Provided are an adhesive for an endoscope, a cured product thereof, an endoscope including a member secured with the cured product, and a method for manufacturing the endoscope. The adhesive includes the following (a) to (c): (a) an epoxy resin including at least one of a bisphenol A epoxy resin, a bisphenol F epoxy resin, or a phenol novolac epoxy resin; (b) a polyamine compound having an oxygen atom but no amide bond in a molecule thereof; and (c) at least one of an inorganic filler, an amide compound, a fatty acid wax, or a sorbitol compound.

Provided is a curable silicone rubber mixture that provides a cured silicone rubber having a small change in volume resistivity when a high voltage is applied for a long period of time. The curable silicone rubber mixture includes a curable silicone rubber, a cation having one or more carbon-carbon double bonds in the molecular structure thereof, a metal oxide particle having a hydrophilization ratio at the surface thereof of 0.50 or more, and an anion having a specific structure.

A composition contains an amine compound, metal oxide particles, and a binder polymer having an acid group, in which the amine compound has, as a substituent on a nitrogen atom in the amine compound, a substituent which includes a linking group having a linking chain length of 3 or more, and a weight-average molecular weight of the amine compound is 100 or more.

The present invention relates to an electromagnetic millimetre wave transmission reducing material, preferably having a volume resistivity of more than 1 Ωcm, containing particles of at least an electrically conductive, magnetic or dielectric material and an electrically non-conductive polymer, wherein the transmission reducing material is capable of reducing transmission of electromagnetic waves in a frequency region of 60 GHz or more. The invention also relates to its use and method for reducing transmission as well as an electronic device comprising said transmission reducing material.

A curable liquid composition containing a particulate filler and an epoxy compound having a non-aromatic cyclic group having 5 or more annular atoms, having a favorable dispersion stability of particulate filler and providing a cured material having high hardness, a filler that is suitably incorporated in the curable liquid composition, and a compound that can be suitably used as a ligand bonded to the filler. In a curable liquid composition comprising an epoxy compound having a non-aromatic cyclic group having 5 or more annular atoms as a curable component, a filler on a surface of which a ligand having an alicyclic epoxy group that may be condensed with an aromatic ring and a thiol group, is bonded, is used.

The invention relates to an one pack ambient cure crosslinkable modified vinyl branched ester polymer with vinyl silane and a water scavanger. The copolymer composition can be formulated to the desired viscosity that allows the application by standard technics, and the curing is optimized in the presence of an appropriated catalyst as one pack system to be cure at room temperature.

Methods of producing lead-free piezoelectric composites are described. The method can include adding a lead-free piezoelectric additive to a solution that includes a solvent and polymer solubilized therein. The solvent can have i) a boiling point ≤80° C. at 0.1 MPa and ii) a solubility in water of ≥0.1 g/g and/or a dielectric constant ≥20. The solvent can be removed to form a polymeric matrix having the lead-free piezoelectric particles dispersed therein. Electrical treatment of the polymeric matrix can form the piezoelectric component. Lead-free piezoelectric composites and devices that include the lead-free piezoelectric composites are also described.

A powder mixture including spherical barium titanate particles and spherical oxide particles and having an average particle diameter of 2 μm or more and 30 μm or less, wherein the spherical oxide particles have an average particle diameter of 0.05 μm or more and 1.5 μm or less, and the spherical oxide particles are contained in an amount of 0.02% by mass or more and 15% by mass or less based on the powder mixture. The spherical oxide particles are preferably amorphous silicon dioxide particles and/or aluminum oxide particles. According to the present invention, it is possible to provide a spherical barium titanate-based powder which enables to prepare a high dielectric resin composition with which reduced wire sweep amount and burr are achieved.

A method of forming a polyolefin-perovskite nanomaterial composite which contains oriented electrically and thermally conductive pathways. The method involves milling a polyolefin with particles of a perovskite nanomaterial, molding to forma composite plate, and subjecting the composite plate to an AC voltage. The AC voltage forms oriented electrically and thermally conductive pathways by partial dielectric breakdown of the composite. The presence of the oriented electrically and thermally conductive pathways gives the polyolefin-perovskite nanomaterial electrical and thermal conductivity and dielectric permittivity higher than the polyolefin alone.

There is provided a resin composition that can greatly improve voltage endurance while ensuring high capacitance and excellent circuit adhesion, when used as the dielectric layer of a capacitor. This resin composition includes a binder component including bisphenol S, an epoxy resin curing agent having a phenolic hydroxyl group, and an epoxy resin; and a dielectric filler.