A heat regenerating material particle according to an embodiment includes a plurality of heat regenerating substance particles having a maximum volume specific heat value of 0.3 J/cm.sup.3.Math.K or more at a temperature of 20 K or lower, and a binder bonding the heat regenerating substance particles, the binder containing water insoluble resin. The heat regenerating material particle has a particle diameter of 500 m or less.

Provided are: a thermal bonding sheet suitable for actually providing sinter bonding between bonding targets while reducing misalignment of the bonding targets, and a dicing tape with such a thermal bonding sheet. This thermal bonding sheet includes a pressure-sensitive adhesive layer including sinterable particles containing a conductive metal. The pressure-sensitive adhesive layer has a shear bond strength of 0.1 MPa or more determined at 70 C. with respect to a silver plane to which the pressure-sensitive adhesive layer as a 5-mm square piece has been compression-bonded under compression bonding conditions of 70 C., 0.5 MPa, and 1 second. The thermal bonding sheet-associated dicing tape includes a dicing tape and the thermal bonding sheet. The dicing tape has a multilayer structure including a base and a pressure-sensitive adhesive layer. The thermal bonding sheet is disposed on the pressure-sensitive adhesive layer of the dicing tape.

Oxidation-resistant electrically-conductive metal particles (ORCMP) are disclosed. ORCMPs are comprised of a base-metal core, an oxidation-resistant first shell, and an optional conductive second shell. ORCMPs are low cost alternatives to silver particles in metal fillers for low-temperature, electrically-conductive adhesives. Adhesives including ORCMPs, organic vehicles, and optional conductive metal particles such as silver were formulated to yield conductive films upon curing at low temperatures. Such films can be used in many electronic devices where low-temperature, low cost films are needed.

Provided are materials having antimicrobial properties. The materials include a polymer having incorporated therein a synergistic combination of at least two metal oxide powders, including a mixed oxidation state oxide of a first metal and a single oxidation state oxide of a second metal. The powders may be incorporated substantially uniformly within the polymer. Further, the powders may have substantially different specific gravities and substantially similar bulk densities. In addition, the ions of the metal powders may be in ionic contact upon exposure of the material to moisture. Also provided are methods for the preparation of the materials and uses thereof, including in combating or inhibiting the activity of microbes or microorganisms.

A method for nanomaterial formation and distribution within a matrix material that includes: preparing a gel matrix; patterning a reactive group within the matrix material; binding a seed material to reactive group within the matrix material, the seed material selected from a first set of gold nanomaterials, silver nanomaterials, and copper nanomaterials; binding a precursor reagent selected from materials to the seed material; adding a chalcogen to form a precursor reagent chalcogenide at sites of the precursor reagent via an ion exchange; adding final compound and optionally a ligand in solution and facilitating cation exchange replacing the precursor reagent chalcogenide with the final compound to form a nanomaterial within the matrix material.

The present disclosure relates to an antimicrobial coating on a surface, a method for preparing and uses of the same. In particular it relates to a process for preparing an antimicrobial coating on a surface, the process comprising the steps of: a) providing a surface; b) coating a metal oxide or a metal hydroxide on the surface in the presence of a solvent in a hydrothermal synthesis step to form a coated surface having a plurality of nanostructures; c) optionally drying the coated surface, wherein said nanostructure is preferably in nanopillar structure. The coating of the present application exhibits excellent antimicrobial activity against different types of microorganism, such as bacteria and yeast. The nanostructures are able to exert stress to the microorganism, and therefore controlling or killing them.

A sheet for thermal bonding which has a tensile modulus of 10 to 3,000 MPa and contains fine metal particles in an amount in the range of 60-98 wt % and which, when heated from 23 C. to 400 C. in the air at a heating rate of 10 C./min and then examined by energy dispersive X-ray spectrometry, has a carbon concentration of 15 wt % or less.

Provided is a thermal bonding sheet capable of preventing bonding irregularity by uniform thickness, and imparting the bonding reliability at high temperatures, and a thermal bonding sheet with dicing tape having the thermal bonding sheet. A thermal bonding sheet includes a precursor layer that is to become a sintered layer by heating, and the precursor layer has an average thickness of 5 m to 200 m, and a maximum thickness and a minimum thickness falling within a range of 20% of the average thickness. A thermal bonding sheet includes a precursor layer that is to become a sintered layer by heating, and the precursor layer has an average thickness of 5 m to 200 m, and a surface roughness Sa measured in a field of view of 200 m200 m by a confocal microscope of 2 m or less.

A thermal bonding sheet includes a layer, in which an average area of a pore portion in a cross section of the layer after being heated at a heating rate of 1.5 C./sec from 80 C. to 300 C. under pressure of 10 MPa, and then held at 300 C. for 2.5 minutes is in a range of 0.005 m.sup.2 to 0.5 m.sup.2.

A problem is to provide a sheet having a pre-sintering layer, the thickness of which following sintering is such as to be capable of relieving stresses. Solution means relate to a sheet comprising a pre-sintering layer. Viscosity at 90 C. of the pre-sintering layer is not less than 0.27 MPa.Math.s. Thickness of the pre-sintering layer is 30 m to 200 m.