 95% or more with respect to the entire fillers. The proportion by number of the fillers present in a non-contact state with each other is preferably 99.5% or more with respect to the entire fillers.