A resin composition includes a prepolymer and an additive, wherein: the prepolymer is prepared from a mixture subjected to a prepolymerization reaction, and the mixture includes 100 parts by weight of a maleimide resin, 15 to 30 parts by weight of a siloxane compound and 4 to 16 parts by weight of a diamine compound; the maleimide resin includes bisphenol A diphenyl ether bismaleimide, 3,3′-dimethyl-5,5′-diethyl-4,4′-diphenylmethane bismaleimide or a combination thereof; the siloxane compound includes a compound of Formula (I), wherein n is an integer of 5 to 40; and the diamine compound includes a compound of Formula (II) or Formula (III). The resin composition is made by using a preparation method. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following properties can be improved, including dissipation factor, X-axis coefficient of thermal expansion, copper foil peeling strength, varnish precipitation property and resin compatibility.

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A resin composition includes a prepolymer and an additive, wherein: the prepolymer is prepared from a mixture subjected to a prepolymerization reaction, and the mixture includes 100 parts by weight of a maleimide resin, 15 to 30 parts by weight of a siloxane compound and 4 to 16 parts by weight of a diamine compound; the maleimide resin includes bisphenol A diphenyl ether bismaleimide, 3,3′-dimethyl-5,5′-diethyl-4,4′-diphenylmethane bismaleimide or a combination thereof; the siloxane compound includes a compound of Formula (I), wherein n is an integer of 5 to 40; and the diamine compound includes a compound of Formula (II) or Formula (III). The resin composition is made by using a preparation method. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following properties can be improved, including dissipation factor, X-axis coefficient of thermal expansion, copper foil peeling strength, varnish precipitation property and resin compatibility.

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Provided are a polyamide/polyphenylene ether resin composition that has excellent fluidity, heat resistance, and surface impact strength while also having excellent repeated processability and a shaped product that includes this resin composition. The resin composition contains: (a) a polyamide; (b) a polyphenylene ether; (c) a compatibilizer for the (a) polyamide and the (b) polyphenylene ether; and (d) a polyhydric alcohol including at least two hydroxyl groups and having a number-average molecular weight (Mn) of less than 500. The content of the (d) polyhydric alcohol is 0.3 parts by mass to 5 parts by mass relative to 100 parts by mass, in total, of the (a) polyamide and the (b) polyphenylene ether. A ratio of terminal amino group concentration relative to terminal carboxyl group concentration (terminal amino group concentration/terminal carboxyl group concentration) in the (a) polyamide is 0.3 to 0.5. The (a) polyamide forms a continuous phase.

Provided are a polyamide/polyphenylene ether resin composition that has excellent fluidity, heat resistance, and surface impact strength while also having excellent repeated processability and a shaped product that includes this resin composition. The resin composition contains: (a) a polyamide; (b) a polyphenylene ether; (c) a compatibilizer for the (a) polyamide and the (b) polyphenylene ether; and (d) a polyhydric alcohol including at least two hydroxyl groups and having a number-average molecular weight (Mn) of less than 500. The content of the (d) polyhydric alcohol is 0.3 parts by mass to 5 parts by mass relative to 100 parts by mass, in total, of the (a) polyamide and the (b) polyphenylene ether. A ratio of terminal amino group concentration relative to terminal carboxyl group concentration (terminal amino group concentration/terminal carboxyl group concentration) in the (a) polyamide is 0.3 to 0.5. The (a) polyamide forms a continuous phase.

A resin composition includes a first prepolymer and a second prepolymer, the first prepolymer being prepared from a first mixture subjected to a prepolymerization reaction, the second prepolymer being prepared from a second mixture subjected to a prepolymerization reaction, wherein the first mixture includes a maleimide resin and a benzoxazine resin, and the second mixture includes a maleimide resin and a bis(trifluoromethyl)benzidine. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following properties can be improved, including copper foil peeling strength, dissipation factor, ratio of thermal expansion, cure shrinkage and glass transition temperature.

A resin composition includes a first prepolymer and a second prepolymer, the first prepolymer being prepared from a first mixture subjected to a prepolymerization reaction, the second prepolymer being prepared from a second mixture subjected to a prepolymerization reaction, wherein the first mixture includes a maleimide resin and a benzoxazine resin, and the second mixture includes a maleimide resin and a bis(trifluoromethyl)benzidine. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following properties can be improved, including copper foil peeling strength, dissipation factor, ratio of thermal expansion, cure shrinkage and glass transition temperature.

Adhesive tapes include a plasticized polyvinyl chloride backing, a primer including an ethylene/carbon monoxide-containing terpolymer and a styrene-containing block copolymer and an epoxidized polymer, and an adhesive.

Adhesive tapes include a plasticized polyvinyl chloride backing, a primer including an ethylene/carbon monoxide-containing terpolymer and a styrene-containing block copolymer and an epoxidized polymer, and an adhesive.

Disclosed herein are pressure sensitive adhesive compositions that can include a styrene-butadiene rubber latex and a tackifier agent. In another example, the pressure sensitive adhesive compositions can include a styrene-butadiene rubber latex and acrylic polymer. The adhesive compositions can further include mineral oil and ethylene propylene diene monomer rubber. The pressure sensitive adhesives compositions can have a have low volatile organic compound vapor pressures while having effective adhesion properties on low surface energy substrates.

Disclosed herein are pressure sensitive adhesive compositions that can include a styrene-butadiene rubber latex and a tackifier agent. In another example, the pressure sensitive adhesive compositions can include a styrene-butadiene rubber latex and acrylic polymer. The adhesive compositions can further include mineral oil and ethylene propylene diene monomer rubber. The pressure sensitive adhesives compositions can have a have low volatile organic compound vapor pressures while having effective adhesion properties on low surface energy substrates.