It is provided that a particulate hydrophilic resin that can be produced under mild conditions, and that has a small load on the environment. A resin particle comprising a crosslinked structure in which at least one of monomers represented by the following general formula (1) and a polyfunctional ethylenically unsaturated monomer are crosslinked,

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wherein R.sup.1 represents an alkyl group having 1 to 4 carbon atoms, a hydrogen atom, an alkali metal atom, or an ammonium.

The present invention relates to a thermally crosslinkable composition comprising an acid-modified polymer A having a melting point of 110 to 150° C. and a crystallization temperature of 50 to 90° C., an acid-modified polymer B having a melting point of 30 to 110° C. and a crystallization temperature of lower than 50° C., a tackifier resin, and a curing agent, wherein the thermally crosslinkable composition has a crystallization temperature of 30 to 70° C.

The present invention relates to a thermally crosslinkable composition comprising an acid-modified polymer A having a melting point of 110 to 150° C. and a crystallization temperature of 50 to 90° C., an acid-modified polymer B having a melting point of 30 to 110° C. and a crystallization temperature of lower than 50° C., a tackifier resin, and a curing agent, wherein the thermally crosslinkable composition has a crystallization temperature of 30 to 70° C.

A clear binder, in divided form, that is solid when cold, and to the different ways in which it is formed. Also, the method for transporting and/or storing and/or handling the binder, as well as to the uses of the binder for road and/or industrial applications.

A clear binder, in divided form, that is solid when cold, and to the different ways in which it is formed. Also, the method for transporting and/or storing and/or handling the binder, as well as to the uses of the binder for road and/or industrial applications.

Provided are a thermosetting resin composition, and a prepreg, a laminate and a printed circuit board using same. The thermosetting resin composition comprises a resin component comprising a modified cycloolefin copolymer and other unsaturated resins. The modified cycloolefin copolymer is a reaction product of maleic anhydride and a cycloolefin copolymer; the cycloolefin copolymer is a copolymerization product of a monomer A and a monomer B; the monomer A is selected from one of or a combination of at least two of norbornene, cyclopentadiene, dicyclopentadiene, tricyclopentadiene, and (I); and the monomer B is selected from one of or a combination of at least two of C2-C3 olefins and C2-C3 alkynes. The laminate prepared by using the provided thermosetting resin composition has good dielectric properties, peel strength and thermal resistance, and can satisfy the current requirements of properties for printed circuit board substrates in the field of high-frequency and high-speed communications.

Provided are a thermosetting resin composition, and a prepreg, a laminate and a printed circuit board using same. The thermosetting resin composition comprises a resin component comprising a modified cycloolefin copolymer and other unsaturated resins. The modified cycloolefin copolymer is a reaction product of maleic anhydride and a cycloolefin copolymer; the cycloolefin copolymer is a copolymerization product of a monomer A and a monomer B; the monomer A is selected from one of or a combination of at least two of norbornene, cyclopentadiene, dicyclopentadiene, tricyclopentadiene, and (I); and the monomer B is selected from one of or a combination of at least two of C2-C3 olefins and C2-C3 alkynes. The laminate prepared by using the provided thermosetting resin composition has good dielectric properties, peel strength and thermal resistance, and can satisfy the current requirements of properties for printed circuit board substrates in the field of high-frequency and high-speed communications.

A composition for extrusion and deposition by a three-dimensional (3D) printer is provided. The composition comprises a thermoplastic elastomer (TPE), particulate matter having particles in the range of about 5 nm to about 10 μm in diameter, and a solvent. Uses of the composition for 3D printing microstructures, including multiwall plate devices, are also provided.

A composition for extrusion and deposition by a three-dimensional (3D) printer is provided. The composition comprises a thermoplastic elastomer (TPE), particulate matter having particles in the range of about 5 nm to about 10 μm in diameter, and a solvent. Uses of the composition for 3D printing microstructures, including multiwall plate devices, are also provided.

Asphalt modifier packages and rubber-modified asphalts including the packages are described. Asphalt modifier packages can include an amine functionalized wax and an elastomeric polymer in conjunction with ground tire rubber. Asphalt modifiers can include a ground tire rubber compounded with a reactive elastomeric terpolymer. Rubber-modified asphalts can exhibit an excellent stability of the ground tire rubber additive. Rubber-modified asphalts can exhibit a storage stability separation factor of about 6° F. or less, an MSCR J.sub.nr value of from about 0.05 to about 2 at 3.2 kPa and 67° C., and an MSCR percent recovery of from about 20% to about 75% at 3.2 kPa and 67° C.