A powder coating composition can include: a polyester polymer having carboxylic acid functional groups; a first crosslinker reactive with the carboxylic acid functional groups of the polyester polymer; and a fluoropolymer unreactive with the polyester polymer and first crosslinker. A weight ratio of the polyester polymer to the fluoropolymer is from 80:20 to 60:40. When cured, the powder coating composition forms a single coating layer including the polyester polymer and the fluoropolymer.

A powder coating composition can include: a polyester polymer having carboxylic acid functional groups; a first crosslinker reactive with the carboxylic acid functional groups of the polyester polymer; and a fluoropolymer unreactive with the polyester polymer and first crosslinker. A weight ratio of the polyester polymer to the fluoropolymer is from 80:20 to 60:40. When cured, the powder coating composition forms a single coating layer including the polyester polymer and the fluoropolymer.

A polymeric composition includes (a) 1 wt % to 45 wt % of an ethylene-based polymer; (b) 50 wt % to 90 wt % of a polybutylene terephthalate having a melt flow index from 21 g/10 min. to 35 g/10 min at 250 C and 2.16 Kg; and (c) 3.5 wt % to 10 wt % of a compatibilizer comprising a maleated ethylene-based polymer and ethylene n-butylacrylate glycidyl methacrylate.

A polymeric composition includes (a) 1 wt % to 45 wt % of an ethylene-based polymer; (b) 50 wt % to 90 wt % of a polybutylene terephthalate having a melt flow index from 21 g/10 min. to 35 g/10 min at 250 C and 2.16 Kg; and (c) 3.5 wt % to 10 wt % of a compatibilizer comprising a maleated ethylene-based polymer and ethylene n-butylacrylate glycidyl methacrylate.

Disclosed are a UV curable adhesive composition, an adhesive tape comprising the UV curable adhesive composition, an adhesive film formed by UV curing of the adhesive composition, and a corresponding bonding member. The UV curable adhesive composition and the adhesive tape comprising the UV curable adhesive composition have a hybrid system of reactive polyacrylate/epoxy resin/core-shell rubber particles/hydroxy-containing compound, wherein a cationic photoinitiator is used to initiate curing of the epoxy a resin.

Disclosed are a UV curable adhesive composition, an adhesive tape comprising the UV curable adhesive composition, an adhesive film formed by UV curing of the adhesive composition, and a corresponding bonding member. The UV curable adhesive composition and the adhesive tape comprising the UV curable adhesive composition have a hybrid system of reactive polyacrylate/epoxy resin/core-shell rubber particles/hydroxy-containing compound, wherein a cationic photoinitiator is used to initiate curing of the epoxy a resin.

This photosensitive resin composition comprises: a photosensitive prepolymer having a carboxyl group and an ethylenically unsaturated group; a photopolymerization initiator; a thermosetting agent; and a pigment. The thermosetting agent is a polycarbodiimide compound represented by formula (1), in which a carbodiimide group is protected by an amino group that dissociates at temperatures of 80□ or greater. The polycarbodiimide compound has a weight average molecular weight of 300-3000, and a carbodiimide equivalent weight of 150-600. When formed into a film having a dry film thickness of 10-40 μm, the maximum value of the transmittance of the photosensitive resin composition is at least 7% for the transmission spectrum of at least some of the wavelength from 350-430 nm. (In formula (1), R.sup.1, R.sup.2, X.sup.1, X.sup.2, and n are as defined in the description.)

The present invention relates to an adhesive film for a semiconductor, including: a first layer including an adhesive binder and a heat-dissipating filler; and a second layer including an adhesive binder and a magnetic filler, which is formed on at least one surface of the first layer, wherein the adhesive film has a predetermined composition for the adhesive binder included in each of the first layer and the second layer.

The present invention relates to an adhesive film for a semiconductor, including: a first layer including an adhesive binder and a heat-dissipating filler; and a second layer including an adhesive binder and a magnetic filler, which is formed on at least one surface of the first layer, wherein the adhesive film has a predetermined composition for the adhesive binder included in each of the first layer and the second layer.

The invention provides a polyolefin composition comprising (i) a polyolefin (A) comprising epoxy groups; and (ii) a polyolefin (B) comprising carboxylic acid groups and/or precursors thereof, with the proviso that at least one of (A) and (B) is polyethylene. Preferably one of (A) and (B) is a low density polyethylene (LDPE) and the other is a polypropylene.