Provided are a polyphenyl ether resin composition and a prepreg and a laminated board containing same. The polyphenyl ether resin composition comprises the following components: (1) a tetrafunctional or higher multifunctional acrylate-modified thermosetting polyphenyl ether resin; and (2) a vinyl eresin cross-linking agent, the weight of the vinyl resin cross-linking agent being 40-100 parts by weight based on 100 parts by weight of the tetrafunctional or higher multifunctional acrylate-modified thermosetting polyphenyl ether resin. The modified thermosetting polyphenyl ether resin, due to containing a tetrafunctional or higher multifunctional acrylate active group, can cross-link more vinyl resin cross-linking agents. Not only the prepared high-speed electronic circuit substrate has low dielectric constant and dielectric loss, but also double bonds in side chains of the vinyl resin cross-linking agent are reacted completely in a resin curing system, so that the high-speed electronic circuit substrate has a better thermo-oxidative aging resistance.

The present invention provides an adhesive film having an adhesive layer on at least one surface of a heat-resistant layer, in which the heat-resistant layer contains a thermoplastic resin having an aromatic ring in a monomer unit as an essential component, a heat deflection temperature of the heat-resistant layer is 100? C. or higher, and the adhesive layer contains a modified polyolefin resin as an essential component and, furthermore, contains at least one resin having a styrene structure or a cyclic hydrocarbon structure.

A composition includes specific amounts of a poly(phenylene ether), a rubber-modified polystyrene, a flame retardant containing an organophosphate ester, and a mold release agent containing a high viscosity polydiorganosiloxane. The composition excludes polyolefin waxes. The high viscosity polydiorganosiloxane can be provided in the form of a room temperature solid masterbatch, thereby facilitating compounding of the composition. The composition is useful for injection molding, and particularly useful for injection molding battery holders for cell phone tower back-up power systems.

A resin composition contains a maleimide compound (A), a cyanate ester compound (B), a polyphenylene ether compound (C) with a number average molecular weight of not lower than 1000 and not higher than 7000 and represented by Formula (1), and a block copolymer (D) having a styrene backbone. In Formula (1), X represents an aryl group; (YO)n.sub.2- represents a polyphenylene ether moiety; R.sub.1, R.sub.2, and R.sub.3 each independently represent a hydrogen atom, an alkyl group, an alkenyl group, or an alkynyl group; n.sub.2 represents an integer of from 1 to 100; n.sub.1 represents an integer of from 1 to 6; and n.sub.3 represents an integer of from 1 to 4. ##STR00001##

A resin composition and uses thereof are provided. The resin composition includes: (A) a polyfunctional vinyl aromatic copolymer; and (B) a compound having a structure of formula (I),

##STR00001## wherein the polyfunctional vinyl aromatic copolymer (A) is prepared by copolymerizing one or more divinyl aromatic compounds with one or more monovinyl aromatic compounds, and in formula (I), Y.sub.1 is an organic group.

A method of forming a skin-foam-substrate type structure particular suitable as an automobile trim component. The method comprises supplying a polymer resin containing a chemical foaming agent and including metal particles capable of inductive heating, that is positioned between a polymeric skin and substrate, followed by inductive heating to cause foaming of the polymeric resin. The foamed polymer resin adheres to the skin and substrate.

The method for manufacturing a composition consists in bringing into contact a product containing mostly polypropylene having a controlled fluidity less than 10 g/10 min with highly fluid polypropylene and a polymer grafted with maleic anhydride.

The present invention relates to the technical field of copper clad laminates and relates to a resin composition and a pre-preg and a laminate using the composition. The resin composition comprises: (A) a prepolymer of vinyl thermosetting polyphenylene ether and a bifunctional maleimide or a multifunctional maleimide; and, (B) a polyolefin resin. The present invention, by employing the prepolymer of vinyl thermosetting polyphenylene ether and the bifunctional maleimide or the multifunctional maleimide, solves the problem of incompatibility of the bifunctional maleimide or the multifunctional maleimide with the vinyl thermosetting polyphenylene ether and the polyolefin resin. An aqueous glue solution so mixed is uniform and consistent, the prepreg has a uniform expression, and a substrate resin area is free of a phase-separation problem. In addition, the maleimide employed is either the bifunctional maleimide or the multifunctional maleimide, relative to a monofunctional maleimide, a substrate so prepared is provided with increased heat resistance, a reduced thermal expansion coefficient, extended thermal stratification time, and increased thermal decomposition temperature.

An oil-resistant film may be provided by an oil-resistant base material that is excellent in the oil resistance even in not only a plane part but also a bent part of a package can be obtained and also to the provision of an oil-resistant base material having the oil-resistant film and an oil-resistant paper having the oil-resistant film. An oil-resistant film may contain a polyvinyl alcohol-based polymer (A) and a polymer particle (B) containing a polymer having a glass transition temperature of 40 C. or lower, wherein the content of the polymer particle (B) is 1 part by mass or more and less than 150 parts by mass based on 100 parts by mass of the polyvinyl alcohol-based polymer (A); and an oil-resistant base material (oil-resistant paper) having the oil-resistant film on a base material (paper).

Disclosed herein are modified diene-containing (co)polymers, in particular, modified styrene-butadiene copolymer, which can be used as flame retardants for expandable polystyrene polymer compositions. In particular, disclosed is a modified diene-containing (co)polymer, a method for preparing it, and use as a flame retardant for expandable polystyrene. The modified diene-containing (co)polymer claimed in the invention is characterized by high thermostability, namely, a 5% weight loss temperature of at least 180 C., a molecular weight of at least 1500 g/mol and a halogen content of at least 35 wt. %; the content of tertiary and/or allyl halogenides is in the range from 0 to less than 1.5 wt. %, and also does not affect the polymerization process and the formation of polystyrene granules either, and allows to obtain polystyrene granules with a yellowness index of 2 to 6 units, comparable to the yellowness index of polystyrene granules containing HBCD (from 0 to 3 units).