A hydrogen barrier agent capable of imparting hydrogen barrier performance to various materials; a hydrogen barrier film forming composition including the hydrogen barrier agent; a hydrogen barrier film including the hydrogen barrier agent; a method for producing a hydrogen barrier film, which uses the composition; and an electronic element provided with the hydrogen barrier film. A salt compound having a specific structure including an imidazolyl group is used as the hydrogen barrier agent. The composition is prepared by blending the hydrogen barrier agent into the base material component. The hydrogen barrier film is formed using the hydrogen barrier film forming composition.

A hydrogen barrier agent capable of imparting hydrogen barrier performance to various materials; a hydrogen barrier film forming composition including the hydrogen barrier agent; a hydrogen barrier film including the hydrogen barrier agent; a method for producing a hydrogen barrier film, which uses the composition; and an electronic element provided with the hydrogen barrier film. A salt compound having a specific structure including an imidazolyl group is used as the hydrogen barrier agent. The composition is prepared by blending the hydrogen barrier agent into the base material component. The hydrogen barrier film is formed using the hydrogen barrier film forming composition.

A thermoset barrier film including: a reaction product of the formulas (I), (II), (III), (IV), or a mixture thereof, as defined herein. Also disclosed are methods of making and using the thermoset barrier film, and devices incorporating the thermoset barrier film.

A thermoset barrier film including: a reaction product of the formulas (I), (II), (III), (IV), or a mixture thereof, as defined herein. Also disclosed are methods of making and using the thermoset barrier film, and devices incorporating the thermoset barrier film.

An epoxy resin composition for semiconductor device encapsulation films, a film for encapsulation of semiconductor devices, and a semiconductor device encapsulated using the same, the epoxy resin composition including a liquid epoxy resin; a curing agent; about 2 wt % to about 10 wt % of a binder resin; and about 50 wt % or more of an oxide, a nitride, a carbide, or a hydroxide of gadolinium, boron, samarium, cadmium, or europium, all wt % being based on a total weight of the epoxy resin composition.

An epoxy resin composition for semiconductor device encapsulation films, a film for encapsulation of semiconductor devices, and a semiconductor device encapsulated using the same, the epoxy resin composition including a liquid epoxy resin; a curing agent; about 2 wt % to about 10 wt % of a binder resin; and about 50 wt % or more of an oxide, a nitride, a carbide, or a hydroxide of gadolinium, boron, samarium, cadmium, or europium, all wt % being based on a total weight of the epoxy resin composition.

The present invention relates to a plastic composition based on biodegradable and bio-based polyesters, in particular for the preparation of plastic films.

A glass fiber-reinforced polyolefin resin material, containing: a glass fiber; and a thermoplastic resin, wherein said thermoplastic resin contains: at least, a specific graft-modified polypropylene, wherein, with respect to the graft-modified polypropylene, each specific amounts of the glass fiber and a compound or polymer having an acid anhydride structure are contained, and wherein, in the content of a graft-modification component in the graft-modified polypropylene, the content of a component obtained from the (meth)acrylate containing an epoxy group is 0.5 or more and 10 or less parts by mass with respect to 100 parts by mass of said polypropylene, and a component obtained from the aromatic vinyl compound has a mass equal to or less than said component obtained from the (meth)acrylate; a composition for said resin material; a method of producing the same; and a composite.

A novel compound which absorbs long-wavelength active energy rays and generates with high-efficiency radicals and strong bases, and which has excellent reaction efficiency in a base generating chain reaction; a photopolymerization initiator which contains said compound; and a photosensitive resin composition which contains said photopolymerization initiator are provided, where the novel compound is represented by formula (1), where, in formula (1), R.sub.1, R.sub.2, R.sub.3, R.sub.5 and R.sub.6 independently represent a hydroxyl group, an alkoxy group, or an organic group other than those substituents, the R.sub.4's independently represent an organic group including a thioether bond, ‘A’ represents a substituent represented by formula (1-1) or (1-2), where, in formula (1-1), R.sub.7 and R.sub.8 independently represent a hydrogen atom, an alkyl group or a heterocyclic group, and where, in formula (1-2), R.sub.9 and R.sub.10 independently represent an amino group or a substituted amino group.

A novel compound which absorbs long-wavelength active energy rays and generates with high-efficiency radicals and strong bases, and which has excellent reaction efficiency in a base generating chain reaction; a photopolymerization initiator which contains said compound; and a photosensitive resin composition which contains said photopolymerization initiator are provided, where the novel compound is represented by formula (1), where, in formula (1), R.sub.1, R.sub.2, R.sub.3, R.sub.5 and R.sub.6 independently represent a hydroxyl group, an alkoxy group, or an organic group other than those substituents, the R.sub.4's independently represent an organic group including a thioether bond, ‘A’ represents a substituent represented by formula (1-1) or (1-2), where, in formula (1-1), R.sub.7 and R.sub.8 independently represent a hydrogen atom, an alkyl group or a heterocyclic group, and where, in formula (1-2), R.sub.9 and R.sub.10 independently represent an amino group or a substituted amino group.