Patent classifications
C08L23/0846
Multilayer heat shrinkable films
The present invention relates to a polymer blend and to multilayer heat shrinkable films containing at least a layer made of said polymer blend, to flexible containers made of said film, such as bags, pouches and the like, useful for packaging articles, in particular food items. The invention also relates to a process for the manufacturing of such multilayer heat shrinkable films.
Laser marking additive
A laser marking additive including a bismuth compound and a polyol. The laser marking additive can be directly added to a matrix polymer to prepare a laser markable composition, or the laser marking additive can be added to a polymer to prepare a masterbatch, which can be added to a matrix polymer. Preferred polyols are PEG, and polyols having at least 3 hydroxy groups.
POLYMER COMPOSITION FOR PHOTOVOLTAIC APPLICATIONS
The present invention relates to a polymer composition, to an article comprising the polymer composition, preferably to an article which is a photovoltaic (PV) module comprising at least one layer element (LE) comprising the polymer composition and to a process for producing said article, preferably said photovoltaic (PV) module.
POLYMER COMPOSITION FOR PHOTOVOLTAIC APPLICATIONS
The present invention relates to a polymer composition, to an article comprising the polymer composition, preferably to an article which is a photovoltaic (PV) module comprising at least one layer element (LE) comprising the polymer composition and to a process for producing said article, preferably said photovoltaic (PV) module.
MELT-FORMABLE ETHYLENE-VINYL ALCOHOL COPOLYMER COMPOSITION, PELLETS, AND MULTILAYER STRUCTURE
A melt-formable ethylene-vinyl alcohol copolymer composition and a multilayer structure are substantially free from heat coloration. The melt-formable ethylene-vinyl alcohol copolymer composition contains: (A) an ethylene-vinyl alcohol copolymer; (B) an alkali earth metal compound; and (C) an iron compound; wherein the iron compound (C) is present in an amount of 0.01 to 20 ppm on a metal basis based on the weight of the ethylene-vinyl alcohol copolymer composition.
ETHYLENE-VINYL ALCOHOL COPOLYMER COMPOSITION AND PREPARATION METHOD THEREFOR
Provided are an ethylene-vinyl alcohol copolymer composition and a preparation method therefor. The composition includes an ethylene-vinyl alcohol copolymer, an alkali metal element and a carboxyl-containing material, characterized in that the carboxyl-containing material includes a mono-saturated carboxylic acid and a carboxylic acid containing a carbon-carbon double bond. The present invention can improve the yellowing resistance of an EVOH resin composition by making the EVOH resin composition contain both acetic acid and a carboxylic acid containing a carbon-carbon double bond. After heat treatment at 210 C. for 0.5 h, the yellowing index YI does not exceed 20 and the increase does not exceed 15.
Multiphase Conductive Polymer Composite Compositions
A composition comprises a ternary-phase polymer composite including components (A) ethylene/unsaturated ester copolymers having .sup. of from <5 to >1 mN/m; at least two additional polymers selected from the group consisting of: (B)non-polar polymers having .sup. of from >0 to <1 mN/m selected from the group consisting of polyethylene homopolymers, silane-functionalized polyethylene homopolymers, ethylene/alpha-olefin copolymers, and silane-functionalized ethylene/alpha-olefin copolymers, (C) ethylene/unsaturated ester copolymers having a .sup.P of >5 mN/m, and (D) EPDM copolymers; and conductive filler dispersed in only one of (A) and the at least two additional polymers, wherein (i) one of the at least two additional polymers is selected from (B) and the other is selected from (C) or (D), or (ii) one of the at least two additional polymers is selected from (C) and the other is selected from (B) or (D).
Multiphase Conductive Polymer Composite Compositions
A composition comprises a ternary-phase polymer composite including components (A) ethylene/unsaturated ester copolymers having .sup. of from <5 to >1 mN/m; at least two additional polymers selected from the group consisting of: (B)non-polar polymers having .sup. of from >0 to <1 mN/m selected from the group consisting of polyethylene homopolymers, silane-functionalized polyethylene homopolymers, ethylene/alpha-olefin copolymers, and silane-functionalized ethylene/alpha-olefin copolymers, (C) ethylene/unsaturated ester copolymers having a .sup.P of >5 mN/m, and (D) EPDM copolymers; and conductive filler dispersed in only one of (A) and the at least two additional polymers, wherein (i) one of the at least two additional polymers is selected from (B) and the other is selected from (C) or (D), or (ii) one of the at least two additional polymers is selected from (C) and the other is selected from (B) or (D).
USE OF AT LEAST ONE PHENOLIC COMPOUND TO STABILISE ETHYLENE COPOLYMERISATION REACTIONS
The present invention relates to the use of one or more phenolic compounds, as defined below, to stabilise ethylene copolymer reactions at high pressure.
The invention also relates to a method of preparing an ethylene copolymer at high pressure in the presence of one or more phenolic compounds, as defined below, and one or more initiators.
USE OF AT LEAST ONE PHENOLIC COMPOUND TO STABILISE ETHYLENE COPOLYMERISATION REACTIONS
The present invention relates to the use of one or more phenolic compounds, as defined below, to stabilise ethylene copolymer reactions at high pressure.
The invention also relates to a method of preparing an ethylene copolymer at high pressure in the presence of one or more phenolic compounds, as defined below, and one or more initiators.