Disclosed is a compound useful in a resin composition for fabricating articles such as a prepreg, a resin film, a laminate or a printed circuit board, such that the articles have improved one or more properties including glass transition temperature, ratio of thermal expansion, peel strength, thermal resistance, dielectric constant, dissipation factor and flame retardancy.

Provided is a carbon black master batch pellet for black coloring comprising a high concentration of carbon black, having an excellent dispersibility of the carbon black, and which can express a stable black coloring concentration with hardly any classification occurring even when mixed in the various raw materials of a thermoplastic resin composition. A pellet comprising 35 to 55 mass % of carbon black (A), 65 to 45 mass % of a thermoplastic resin (B), and 0 to 10 mass % of a dispersant assistant (C), wherein a diameter (D) in a direction orthogonal to the axial direction is 2 to 5 mm, and a ratio (D/L) of the diameter (D) to a length (L (mm)) in the axial direction is 3.0 to 1.5.

A phosphorus-containing compound, a phosphorus-containing flame retardant, and a preparation method thereof are provided. Also provided is a resin composition which comprises the phosphorus-containing flame retardant and an unsaturated bond-containing resin. The resin composition may be used to make various articles, such as a prepreg, a resin film, a resin-coated copper, a laminate or a printed circuit board, and achieves improvement in at least one, more or all properties including resin filling property of prepreg, flame retardancy, alkali resistance, glass transition temperature, thermal dimensional stability (ratio of dimensional change under heat), thermal resistance after moisture absorption, peeling strength, dielectric constant and dissipation factor.

A resin composition containing: a block copolymer (I) having a polymer block (a1) containing a structural unit derived from an aromatic vinyl compound and a polymer block (a2) containing a structural unit derived from a conjugated diene compound; a plasticizer (II); and a biomass-derived polyolefin-based resin (III); in which the plasticizer (II) contains a plasticizer (II-1) containing a biomass-derived raw material; and in which the resin composition has a biobased content of 45% by mass or more, and a molded body obtained by using the resin composition.

Provided are a polyphenyl ether resin composition and a prepreg and a laminated board containing same. The polyphenyl ether resin composition comprises the following components: (1) a tetrafunctional or higher multifunctional acrylate-modified thermosetting polyphenyl ether resin; and (2) a vinyl resin cross-linking agent, the weight of the vinyl resin cross-linking agent being 40-100 parts by weight based on 100 parts by weight of the tetrafunctional or higher multifunctional acrylate-modified thermosetting polyphenyl ether resin. The modified thermosetting polyphenyl ether resin, due to containing a tetrafunctional or higher multifunctional acrylate active group, can cross-link more vinyl resin cross-linking agents. Not only the prepared high-speed electronic circuit substrate has low dielectric constant and dielectric loss, but also double bonds in side chains of the vinyl resin cross-linking agent are reacted completely in a resin curing system, so that the high-speed electronic circuit substrate has a better thermo-oxidative aging resistance.

A resin composition and the uses of it are provided. The resin composition comprises: (A) a polyfunctional vinyl aromatic copolymer; and (B) a diene compound, represented by the following formula (I)

##STR00001## wherein, in formula (I), R.sub.10 and R.sub.11 are independently H, a C1-C6 linear or branched alkyl, with the proviso that R.sub.10 and R.sub.11 are not simultaneously H; and the polyfunctional vinyl aromatic copolymer (A) is prepared by copolymerizing one or more divinyl aromatic compounds with one or more monovinyl aromatic compounds.

Disclosed herein is a resin composition, comprising: a crosslinking agent, its prepolymer, or a combination thereof; and a first unsaturated bond-containing resin. The resin composition may be used to make various articles, such as a prepreg, a resin film, a resin-coated copper, a laminate or a printed circuit board and achieve improvement in at least one, more or all properties including volatile content of prepreg, stickiness of prepreg, resin filling property of prepreg, glass transition temperature, dimensional stability under heat, T288 thermal resistance, thermal resistance after moisture absorption, dielectric constant and dissipation factor.

Described is an aqueous coating composition comprising an aqueous dispersion of a radically polymerized addition polymer and phyllosilicate. The aqueous polymer dispersion has a particularly low electrical conductivity. The composition can be used for providing oxygen barrier properties to polymer films.

Disclosed herein are compositions comprising a crosslinked product prepared by ionically crosslinking a solid grade oligomer and a polymer using an ionic crosslinking agent. In some embodiments, the polymer is derived from a hydrophobic monomer and/or a gas-phase monomer. In some embodiments, the solid grade oligomer is reacted with a polymer comprising a hydrophobic monomer and/or a gas-phase monomer. The present disclosure also relates to methods of making the disclosed compositions. The compositions disclosed herein can be used in a variety of applications including, but not limited to, asphalt compositions, paints, coatings, carpet compositions, paper binding and coating compositions, foams, or adhesives.

Disclosed herein are compositions comprising a crosslinked product prepared by ionically crosslinking a solid grade oligomer and a polymer using an ionic crosslinking agent. In some embodiments, the polymer is derived from a hydrophobic monomer and/or a gas-phase mono-mer. In some embodiments, the solid grade oligomer is reacted with a polymer comprising a hydrophobic monomer and/or a gas-phase monomer. The present disclosure also relates to methods of making the disclosed compositions. The compositions disclosed herein can be used in a variety of applications including, but not limited to, asphalt compositions, paints, coatings, carpet compositions, paper binding and coating compositions, foams, or adhesives.