A formaldehyde free adhesive composition and a plywood obtained by the adhesive composition is provided, and the plywood retains desired performances, such as water resistance and workability.

A formaldehyde free adhesive composition and a plywood obtained by the adhesive composition is provided, and the plywood retains desired performances, such as water resistance and workability.

Reprocessable materials are provided that include a product of cross-linking a glycidyl methacrylate grafted high-density polyethylene (HDPE-g-GMA) with a polymacrolactone of formula (II) to form a cross-linked polymer exhibiting vitrimer characteristics. Methods for preparing the cross-linked polymer materials include reacting the glycidyl methacrylate grafted high-density polyethylene of with the polymacrolactone in the presence of a first catalyst under conditions that initiate cross-linking of HDPE-g-GMA with the polymacrolactone. Mechanically reprocessable articles include a structural element that is or includes the cross-linked polymer material. Examples of the mechanically reprocessable articles include pallets or molded structures formed from the material and configured to support a load of at least 1000 kg without bending.

Reprocessable materials are provided that include a product of cross-linking a glycidyl methacrylate grafted high-density polyethylene (HDPE-g-GMA) with a polymacrolactone of formula (II) to form a cross-linked polymer exhibiting vitrimer characteristics. Methods for preparing the cross-linked polymer materials include reacting the glycidyl methacrylate grafted high-density polyethylene of with the polymacrolactone in the presence of a first catalyst under conditions that initiate cross-linking of HDPE-g-GMA with the polymacrolactone. Mechanically reprocessable articles include a structural element that is or includes the cross-linked polymer material. Examples of the mechanically reprocessable articles include pallets or molded structures formed from the material and configured to support a load of at least 1000 kg without bending.

The invention is directed to a resin composition containing polycarbonate, reinforced fibers and a compatibilizer having a reactive cyclic group, a resin molded article containing polycarbonate, reinforced fibers and a compatibilizer having a reactive cyclic group, and a method for preparing a resin composition including molten kneading polycarbonate, reinforced fibers and compatibilizer having a reactive cyclic group.

The invention is directed to a resin composition containing polycarbonate, reinforced fibers and a compatibilizer having a reactive cyclic group, a resin molded article containing polycarbonate, reinforced fibers and a compatibilizer having a reactive cyclic group, and a method for preparing a resin composition including molten kneading polycarbonate, reinforced fibers and compatibilizer having a reactive cyclic group.

A thermoset barrier film including: a reaction product of the formulas (I), (II), (III), (IV), or a mixture thereof, as defined herein. Also disclosed are methods of making and using the thermoset barrier film, and devices incorporating the thermoset barrier film.

A thermoset barrier film including: a reaction product of the formulas (I), (II), (III), (IV), or a mixture thereof, as defined herein. Also disclosed are methods of making and using the thermoset barrier film, and devices incorporating the thermoset barrier film.

The present teachings relate to compositions for forming a negative-tone photopatternable dielectric material, where the compositions include, among other components, an organic filler and one or more photoactive compounds, and where the presence of the organic filler enables the effective removal of such photoactive compounds (after curing, and during or after the development step) which, if allowed to remain in the photopatterned dielectric material, would lead to deleterious effects on its dielectric properties.

The present teachings relate to compositions for forming a negative-tone photopatternable dielectric material, where the compositions include, among other components, an organic filler and one or more photoactive compounds, and where the presence of the organic filler enables the effective removal of such photoactive compounds (after curing, and during or after the development step) which, if allowed to remain in the photopatterned dielectric material, would lead to deleterious effects on its dielectric properties.