Patent classifications
C08K2003/267
THERMOPLASTIC POLYMER COMPOSITION AND METHOD FOR MOLDING THE SAME
A thermoplastic polymer composition comprises a polyethylene polymer composition and a salt of bicyclo[2.2.1]heptane-2,3-dicarboxylic acid. The polyethylene polymer composition can have a Melt Relaxation Ratio of 1.5 or greater. A method for molding a thermoplastic polymer composition comprises the steps of (a) providing an apparatus comprising a die and a mold cavity; (b) providing the thermoplastic polymer composition described above; (c) heating the thermoplastic polymer composition to melt the thermoplastic polymer composition; (d) extruding the molten thermoplastic polymer composition through the die to form a parison; (e) capturing the parison in the mold cavity; (f) blowing a pressurized fluid into the parison to inflate the parison and conform it to the interior surface of the mold cavity; (g) allowing the molded article to cool so that the molded article retains its shape; and (h) removing the molded article from the mold cavity.
METHOD FOR PRODUCING THIXOTROPIC CURABLE SILICONE COMPOSITION
A method for producing a thixotropic curable silicone composition is provided. The curable silicone composition comprises: (A) a silicone base material comprising: an organopolysiloxane having at least two alkoxysilyl-containing groups per molecule and a filler other than fumed silica; (B) a hydrophobic fumed silica; (C) a carbasilatrane derivative; (D) an alkoxysilane or its partial hydrolysis and condensation product; and (E) a condensation reaction catalyst. The method comprises the following steps: (I) mixing components (A) and (B); (II) mixing component (C) with a mixture obtained by step (I); and (III) mixing components (D) and (E) with a mixture obtained by step (II) under free of moisture. The curable silicone composition obtained by the method has an excellent thixotropic property and can cure at room temperature by contact with moisture in air.
Benzothiazol-2-ylazo-phenyl compound as dye, compositions including the dye, and method of determining degree of cure of such compositions
A compound represented by formula: is disclosed. R is hydrogen or alkyl; X is alkylene; Y is a bond, ether, thioether, amine, amide, ester, thioester, carbonate, thiocarbonate, carbamate, thiocarbamate, urea, thiourea, alkylene, arylalkylene, alkylarylene, or arylene, wherein alkylene, arylalkylene, alkylarylene, and arylene are optionally at least one of interrupted or terminated by at least one of an ether, thioether, amine, amide, ester, thioester, carbonate, thiocarbonate, carbamate, thiocarbamate, urea, or thiourea; and Z is an acrylate, a methacrylate, an acrylamide, a methacrylamide, a styrenyl, or a terminal alkenylene having at least three carbon atoms. A composition including the compound, and a method of determining the degree of cure of a curable polymeric resin are also disclosed. ##STR00001##
Digital glaze ink
The present invention relates to a digital GLAZE ink, to the method for the preparation thereof and to the use of the digital GLAZE ink for functional and/or decorative coating of a ceramic and/or metallic material.
PURGING AGENT
A purging agent that has excellent purging performance without generation of aggregate is disclosed as a purging agent used in a purging operation where a resin to be processed contains a polar group-containing thermoplastic resin. This purging agent contain a hydrocarbon-based resin, and at least one metal salt among an alkaline metal salt and alkaline earth metal salt, has a water content of 0.15% by weight or less, and includes 0.1 to 20% by weight of the metal salt expressed as the metal relative to the hydrocarbon-based resin.
POLYETHYLENE OR POLYPROPYLENE ARTICLES
An article in the form of a pipe, cable or geomembrane comprising polyethylene or polypropylene, and components A) and B), wherein component A) is a hindered amine light stabilizer containing a triazine residue, component B) is magnesium hydroxide which is present in an amount of 0.01% to 5% by weight relative to the weight of the polyethylene or polypropylene, and the weight ratio of component A) to component B) is 1:50 to 50:1, with the proviso that component B) is not a hydrotalcite.
HYBRID SILICONE COMPOSITE FOR HIGH TEMPERATURE APPLICATIONS
A hybrid silicone composite for high temperature insulation applications is disclosed. The hybrid silicone composite is formed of a mixture of liquid high consistency silicone rubber and solid high consistency silicone rubber and a thermally decomposable inorganic filler which are compounded together. The compounded material is then injection molded, over molded, compression molded, cast, laminated, extruded, calendered, adhered or dispensed. When the silicone composite is exposed to a high temperature, it forms an inorganic composite and maintains its insulating properties and dimensional stability.
Composition for manufacturing lightweight footwear having improved heat-resistance and lightweight footwear manufactured using the same
The lightweight footwear of the present invention maintains excellent durability and improves heat resistance, so that contraction percentage due to a change with the passage of time is significantly low, rarely causing deformation, and thus, the lightweight footwear may be used in a high temperature and sanitary environment. In addition, the present invention solves the problem of the occurrence of premature foaming due to injection molding and a pattern on the appearance due to dispersion failure, thereby facilitating injection molding.
FLUORORUBBER COMPOSITION AND MOLDED ARTICLE
A fluoroelastomer composition containing (a) a polyol-crosslinkable fluoroelastomer, (b) a cross-linking agent for polyol crosslinking, (c) a crosslinking accelerator; and (d) at least one acid acceptor selected from basic magnesium carbonate and magnesium phosphate, wherein the content of a divalent metal oxide is lower than 1 part by mass with respect to 100 parts by mass of the fluoroelastomer (a). Also disclosed is a molded article obtained by crosslinking the fluoroelastomer composition.
Silicone composite for high temperature applications
A silicone composite for high temperature insulation applications is disclosed. The composite is formed of a silicone and a thermally decomposable inorganic filler which are compounded together. The compounded material is then injection molded, overmolded, compression molded, cast, laminated, extruded, or dispensed. When the silicone composite is exposed to a high temperature, it forms an inorganic composite and maintains its insulating properties and dimensional stability.