A resin molded body contains a resin, a magnetic powder, and a non-magnetic powder. The non-magnetic powder has an apparent density in the range of 0.70 to 1.0 g/cm.sup.3. The non-magnetic powder content is more than 8% by volume and 40% or less by volume.

An electronic component has an organic member between two transparent substrates, in which outer peripheral portions of the two transparent substrates are bonded by a sealing material containing to melting glass. The low melting glass contains vanadium oxide, tellurium oxide, iron oxide and phosphoric acid, and satisfies the following relations (1) and (2) in terms of oxides. The sealing material is formed of a sealing material paste which contains the low melting glass, a resin binder and a solvent, the low melting glass containing vanadium oxide, tellurium oxide, iron oxide and phosphoric acid, and satisfies the following relations (1) and (2) in terms of the oxides. Thereby, thermal damages to an organic element or an organic material contained in the electronic component can be reduced and an electronic component having a glass bonding layer of high reliability can be produced efficiently.
V.sub.2O.sub.5+TeO.sub.2+Fe.sub.2O+P.sub.2O.sub.5≧90(mass %)  (1)
V.sub.2O.sub.5>TeO.sub.2>Fe.sub.2O.sub.3>P.sub.2O.sub.5 (mass %)  (2)

Method for the preparation of a film forming flame retardant comprising nitrogen and silicon in its chemical composition, said method comprising the following steps: i. conversion of Z.sub.1 moles of amine moiety, selected from the group of primary and secondary amine and covalently bound to Z.sub.2 moles of one or more at least partially hydrolysable silane moiety, with Z.sub.3 moles of a chemical substance selected from a group of chemical substances obtainable from carboxylic acids or carbonic acid and represented by formula (I), (II) or (III); ii. conversion with a with at least one HO-functionalized substance of formula (IV): M.sub.x(OH).sub.yR.sup.5z. The resulting film forming flame retardant is contemplated.

A method for producing a thixotropic curable silicone composition is provided. The curable silicone composition comprises: (A) a silicone base material comprising: an organopolysiloxane having at least two alkoxysilyl-containing groups per molecule and a filler other than fumed silica; (B) a hydrophobic fumed silica; (C) a carbasilatrane derivative; (D) an alkoxysilane or its partial hydrolysis and condensation product; and (E) a condensation reaction catalyst. The method comprises the following steps: (I) mixing components (A) and (B); (II) mixing component (C) with a mixture obtained by step (I); and (III) mixing components (D) and (E) with a mixture obtained by step (II) under free of moisture. The curable silicone composition obtained by the method has an excellent thixotropic property and can cure at room temperature by contact with moisture in air.

Particles having excellent touch properties are achieved with a water-soluble material having excellent biodegradability. Particles according to the present invention contain a starch having an amylopectin content of 90% by weight or more. The average particle diameter d.sub.1 of the panicles is 0.5 to 20 μm, and the maximum particle diameter d.sub.2 is less than 30 μm while being within 3.0 times the average particle diameter.

A method for improving the heat stability or heat resistance of a cured fluorosilicone elastomer is disclosed. The method comprises I) mixing a stabilizer with a fluorosilicone elastomer base and a cure agent, to form a curable fluorosilicone elastomer composition. The stabilizer comprises B1) yellow iron oxide, and B2) optionally, an acid acceptor. The method further comprises II) vulcanizing the fluorosilicone elastomer composition containing the stabilizer.

Disclosed are magnetic nanoparticles and methods of using magnetic nanoparticles for selectively removing biologics, small molecules, analytes, ions, or other molecules of interest from liquids.

A heat resistant silicone rubber composition containing greater than or equal to 0.1 mass % each of titanium oxide and iron oxide is disclosed. The heat resistant silicone rubber composition can form a heat resistant silicone rubber suitable for use in a high temperature environment. A method of reducing formaldehyde and/or low molecular weight organopolysiloxane generated from a cured product of a heat resistant silicone rubber composition upon heating the cured product is also disclosed. The method comprises compounding greater than or equal to 0.1 mass % each of titanium oxide and iron oxide in the heat resistant silicone rubber composition. Generally, even when the cured product is heated to a high temperature, such as a temperature greater than or equal to 300° C., generation of formaldehyde and/or low molecular weight organopolysiloxane (e.g. D4, D5, and D6) from the cured product can be reduced.

A heat resistant silicone rubber composition containing greater than or equal to 0.1 mass % each of titanium oxide and iron oxide is disclosed. The heat resistant silicone rubber composition can form a heat resistant silicone rubber suitable for use in a high temperature environment. A method of reducing formaldehyde and/or low molecular weight organopolysiloxane generated from a cured product of a heat resistant silicone rubber composition upon heating the cured product is also disclosed. The method comprises compounding greater than or equal to 0.1 mass % each of titanium oxide and iron oxide in the heat resistant silicone rubber composition. Generally, even when the cured product is heated to a high temperature, such as a temperature greater than or equal to 300° C., generation of formaldehyde and/or low molecular weight organopolysiloxane (e.g. D4, D5, and D6) from the cured product can be reduced.

To provide a composition for an acoustic wave probe which can significantly improve the hardness and the mechanical strength (tensile strength at break, tensile elongation at break, tear strength, and abrasion resistance) of a silicone resin while maintaining a low acoustic attenuation, a silicone resin for an acoustic wave probe and the acoustic wave probe using the composition for an acoustic wave probe, an acoustic wave measurement apparatus, and an ultrasound diagnostic apparatus.

To provide an ultrasound probe in which cMUT is used as an ultrasonic diagnostic transducer, and the composition for an acoustic wave probe and the silicone resin for an acoustic wave probe which can improve the sensitivity of the photoacoustic wave measurement apparatus and the ultrasound endoscope.

Provided are a composition for an acoustic wave probe containing a polysiloxane mixture containing polysiloxane having a vinyl group, polysiloxane having two or more Si—H groups in a molecular chain, and one or more inorganic compound particles, in which the average primary particle diameter of the inorganic compound particles is less than 25 nm and the inorganic compound particles are selected from the group consisting of magnesium oxide, titanium oxide, iron oxide, zinc oxide, zirconium oxide, barium oxide, tin oxide, and ytterbium oxide; a silicone resin for an acoustic wave probe; an acoustic wave probe; an acoustic wave measurement apparatus; an ultrasound diagnostic apparatus; an ultrasound probe; a photoacoustic wave measurement apparatus; and an ultrasound endoscope.