Patent classifications
C08L25/10
THERMOPLASTIC RESIN COMPOSITION AND MOLDED ARTICLE INCLUDING THE SAME
The present invention relates to a thermoplastic resin composition. More particularly, the present invention relates a thermoplastic resin composition including 100 parts by weight of a base resin including (a) an aromatic vinyl compound-conjugated diene-based compound-vinyl cyan compound copolymer and (b) an aromatic vinyl compound-vinyl cyan compound copolymer; and (c) greater than 0.05 parts by weight and less than 11 parts by weight of a polyolefin oxide-based triblock copolymer, and a molded article including the same. In accordance with the present invention, the thermoplastic resin composition having superior chemical resistance and paintability with identical or superior impact strength, fluidity, and heat resistance, to conventional thermoplastic resin compositions, and a molded article including the same are provided.
OLIGOMER, COMPOSITION AND COMPOSITE MATERIAL EMPLOYING THE SAME
An oligomer, composition, and composite material employing the same are provided. The oligomer can be a reaction product of a reactant (a) and a reactant (b). The reactant (a) is a reaction product of a reactant (c) and a reactant (d). The reactant (b) can be
##STR00001##
or a combination thereof, wherein a is 0 or 1, and R.sup.1 is independently hydrogen
##STR00002##
or and wherein b is 0-6; c is 0 or 1; and, d is 0-6. The reactant (c) is
##STR00003##
wherein R.sup.2 is C.sub.5-10 alkyl group. The reactant (d) is
##STR00004##
wherein e is 0-10.
OLIGOMER, COMPOSITION AND COMPOSITE MATERIAL EMPLOYING THE SAME
An oligomer, composition, and composite material employing the same are provided. The oligomer can be a reaction product of a reactant (a) and a reactant (b). The reactant (a) is a reaction product of a reactant (c) and a reactant (d). The reactant (b) can be
##STR00001##
or a combination thereof, wherein a is 0 or 1, and R.sup.1 is independently hydrogen
##STR00002##
or and wherein b is 0-6; c is 0 or 1; and, d is 0-6. The reactant (c) is
##STR00003##
wherein R.sup.2 is C.sub.5-10 alkyl group. The reactant (d) is
##STR00004##
wherein e is 0-10.
POLY(PHENYLENE ETHER) COMPOSITION, METHOD FOR THE MANUFACTURE THEREOF, AND ARTICLES MADE THEREFROM
A poly(phenylene ether) composition includes specific amounts of a poly(phenylene ether)-poly(siloxane) block copolymer reaction product including a poly(phenylene ether)-poly(siloxane) block copolymer and a poly(phenylene ether), an organophosphate ester, a reinforcing filler including glass fibers, an impacted modifier that is a high impact polystyrene, a hydrogenated block copolymer of an alkenyl aromatic and a conjugated diene, or a combination thereof, and, optionally, a second poly(phenylene ether).
POLY(PHENYLENE ETHER) COMPOSITION, METHOD FOR THE MANUFACTURE THEREOF, AND ARTICLES MADE THEREFROM
A poly(phenylene ether) composition includes specific amounts of a poly(phenylene ether)-poly(siloxane) block copolymer reaction product including a poly(phenylene ether)-poly(siloxane) block copolymer and a poly(phenylene ether), an organophosphate ester, a reinforcing filler including glass fibers, an impacted modifier that is a high impact polystyrene, a hydrogenated block copolymer of an alkenyl aromatic and a conjugated diene, or a combination thereof, and, optionally, a second poly(phenylene ether).
Rubber composition comprising a polyphenylene ether resin as plasticizer
A rubber composition is based on at least one predominant vinylaromatic diene elastomer, a reinforcing filler, a crosslinking system and a thermoplastic resin comprising optionally substituted polyphenylene ether units, said resin having a compatibility with said vinylaromatic diene elastomer such that a mixture of said vinylaromatic diene elastomer and said resin creates a composition having less than 10% of its volume in the form of particles greater than 2 micrometres in size. The rubber composition may be used in semi-finished tire articles and tires.
Rubber composition comprising a polyphenylene ether resin as plasticizer
A rubber composition is based on at least one predominant vinylaromatic diene elastomer, a reinforcing filler, a crosslinking system and a thermoplastic resin comprising optionally substituted polyphenylene ether units, said resin having a compatibility with said vinylaromatic diene elastomer such that a mixture of said vinylaromatic diene elastomer and said resin creates a composition having less than 10% of its volume in the form of particles greater than 2 micrometres in size. The rubber composition may be used in semi-finished tire articles and tires.
HIGH-PERFORMANCE TYRE
The present invention relates to a tyre for vehicle wheels, in particular automobile wheels, characterised by a tread comprising at least one iso-styrene/trans-butadiene/terpene random terpolymer. Said tread is characterised by a greater tear resistance and a greater grip of the tyre to the roadbed.
Thermosetting resin composition, prepreg, laminate, and printed circuit board
A thermosetting resin composition, a prepreg, a laminate, and a printed circuit board are provided. The thermosetting resin composition has a thermosetting polyphenylene ether resin, an unsaturated polyolefin resin, a curing agent, and hollow borosilicate microspheres with surfaces treated with a bromine-containing silane coupling agent. The laminate produced from the thermosetting resin composition satisfies the requirements for overall properties such as low dielectric constant, low dielectric loss, low water absorption rate, high peeling strength, and the like for a high-frequency electronic circuit substrate.
Thermosetting resin composition, prepreg, laminate, and printed circuit board
A thermosetting resin composition, a prepreg, a laminate, and a printed circuit board are provided. The thermosetting resin composition has a thermosetting polyphenylene ether resin, an unsaturated polyolefin resin, a curing agent, and hollow borosilicate microspheres with surfaces treated with a bromine-containing silane coupling agent. The laminate produced from the thermosetting resin composition satisfies the requirements for overall properties such as low dielectric constant, low dielectric loss, low water absorption rate, high peeling strength, and the like for a high-frequency electronic circuit substrate.