There are provided a syringe filled with a resin composition and a storage method thereof. According to the syringe and the storage method, mixed air, which causes the resin composition to be intermittently discharged from the syringe, is suppressed. The syringe filled with the resin composition includes a syringe, a resin composition filling the syringe, and a plunger. The resin composition contains voids. The ratio of the volume of the voids relative to the volume of the resin composition is 1.0 ppm by volume to 520 ppm by volume. The voids have a maximum diameter of 2,500 μm or less.

A polymer stabilized vertical alignment liquid crystal display (PS-VA LCD) panel and a method of manufacturing same. The PS-VA LCD panel includes a first substrate; a second substrate; a crystal layer disposed between the first substrate and the second substrate; a plurality of vesicles disposed around the crystal layer, wherein the vesicles includes a plurality of free radical inhibitors; and a sealant using for encapsulating the liquid crystal layer between the first substrate and the second substrate.

A polymer stabilized vertical alignment liquid crystal display (PS-VA LCD) panel and a method of manufacturing same. The PS-VA LCD panel includes a first substrate; a second substrate; a crystal layer disposed between the first substrate and the second substrate; a plurality of vesicles disposed around the crystal layer, wherein the vesicles includes a plurality of free radical inhibitors; and a sealant using for encapsulating the liquid crystal layer between the first substrate and the second substrate.

To provide a heat-dissipating resin composition, and cured product thereof, which can effectively transmit heat generated from a heat-generating part such as a semiconductor element or the like with a high heating value to an object such as a substrate, heat sink, shield can lid, housing, or the like, and reduce defects such as contact failure of a relay or connector, or the like. A heat-dissipating resin composition of an embodiment of the present disclosure includes: component (A): epoxy resin; component (B): curing agent for epoxy resin; component (C): (meth)acrylic oligomer with weight average molecular weight of 10,000 or less; and component (D): heat conductive particles.

A roofing formulation may comprise a first part and a second part. The first part may comprise a coating material, the coating material comprising at least one acrylic latex resin, at least one functional filler, and at least one hydrophobic additive. The second part may comprise an activator formulation. The roofing formulation may be applied as a coating to a roofing substrate. A roofing system may comprise at least one roof substrate and a multi-layer coating system. The multi-layer coating system may comprise at least one top layer and at least one core layer disposed between the at least one top layer and the at least one roof substrate.

A roofing formulation may comprise a first part and a second part. The first part may comprise a coating material, the coating material comprising at least one acrylic latex resin, at least one functional filler, and at least one hydrophobic additive. The second part may comprise an activator formulation. The roofing formulation may be applied as a coating to a roofing substrate. A roofing system may comprise at least one roof substrate and a multi-layer coating system. The multi-layer coating system may comprise at least one top layer and at least one core layer disposed between the at least one top layer and the at least one roof substrate.

A radiation-sensitive resin composition contains: a polymer that includes a structural unit including an acid-labile group; and a radiation-sensitive acid generating agent. The radiation-sensitive acid generating agent includes a sulfonate anion and a radiation-sensitive cation. The sulfonate anion includes two or more rings, and an iodine atom and a monovalent group having 0 to 10 carbon atoms which includes at least one of an oxygen atom and a nitrogen atom bond to at least one of the two or more rings. The ring is preferably an aromatic ring. The radiation-sensitive acid generating agent is preferably a compound represented by formula (1). In the formula (1), A.sup.1 represents a group obtained from a compound which includes a ring having 3 to 20 ring atoms by removing (p+q+r+1) hydrogen atoms on the ring.

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A method for manufacturing a patterned polyimide aerogel film on a substrate includes: dispensing a polyimide prepolymer sol onto a first portion of a surface of a substrate, a second portion of the surface of the substrate being substantially free of the polyimide prepolymer sol; forming a patterned film of a polyimide prepolymer gel on the substrate from the polyimide prepolymer sol; drying the polyimide prepolymer gel to form a patterned film of a polyimide prepolymer aerogel on the substrate; and curing the polyimide prepolymer aerogel on the substrate to form the patterned polyimide aerogel film on the first portion of the surface of the substrate, the second portion of the surface of the substrate being substantially free of the patterned polyimide aerogel film.

There is disclosed an optically clear shear thickening fluid and a protection assembly comprising the optically clear shear thickening fluid. It further relates to uses of the optically clear shear thickening fluid in electronic devices, particularly in optical display devices. The optically clear shear thickening fluid includes: (a) a solid nanoparticle having an average particle size equal to or less than 100 nm; (b) at least one polymer; and (c) a liquid medium. The at least one polymer is substantially soluble in the liquid medium.

A resist composition which generates acid upon exposure and exhibits changed solubility in a developing solution under action of acid, a total amount of a basic component including a compound represented by general formula (d0) and an acid-generator component is 25 to 60 parts by weight relative to 100 parts by weight of a base material component. In formula (d0), Rd.sup.0 represents a monovalent organic group; Xd.sup.0 represents —O—, —C(═O)—, —O—C(═O)—, —C(═O)—O—, —S— or —SO.sub.2—; Yd.sup.0 represents a single bond or a divalent hydrocarbon group which may have a substituent; M.sup.m+ represents a m-valent organic cation; and m represents an integer of 1 or more

Rd.sup.0-Xd.sup.0-Yd.sup.0-COO.sup.⊖(M.sup.m⊕).sub.1/m  (d0).