The present invention is directed towards a powder coating composition comprising a binder; a thermally conductive, electrically insulative filler material; and, optionally, a thermoplastic material and/or a core-shell polymer. The present invention is also directed to a substrate comprising a coating layer deposited from the powder coating composition of the present invention, as well as methods of coating a substrate.

Provided is a copper-based paste capable of bonding a chip component and a substrate more firmly and obtaining a copper-based bonding material having high thermal conductivity. This copper oxide paste includes copper-containing particles, a binder resin, and an organic solvent. The copper-containing particles contain Cu.sub.2O and CuO. The total amount of copper element constituting Cu.sub.2O and copper element constituting CuO is 90% or more of the copper element contained in the copper-containing particles. The copper-containing particles have a 50% cumulative particle size (D.sub.50) of 0.20-5.0 μm inclusive; the 50% cumulative particle size (D.sub.50) and the 10% cumulative particle size (D.sub.10) satisfy 1.3≤D.sub.50/D.sub.10≤4.9; the 50% cumulative particle size (D.sub.50) and the 90% cumulative particle size (D.sub.90) satisfy 1.2≤D.sub.90/D.sub.50≤3.7, and the BET specific surface area of the copper-containing particles is 1.0 m.sup.2/g to 8.0 m.sup.2/g inclusive.

A polyphenylene sulfide resin composition including (a) 25% to 75% by weight of a base resin; (b) 0.1% to 10% by weight of a laser direct structuring (LDS) additive; (c) 0.1% to 5% by weight of a plating seed generation promoter; (d) 10% to 60% by weight of a glass fiber; and (e) 0% to 40% by weight of a mineral filler, based on a total weight of the polyphenylene sulfide resin composition. The base resin includes 95% by weight or more of a polyphenylene sulfide resin based on a total weight of the base resin. A method of preparing the polyphenylene sulfide resin composition, and an injection-molded article manufactured using the polyphenylene sulfide resin composition.

A thermoplastic composition includes a polyarylene ether component, a flame retardant additive, an impact modifier, and a laser direct structuring additive. The laser platable thermoplastic composition is capable of being plated after being activated using a laser, exhibits a plating index of greater than 0.8 when tested using X-ray fluorescence, and exhibits a heat deflection temperature of greater than 150° C. at 0.45 MPa/3.2 mm when tested in accordance with ASTM D648. In further aspects, the thermoplastic composition may further comprise a laser direct structuring additive synergist comprising a polysiloxane, a polysilane, or a silane.

The present invention is directed towards a system for coating a substrate comprising an electrodepositable coating composition and a powder coating composition. Also disclosed are coated substrates comprising a first coating layer comprising an electrodepositable coating layer, and a second coating layer comprising a powder coating layer on at least a portion of the first coating layer, as well as methods of coating substrates.

A printable antimicrobial medium is disclosed, including a substrate layer having a first surface which may include a first area, a second surface opposite the first surface which may include a second area. The printable antimicrobial medium also includes a first adhesive deposited on the first area, a liner layer releasably secured to the substrate layer by the first adhesive, and a first antimicrobial dry marking material deposited on at least a portion of the second area of the substrate layer. The printable antimicrobial medium may include a first score line arranged to separate one or more layers of the printable antimicrobial medium into a first portion and a second portion, and an antimicrobial dry marking material may include copper oxide deposited on at least a portion of the second area of the substrate layer.

First embodiment of a (meth)acrylic copolymer in the present invention includes following: a (meth)acrylic copolymer having at least one kind of constitutional unit selected from the group consisting of a constitutional unit (A1) having at least one kind of structure (I) selected from the group consisting of structures represented by the following formula (1), formula (2), or formula (3) and a constitutional unit (A2) having a triorganosilyloxycarbonyl group and a constitutional unit (B) derived from a macromonomer (b): ##STR00001## (where, X represents —O—, —S—, or —NR.sup.14—, R.sup.14 represents a hydrogen atom or an alkyl group, R.sup.1 and R.sup.2 each represent a hydrogen atom or an alkyl group having from 1 to 10 carbon atoms, R.sup.3 and R.sup.5 each represent an alkyl group having from 1 to 20 carbon atoms, a cycloalkyl group, or an aryl group, and R.sup.4 and R.sup.6 each represent an alkylene group having from 1 to 10 carbon atoms).

A polymer includes a repeating unit represented by at least one of Formula 1a or Formula 1b: ##STR00001## wherein, in Formulae 1a or 1b, CY.sub.1 is a group represented by at least one of Formula 1-2 or Formula 1-4, CY.sub.2 is a group represented by Formula 1-3, and L.sub.1, L.sub.2, a1, and a2 are defined the same as in the specification, and ##STR00002## in Formulae 1-2, Formula 1-3, or 1-4, X, Y, R.sub.1, R.sub.2, R.sub.11 to R.sub.14, b1, b2, R.sub.21, R.sub.22, b21, b22, Z.sub.1, Z.sub.2, c1, and c2 are defined the same as in the specification.

A sheet for thermal bonding which has a tensile modulus of 10 to 3,000 MPa and contains fine metal particles in an amount in the range of 60-98 wt % and which, when heated from 23° C. to 400° C. in the air at a heating rate of 10° C./min and then examined by energy dispersive X-ray spectrometry, has a carbon concentration of 15 wt % or less.

A manufacturing method described in the present invention provides antimicrobial copper-containing polyurethane foams by embedding microparticles of metallic copper (Cu), cuprous oxide (Cu.sub.2O), cupric oxide (CuO), or cuprous iodide (CuI), or combinations thereof, into polyurethane foams, wherein said microparticles are homogenously distributed throughout the formed polymeric matrix of said foam. The method combines these copper-containing microparticles, or polyurethane liquid additive containing these particles, mixed in polyol with isocyanate.