This disclosure describes polymerization processes and processes for quenching polymerization reactions using reactive particulates, such as high molecular weight functionalized olefin copolymers, as quenching agents, typically in solution or bulk polymerization processes.

Provided is a polyamide resin composition which comprises a polyamide resin (A) and an impact-resistant material (B), wherein the polyamide resin (A) comprises an aliphatic copolyamide (A-1) comprising three or more types of monomers and an aliphatic polyamide (A-2), wherein the content of the aliphatic copolyamide (A-1) in the polyamide resin composition is 1% by mass to 30% by mass.

Provided is a polyamide resin composition which comprises a polyamide resin (A) and an impact-resistant material (B), wherein the polyamide resin (A) comprises an aliphatic copolyamide (A-1) comprising three or more types of monomers and an aliphatic polyamide (A-2), wherein the content of the aliphatic copolyamide (A-1) in the polyamide resin composition is 1% by mass to 30% by mass.

Peroxide masterbatch comprising: 15-55 wt % of one or more organic peroxides, 15-45 wt % of one or more copolymers of at least two different monomers, the first monomer being ethylene or propylene, the second monomer being a vinyl monomer comprising at least four carbon atoms and optionally heteroatoms, 6-70 wt % of at least two filler typesfiller type 1 and filler type 2each having a different BET surface area: (i) filler type 1 being present in the masterbatch in a concentration of 3-30 wt % and having a BET surface area of more than 100 m.sup.2/g; (ii) filler type 2 being present in the masterbatch in a concentration of 3-40 wt % and having a BET surface area of 100 m.sup.2/g or less; wherein the masterbatch has the form of extrudates.

Peroxide masterbatch comprising: 15-55 wt % of one or more organic peroxides, 15-45 wt % of one or more copolymers of at least two different monomers, the first monomer being ethylene or propylene, the second monomer being a vinyl monomer comprising at least four carbon atoms and optionally heteroatoms, 6-70 wt % of at least two filler typesfiller type 1 and filler type 2each having a different BET surface area: (i) filler type 1 being present in the masterbatch in a concentration of 3-30 wt % and having a BET surface area of more than 100 m.sup.2/g; (ii) filler type 2 being present in the masterbatch in a concentration of 3-40 wt % and having a BET surface area of 100 m.sup.2/g or less; wherein the masterbatch has the form of extrudates.

Provided is a polyamide-based composite resin composition which includes 30 to 80 wt % of a polyamide-based resin; 5 to 59 wt % of m-xylenediamine (MXD)-based modified nylon; 10 to 50 wt % of thermoplastic olefin rubber including a maleic anhydride-grafted ethylene-octene copolymer, a maleic anhydride-grafted ethylene-propylene-diene monomer, or a mixture thereof; 0.5 to 10 wt % of clay; and 0.01 to 5 wt % of carbon nanotubes (CNTs). According to the present invention, the polyamide-based composite resin composition is easily subjected to blow molding, is excellent in mechanical properties such as low-temperature impact strength and tensile strength, and is also capable of significantly enhancing a gas barrier property.

A heat-shrinkable film comprises a blend of 35-75 wt % of an ethylene-based polymer, 10-45 wt % of an ethylene/unsaturated ester copolymer, and 5-30 wt % of a plastomer, with the blend making up at least 20 wt % of the film. The ethylene-based polymer has a peak melt point 95 C. The plastomer has a peak melt point 90 C. and a melt index of 1.1 g/10 min. The film comprises a cross-linked polymer network which has been strained by solid state orientation. The film has a total free shrink at 85 C. of at least 90% and an energy-to-break of at least 0.70 J/mil.

A heat-shrinkable film comprises a blend of 35-75 wt % of an ethylene-based polymer, 10-45 wt % of an ethylene/unsaturated ester copolymer, and 5-30 wt % of a plastomer, with the blend making up at least 20 wt % of the film. The ethylene-based polymer has a peak melt point 95 C. The plastomer has a peak melt point 90 C. and a melt index of 1.1 g/10 min. The film comprises a cross-linked polymer network which has been strained by solid state orientation. The film has a total free shrink at 85 C. of at least 90% and an energy-to-break of at least 0.70 J/mil.

The invention relates to a nontacky film-forming polymer composition (cover material), and tacky hot melt adhesives in the form of pellets which are coated with the polymer composition and producible by coextruding the hot melt adhesive and the cover material. The film-forming composition comprises 5 to 40% by weight of at least one Fischer-Tropsch wax having a melting point of >95 C. and 30 to 70% by weight of at least one metallocene-catalyzed polyolefin having a softening point of >95 C. and a melt flow index (MFI) (230 C., 2.16 kg) of 1000 and 300 g/10 minutes. The invention further relates to suitable uses for such hot melt adhesives, methods for their use, and products containing these adhesives.

A polyethylene composition includes a first polyethylene which is an ethylene copolymer having a weight average molecular weight of from 70,000 to 250,000 and a molecular weight distribution M.sub.w/M.sub.n of <2.3, a second polyethylene which is an ethylene copolymer or homopolymer having a weight average molecular weight of from 15,000 to 100,000 and a molecular weight distribution M.sub.w/M.sub.n of <2.3, and a third polyethylene which is an ethylene copolymer or homopolymer having a weight average molecular weight of from 70,000 to 250,000 and a molecular weight distribution M.sub.w/M.sub.n of >2.3, where the first polyethylene has more short chain branching than the second polyethylene or the third polyethylene. The polyethylene composition has a soluble fraction in a CEF analysis of at least 10 weight percent. Film made from the polyethylene composition may have a machine direction 1% secant modulus of 190 MPa (at a film thickness of about 1 mil), a seal initiation temperature (SIT) of 100 C. (at a film thickness of about 2 mil), an area of hot tack window (AHTW) of 160 Newtons.Math.C (at a film thickness of about 2 mil) and an oxygen transmission rate (OTR) of 650 cm.sup.3 per 100 inch.sup.2 (at a film thickness of about 1 mil).