There is provided an anti-counterfeit ink composition, an anti-counterfeit ink, and an anti-counterfeit printed matter that transmits a visible light region, having absorption in an infrared region, and capable of judging authenticity of a printed matter, and containing composite tungsten oxide fine particles, the composite tungsten oxide fine particles having a hexagonal crystal structure, having a lattice constant such that a-axis is 7.3850 or more and 7.4186 or less, and c-axis is 7.5600 or more and 7.6240 or less, and having a particle size of the near-infrared absorbing material fine particles is 100 nm or less, and a method for producing the anti-counterfeit ink composition, the anti-counterfeit ink, the anti-counterfeit printed matter, and the anti-counterfeit ink composition.

An electromagnetic wave absorbing particle dispersoid is provided that includes at least electromagnetic wave absorbing particles and a thermoplastic resin, wherein the electromagnetic wave absorbing particles contain hexagonal tungsten bronze having oxygen deficiency, wherein the tungsten bronze is expressed by a general formula: M.sub.xWO.sub.3-y (where one or more elements M include at least one or more species selected from among K, Rb, and Cs, 0.15x0.33, and 0<y0.46), and wherein oxygen vacancy concentration N.sub.V in the electromagnetic wave absorbing particles is greater than or equal to 4.310.sup.14 cm.sup.3 and less than or equal to 8.010.sup.21 cm.sup.3.

A polymer includes a repeating unit represented by at least one of Formula 1a or Formula 1b:

##STR00001##

wherein, in Formulae 1a or 1b, CY.sub.1 is a group represented by at least one of Formula 1-2 or Formula 1-4, CY.sub.2 is a group represented by Formula 1-3, and L.sub.1, L.sub.2, a1, and a2 are defined the same as in the specification, and

##STR00002##

in Formulae 1-2, Formula 1-3, or 1-4, X, Y, R.sub.1, R.sub.2, R.sub.11 to R.sub.14, b1, b2, R.sub.21, R.sub.22, b21, b22, Z.sub.1, Z.sub.2, c1, and c2 are defined the same as in the specification.

The present disclosure is directed to systems and methods for providing a dielectric layer on a semiconductor substrate capable of supporting very high density interconnects (i.e., 100 IO/mm). The dielectric layer includes a maleimide polymer in which a thiol-terminated functional group crosslinks with an epoxy resin. The resultant dielectric material provides a dielectric constant of less than 3 and a dissipation factor of less than 0.001. Additionally, the thiol functional group forms coordination complexes with noble metals present in the conductive structures, thus by controlling the stoichiometry of epoxy to polyimide, the thiol-polyimide may beneficially provide an adhesion enhancer between the dielectric and noble metal conductive structures.

A material of formula (I)

M.sup.1.sub.aM.sup.2.sub.bW.sub.cO.sub.d(P(O).sub.nR.sub.m).sub.e(I)

wherein each of M.sup.1 and M.sup.2 is independently ammonium or a metal cation; a is 0.01 to 0.5; b is 0 to 0.5; c is 1; d is 2.5 to 3; e is 0.01 to 0.75; n is 1, 2 or 3; m is 1, 2 or 3; and R is an optionally substituted hydrocarbyl group.

There is provided an interlayer film for laminated glass with which a low yellow index value, low excitation purity and high heat shielding properties can be achieved in spite of the thickness varying with places. The interlayer film for laminated glass according to the present invention has a two or more-layer structure, has a thickness of one end thinner than a thickness of the other end at the opposite side of the one end and includes a first layer containing a thermoplastic resin and a second layer containing a thermoplastic resin, the difference between the maximum thickness and the minimum thickness in the first layer is smaller than the difference between the maximum thickness and the minimum thickness in the second layer, and the first layer contains a heat shielding compound.

Magnetic material powder that can be detected by a metal detector and the like and tungsten powder that can be detected by an X-ray inspection device are dispersed in a polymer material of the molded article.

A radiation-curable slurry for additive manufacturing of 3D metal objects is provided, comprising: (a) 2-45 wt % of a polymerizable resin; (b) 0.001-10 wt % of one or more polymerization photoinitiators; and (c) 55-98 wt % of a mixture of metal-containing compounds, wherein the mixture of metal-containing compounds comprises, based on the weight of said mixture, 5-95 wt % of metal particles and 5-95 wt % of one or more metal precursors. An additive manufacturing method for producing a three-dimensional metal object using the slurry is provided, as well as three-dimensional metal objects obtainable by the method.

A window film that can be applied to a window glass with sufficient adhesive strength at a short curing time when using the water bonding method, and can provide an excellent appearance in which aeration of air bubbles and whitening are suppressed is described.

A tungsten trioxide thermal shield for electronic components in a gun launched munition includes tungsten trioxide grains suspended in a binder. The thermal shield is made such that a tungsten trioxide rich layer is adjacent the electronic component and a binder rich layer opposes the tungsten trioxide rich layer.