C08L33/066

AQUEOUS THERMOSETTING RESIN COMPOSITION AND CURED FILM

An object of the present invention is to obtain an aqueous thermosetting resin composition capable of obtaining satisfactory curing performance by a transesterification reaction between alkyl ester and a hydroxyl group. The aqueous thermosetting resin composition includes a resin component (A) that has —COOR (R is an alkyl group having 50 or less carbon atoms) and a hydroxyl group and a transesterification catalyst (B).

AQUEOUS THERMOSETTING RESIN COMPOSITION AND CURED FILM

An object of the present invention is to obtain an aqueous thermosetting resin composition capable of obtaining satisfactory curing performance by a transesterification reaction between alkyl ester and a hydroxyl group. The aqueous thermosetting resin composition includes a resin component (A) that has —COOR (R is an alkyl group having 50 or less carbon atoms) and a hydroxyl group and a transesterification catalyst (B).

METHOD FOR PRODUCING ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE

A method for producing an actinic ray-sensitive or radiation-sensitive resin composition of an embodiment of the present invention is a method for producing an actinic ray-sensitive or radiation-sensitive resin composition including at least a resin having a polarity that increases due to decomposition by the action of an acid, a compound that generates an acid upon irradiation with actinic rays or radiation, and a solvent, in which the compound that generates an acid upon irradiation with actinic rays or radiation includes one or more compounds selected from the group consisting of a compound (I) to (III) below, and the actinic ray-sensitive or radiation-sensitive resin composition is produced by mixing a first solution including the resin having a polarity that increases by the action of an acid and a first solvent with the one or more compounds selected from the group consisting of the compound (I) to (III).

METHOD FOR PRODUCING ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE

A method for producing an actinic ray-sensitive or radiation-sensitive resin composition of an embodiment of the present invention is a method for producing an actinic ray-sensitive or radiation-sensitive resin composition including at least a resin having a polarity that increases due to decomposition by the action of an acid, a compound that generates an acid upon irradiation with actinic rays or radiation, and a solvent, in which the compound that generates an acid upon irradiation with actinic rays or radiation includes one or more compounds selected from the group consisting of a compound (I) to (III) below, and the actinic ray-sensitive or radiation-sensitive resin composition is produced by mixing a first solution including the resin having a polarity that increases by the action of an acid and a first solvent with the one or more compounds selected from the group consisting of the compound (I) to (III).

Solvent-free acrylic resin composition, solvent-free acrylic adhesive using same, adhesive sheet, and production method for solvent-free acrylic resin composition

A solvent-free acrylic resin composition includes an acrylic resin (A), wherein the acrylic resin (A) contains 5 wt. % to 60 wt. % of a structural moiety derived from a hydroxy group-containing monomer (a1), and an acid value in the resin composition is from 0.001 mgKOH/g to 0.3 mgKOH/g. The solvent-free acrylic resin composition is suppressed in viscosity rise due to heating, and is hence excellent in thermal stability; the composition can be thickly applied when used as an adhesive; and the composition can provide an adhesive excellent in step followability, corrosion resistance, and moist-heat haze resistance.

Solvent-free acrylic resin composition, solvent-free acrylic adhesive using same, adhesive sheet, and production method for solvent-free acrylic resin composition

A solvent-free acrylic resin composition includes an acrylic resin (A), wherein the acrylic resin (A) contains 5 wt. % to 60 wt. % of a structural moiety derived from a hydroxy group-containing monomer (a1), and an acid value in the resin composition is from 0.001 mgKOH/g to 0.3 mgKOH/g. The solvent-free acrylic resin composition is suppressed in viscosity rise due to heating, and is hence excellent in thermal stability; the composition can be thickly applied when used as an adhesive; and the composition can provide an adhesive excellent in step followability, corrosion resistance, and moist-heat haze resistance.

NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATION FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT

The present invention is a negative photosensitive resin composition including: (A) an alkali-soluble resin containing at least one or more structures selected from a polyimide structure, a polybenzoxazole structure, a polyamide-imide structure, and a precursor structure thereof; (B) a crosslinkable polymer compound containing a structural unit represented by the following general formula (1) and having a group crosslinked with the component (A); (C) a compound that generates an acid by light; and (D) a heat crosslinking agent. An object of the present invention is to provide a negative photosensitive resin composition that enables formation of a fine pattern with high rectangularity and high resolution, has excellent mechanical characteristics even when cured at low temperatures, and furthermore, has no degradation in adhesive force between before and after a high temperature and high humidity test.

##STR00001##

POLYMERIZABLE ABSORBERS OF UV AND HIGH ENERGY VISIBLE LIGHT

Described are polymerizable high energy light absorbing compounds of formula I:

##STR00001##

Wherein Y, Pg, R.sup.2, R.sup.3, R.sup.4, R.sup.5, and R.sup.6 are as described herein. The compounds absorb various wavelengths of ultraviolet and/or high energy visible light and are suitable for incorporation in various products, such as biomedical devices and ophthalmic devices.

POLYMERIZABLE ABSORBERS OF UV AND HIGH ENERGY VISIBLE LIGHT

Described are polymerizable high energy light absorbing compounds of formula I:

##STR00001##

Wherein Y, Pg, R.sup.2, R.sup.3, R.sup.4, R.sup.5, and R.sup.6 are as described herein. The compounds absorb various wavelengths of ultraviolet and/or high energy visible light and are suitable for incorporation in various products, such as biomedical devices and ophthalmic devices.

ASSOCIATIVE AND EXCHANGEABLE OLIGOMERS, AND COMPOSITION CONTAINING SAME
20210309930 · 2021-10-07 · ·

A composition is obtained by mixing at least one oligomer A1, which is obtained by copolymerizing at least two monomers functionalized by diol functions with at least one second monomer, with at least one compound A2 having at least two boron ester functions. The compositions exhibit very varied rheological properties depending on the proportion of the compounds A1 and A2 used. A composition is also obtained by mixing at least one lubricating oil with such a composition of associative and exchangeable polymers, and the use of this composition to lubricate a mechanical part.