Patent classifications
C08K2003/2244
PIEZOELECTRIC COMPOSITES CONTAINING A SACRIFICIAL MATERIAL AND USE THEREOF IN ADDITIVE MANUFACTURING
Parts made by additive manufacturing are often structural in nature, rather than having functional properties conveyed by a polymer or other component present therein. Printed parts having piezoelectric properties may be formed using compositions comprising a plurality of piezoelectric particles located in a polymer matrix comprising a first polymer material and a sacrificial material that are immiscible with each other. The sacrificial material, which may comprise a second polymer material, may be removable from the first polymer material under specified conditions. The piezoelectric particles may remain substantially non-agglomerated when combined with the polymer matrix. The polymer matrix may be treated to remove the sacrificial material to introduce a plurality of pores. The compositions may have a form factor such as a composite filament, a composite pellet, a composite powder, or a composite paste. Additive manufacturing processes may comprise forming a printed part by depositing the compositions layer-by-layer.
COMPOSITION FOR COATING AN OVERHEAD CONDUCTOR
A composition for coating an overhead conductor is disclosed comprising: (i) a reflective agent; (ii) a photocatalytic agent comprising ≥70 wt % anatase titanium dioxide (TiO2) having an average particle size (“aps”) ≤100 nm; (iii) a non-aqueous solvent; and (iv) one or more alkyl silicate binders.
ACRYLIC AND MODACRYLIC FIBER STABILIZED AGAINST SUNLIGHT
Acrylic and modacrylic fiber stabilized against sunlight The invention is related to increasing the resistance of acrylic fiber containing at least 85% acrylonitrile groups and modacrylic fibers containing at least 40% acrylonitrile groups and at least 40% vinylidene chloride groups, against UV light and surface heating caused by sunlight.
Resin composition, secondary coating material for optical fiber, and optical fiber
A resin composition comprises a base resin containing an urethane (meth)acrylate oligomer, a monomer having a phenoxy group, and a photopolymerization initiator, and hydrophobic inorganic oxide particles, wherein the viscosity is 300 mPa.Math.s or more and 4200 mPa.Math.s or less at 45° C. and the content of the monomer having a phenoxy group is 1% by mass or more and 30% by mass or less based on the total amount of the base resin.
PIEZOELECTRIC POLYMER FILM
An object of the present invention is to provide a piezoelectric polymer film having excellent piezoelectric characteristics. The object is achieved by providing a piezoelectric polymer film including a piezoelectric layer containing lead zirconate titanate particles in a matrix that contains a polymer material, and an electrode layer provided on each of both surfaces of the piezoelectric layer, in which a Raman shift of a maximum peak present in a range of 190 to 215 cm.sup.−1 in a Raman spectrum of the piezoelectric layer is 205 cm.sup.−1 or less.
Impregnate with antistatic properties
An impregnate with antistatic properties for use in laminates or for coating wood-based panels is disclosed. A resin used for impregnating and/or coating paper may include carbon-based particles, at least one compound of the general formula (Ia) R.sup.1.sub.aSiX.sub.(4-a), R.sup.3.sub.cSiX.sub.(4-c) (II), and inorganic particles. X is methoxy, ethoxy, n-propoxy or i-propoxy. R.sup.1 is an organic radical selected from the group including methyl, ethyl, propyl, or vinyl, and has at least one functional group Q.sub.1, selected from the group including acrylic, acryloxy, methacrylic, methacyloxy, or epoxy. R.sup.3 is a non-hydrolyzable organic radical selected from the group including C1-C10 alky, C6-10 aryl, wherein C is 1, 2, or 3, and the inorganic particles have a size between 2 nm and 400 nm.
Polyimide films and electronic devices
In a first aspect, a polyimide film includes a dianhydride and a diamine. The dianhydride, the diamine or both the dianhydride and the diamine include an alicyclic monomer, an aliphatic monomer or both an alicyclic monomer and an aliphatic monomer. The polyimide film has a b* of 1.25 or less and a yellowness index of 2.25 or less for a film thickness of 50 μm. The polyimide film is formed by: (a) polymerizing the dianhydride and the diamine in the presence of a first solvent to obtain a polyamic acid solution; (b) imidizing the polyamic acid solution to form a substantially imidized solution; (c) casting the substantially imidized solution to form a film; and (d) drying the film.
Printing Plate and Polymeric Coating Material for the Same
The invention relates to a coating material for coating a metal or non-metal printing plate, comprising a liquid starting material which can be polymerised using UV light in order to form a polymer matrix, and comprising a filling material which can be covalently incorporated into a polymer matrix of the starting material. The filling material is of a sub-microscale size, wherein absorption of IR radiation can be brought about by the filling material in the starting material, said absorption being higher than an absorption without filling material. The invention also relates to a printing plate comprising a cylindrical main body, wherein a polymer layer is applied to at least parts of a circumferential surface of the main body, with the polymerisation thereof being induced by UV light, wherein the polymer layer has a sub-microscale filling material, and wherein a higher absorption of infrared radiation is brought about using the filling material in the polymer layer than in the polymer layer without filling material.
RESIN COMPOSITION AND CURED FILM
A resin composition and a cured film are provided. The resin composition includes a monomer mixture (A), a siloxane compound (B), a curing agent (C), and inorganic particles (D). The monomer mixture (A) includes a bisphenol fluorene compound (A-1) represented by Formula (I-1). The siloxane compound (B) has a group represented by Formula (II-a).
##STR00001##
Composite with reduced polymerization shrinkage stress
Radically polymerizable dental material which contains at least one compound of Formulae I to III: ##STR00001## The material preferably additionally contains a radically polymerizable monomer, an initiator for the radical polymerization and filler. It is characterized in particular by a low polymerization contraction stress.