A multi-part curable composition includes: an A part including a polyoxyalkylene polymer (A) having a reactive silicon group, a (meth)acrylic ester polymer (B) having a reactive silicon group, and an epoxy resin curing agent (D); and a B part including an epoxy resin (C) and a silanol condensation catalyst (E). The (meth)acrylic ester polymer (B) is a polymer containing constituent monomers including 40 to 70% by weight of an alkyl (meth)acrylate (b1) having an alkyl having 1 to 3 carbon atoms, a monomer (b2) having a reactive silicon group and a polymerizable unsaturated group, and a macromonomer (b3) that is a (meth)acrylic ester polymer having a polymerizable unsaturated group.

A multi-part curable composition includes: an A part including a polyoxyalkylene polymer (A) having a reactive silicon group, a (meth)acrylic ester polymer (B) having a reactive silicon group, and an epoxy resin curing agent (D); and a B part including an epoxy resin (C) and a silanol condensation catalyst (E). The (meth)acrylic ester polymer (B) is a polymer containing constituent monomers including 40 to 70% by weight of an alkyl (meth)acrylate (b1) having an alkyl having 1 to 3 carbon atoms, a monomer (b2) having a reactive silicon group and a polymerizable unsaturated group, and a macromonomer (b3) that is a (meth)acrylic ester polymer having a polymerizable unsaturated group.

The present invention relates to a positive-type photosensitive resin composition and a cured film prepared therefrom. The composition comprises a photopolymerizable compound containing a double bond and a specific photopolymerization initiator, wherein the photopolymerizable compound containing a double bond suppresses the photopolymerization reaction upon exposure to light but causes the photopolymerization reaction at the time of photobleaching after development, thereby controlling the flowability of the composition during thermal curing. Thus, a pattern is readily formed, which makes it possible to maintain excellent sensitivity upon the development and even upon the hard-bake process after the development, and it is possible to provide a cured film that is excellent in film strength and film retention rate.

The present invention relates to a positive-type photosensitive resin composition and a cured film prepared therefrom. The composition comprises a photopolymerizable compound containing a double bond and a specific photopolymerization initiator, wherein the photopolymerizable compound containing a double bond suppresses the photopolymerization reaction upon exposure to light but causes the photopolymerization reaction at the time of photobleaching after development, thereby controlling the flowability of the composition during thermal curing. Thus, a pattern is readily formed, which makes it possible to maintain excellent sensitivity upon the development and even upon the hard-bake process after the development, and it is possible to provide a cured film that is excellent in film strength and film retention rate.

A composition is provided comprising an epoxide functional polymer comprising epoxide functional groups, wherein the epoxide functional polymer has a number average molecular weight of 1000 to 10.000 g/mol and a grafted polylactic acid, wherein the polylactic acid is grafted with an acid-functional ethylenically unsaturated polymerizable monomer and/or an acid anhydride-functional ethylenically unsaturated polymerizable monomer and has a total amount of carboxylic acid groups and carboxylic acid anhydride groups between 10.0 and 60.0 mg KOH/g.

A composition is provided comprising an epoxide functional polymer comprising epoxide functional groups, wherein the epoxide functional polymer has a number average molecular weight of 1000 to 10.000 g/mol and a grafted polylactic acid, wherein the polylactic acid is grafted with an acid-functional ethylenically unsaturated polymerizable monomer and/or an acid anhydride-functional ethylenically unsaturated polymerizable monomer and has a total amount of carboxylic acid groups and carboxylic acid anhydride groups between 10.0 and 60.0 mg KOH/g.

A polyester blend is made in a reaction of a linear polylactide resin and a thermoplastic epoxy group-containing polymer. The polyester blend is blended with a polyester having a glass transition temperature below 0C to form a polyester blend that is particular useful for making paperboard coatings in a melt extrusion process.

A laminated body in which a thermoplastic resin layer, a thermosetting resin layer, and a protective film are layered one on another in this order, in which the thermosetting resin layer contains a thermosetting resin composition containing two or more kinds of organometallic complex, a surface of the protective film at an opposite side of the thermosetting resin layer has a surface roughness Ra of 30 nm or less, and an amount of nitrogen atoms present at the surface of the protective film at the side of the thermosetting resin layer is less than 1 atm %.

A laminated body in which a thermoplastic resin layer, a thermosetting resin layer, and a protective film are layered one on another in this order, in which the thermosetting resin layer contains a thermosetting resin composition containing two or more kinds of organometallic complex, a surface of the protective film at an opposite side of the thermosetting resin layer has a surface roughness Ra of 30 nm or less, and an amount of nitrogen atoms present at the surface of the protective film at the side of the thermosetting resin layer is less than 1 atm %.

The present invention relates to a polymerizable composition, which comprises (a) at least one radically polymerizable oligomer, (b) at least one radically polymerizable monomer and (c) at least one initiator for the radical polymerization, characterized in that the radically polymerizable oligomer (a) is selected from the group consisting of aliphatic urethane (meth)acrylate oligomers, epoxy (meth)acrylate oligomers and polyether urethane (meth)acrylate oligomers, and the radically polymerizable monomer (b) is polyfunctional.