Provided is: a thermally conductive silicone gel composition which has a high thermal conductivity, and is less likely to flow out and slip off/drop off from a surface on which the gel composition is placed, even when the composition that has not been cured is placed on a sloped surface or in a vertical direction, and has excellent gap-filling ability with respect to a heat dissipation part, etc., and excellent repairability if desired; a thermally conductive member comprising the thermally conductive silicone gel composition; and a heat dissipation structure using the same. The thermally conductive silicone gel composition comprises: (A) an alkenyl group-containing organopolysiloxane; (B) an organohydrogenpolysiloxane; (C) a catalyst for a hydrosilylation reaction; (D) a thermally conductive filler; (E) a silane-coupling agent; and (F) a specific organopolysiloxane having a hydrolyzable silyl group at one end thereof. The gel composition has certain viscosity properties as disclosed herein.

Provided are a thermosetting epoxy resin composition and a prepreg, laminated board and printed circuit board using the thermosetting epoxy resin composition. The thermosetting epoxy resin composition comprises the following components in parts by weight: 2-10 parts of a phosphorus-containing anhydride, 5-40 parts of a phosphorus-free anhydride, 5-45 parts of an epoxy resin, 40-70 parts of a filler, and 0-15 parts of a phosphorus-containing flame retardant, with the total part by weight of all these components being 100 parts, wherein the phosphorus-containing anhydride has a structure as represented by formula I or II, and the epoxy resin is selected from one of or a combination of at least two of a bisphenol A epoxy resin, a bisphenol F epoxy resin and a biphenyl epoxy resin. The thermosetting epoxy resin composition also has good heat resistance, discoloration resistance and dimensional stability after curing while ensuring V-0 grade flame resistance, and can be used for the preparation of printed circuit board substrates in the field of LEDs.

Provided are a rubber composition which provides a self-healing rubber with improved strength and wet grip performance, and a pneumatic tire including the rubber composition. The present disclosure relates to a rubber composition containing a rubber component having a functional group containing a cationic functional group and/or an anionic functional group, a filler capable of generating a charge paired with the functional group, and sulfur.

An epoxy resin composition comprises the following components [A] to [E]: [A] epoxy resin, [B] amine-type curing agent, [C] cure accelerator, and [D] red phosphorus. The epoxy resin composition contains, per 100 mass parts for the total amount of [A], 25-45 mass parts of [A1] a liquid bisphenolic epoxy resin and 20-40 mass parts of [A2] a phenol novolac-type epoxy resin, and has a content ratio of [E] to [D] ([E]/[D]) of at least 1. Provided are a light-weight fiber-reinforced composite material that exhibits an excellent flame retardancy and mechanical properties and does not produce halogen gas during combustion, and an epoxy resin composition that has a viscosity suitable for obtaining the fiber-reinforced composite material as well as prepregs.

A photo-curable resin composition for three-dimensional shaping including: a resin component (A) containing a (meth)acrylate compound (A1) represented by General Formula (1)

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(where R.sub.1 is a hydrogen atom or a methyl group, and R.sub.2 is a linear, branched, or cyclic trivalent hydrocarbon group with one to eight carbon atoms which may have three or less heteroatoms), and a urethane (meth)acrylate compound (A2) having two or more radical-polymerizable functional groups; inorganic particles (B); and a photoradical polymerization initiator (C). 40% by mass or more and 90% by mass or less of the (meth)acrylate compound (A1) is contained in the resin component (A). 10% by mass or more and 60% by mass or less of the urethane (meth)acrylate compound (A2) is contained in the resin component (A).

A silica sol dispersed in a nitrogen-containing solvent and a silica-containing resin composition containing a nitrogen atom-containing polymer. A silica sol including silica particles containing aluminum atoms and having an average primary particle diameter of 5 to 100 nm, the silica particles being dispersed in a nitrogen-containing solvent, wherein the aluminum atoms are bonded to the surfaces of the silica particles in an amount in terms of Al.sub.2O.sub.3 of 800 to 10,000 ppm/SiO.sub.2. The silica particles are bonded to a silane compound or a hydrolysate of the silane compound. The nitrogen-containing solvent is an amide solvent. The nitrogen-containing solvent is dimethylacetamide, dimethylformamide, N-methylpyrrolidone, or N-ethylpyrrolidone. The insulating resin composition includes the silica sol and a nitrogen-containing polymer. The nitrogen-containing polymer is polyimide, polyamide, polyamic acid, polyamideimide, polyetherimide, or polyesterimide. An insulation-coated conductor wire produced by insulation coating of a conductor wire with the insulating resin composition.

A thermal interface composition includes a polysiloxane component, a thermal conductive component, a curing agent, a curing accelerator, an organosilicon coupling agent, and a crosslinking agent having three or more epoxy groups. The polysiloxane component includes not lower than 50 wt % and lower than 100 wt % of a first polysiloxane and a second polysiloxane. The thermal conductive component includes not lower than 30 wt % and lower than 70 wt % of a first thermal conductive filler, not lower than 30 wt % and lower than 70 wt % of a second thermal conductive filler, and greater than 0 wt % and not greater than 40 wt % of a third thermal conductive filler. A method for preparing a thermal interface material is also disclosed.

A crosslinked adhesive composition comprising: (i) a polymer; (ii) solid particles embedded within the polymer; and (iii) a multiplicity of boronate linkages crosslinking between the polymer and solid particles, wherein the boronate linkages have the formula

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wherein the polymer and particles are connected to each other through the boronate linkages, and the crosslinked adhesive composition has an ability to bond surfaces and a further ability to thermally debond and rebond the surfaces. Also described herein is a method of bonding first and second surfaces together, the method comprising placing the above-described crosslinked adhesive composition onto the first surface and pressing the second surface onto the crosslinked adhesive composition on the first surface.

Provided is a flame-retardant resin composition containing a thermoplastic resin and a polysaccharide, wherein the polysaccharide includes an acidic polysaccharide composed of one or more selected from the group consisting of a polysaccharide having an acidic functional group, a derivative of the polysaccharide having an acidic functional group in which a site other than the acidic functional group is modified, and a salt thereof; and a total number of the acidic functional group and the salt thereof per monosaccharide unit in the acidic polysaccharide is in the range of 0.2 to 1.5.

A polymer composition is disclosed that comprises a polymer matrix containing at least one thermotropic liquid crystalline polymer and at least one hollow inorganic filler having a dielectric constant of about 3.0 or less at a frequency of 100 MHz wherein the weight ratio of the at least one thermotropic liquid crystalline polymer to the at least one hollow inorganic filler is from about 0.1 to about 10 and wherein the polymer composition exhibits a dielectric constant of about 4 or less and a dissipation factor of about 0.02 or less, as determined at a frequency of 10 GHz.