A resin composition is provided, which includes a novel low dielectric resin, a SBS resin, a cross-linking agent, a PPE resin, a halogen-free flame retardant, a spherical silica, and a siloxane coupling agent. The novel low dielectric resin is a maleimide resin. With the formula, the resin composition may improve resin fluidity and glass transition temperature (Tg) while maintaining low dielectric, thereby enhancing the overall processability.

The disclosure provides a vinyl-containing aromatic alicyclic copolymer, a resin composition and a product thereof. The resin composition includes the vinyl-containing aromatic alicyclic copolymer, and the product made of the resin composition has a Tg of greater than 200? C., a dielectric constant Dk (10 GHz) of less than 3.0 and a dielectric loss Df (10 GHz) of less than 0.0014.

A rivetable adhesive for use in a joint between dissimilar materials, comprising a Nquid epoxy resin, an expoxidized polysulfide, a flexibilizer, a solid epoxy CTBN adduct based upon bisphenol A, a prienoxy resin, an impact modifier including methacrylate-butadiene-styrene, a curing agent; and a blowing agent. The adhesive finds particular suitability for use in riveting aluminum panels to steel structures, such as for forming automotive vehicle roof structures.

A rivetable adhesive for use in a joint between dissimilar materials, comprising a Nquid epoxy resin, an expoxidized polysulfide, a flexibilizer, a solid epoxy CTBN adduct based upon bisphenol A, a prienoxy resin, an impact modifier including methacrylate-butadiene-styrene, a curing agent; and a blowing agent. The adhesive finds particular suitability for use in riveting aluminum panels to steel structures, such as for forming automotive vehicle roof structures.

A method of manufacturing a resin composition is provided. The resin composition includes: 100 parts by mass in total of (A) polypropylene-based resin and (B) polyphenylene ether resin; 1 part to 20 parts by mass of (C) an admixture; and 0.01 parts to 0.5 parts by mass of (D) one or more compounds selected from the group consisting of a higher fatty acid, a higher fatty acid metal salt, and a higher fatty acid ester. A proportion X.sub.D(B+C) of the component (D) present in a whole fraction of 100 mass % dissolved in the chloroform is 0.13 mass % to 0.80 mass %. The method includes a step of melt-kneading the whole component (B), the whole component (C), and 15 mass % to 100 mass % of the component (D) to obtain kneaded material, and a step of adding the whole component (A) and the rest of the component (D).

A method of manufacturing a resin composition is provided. The resin composition includes: 100 parts by mass in total of (A) polypropylene-based resin and (B) polyphenylene ether resin; 1 part to 20 parts by mass of (C) an admixture; and 0.01 parts to 0.5 parts by mass of (D) one or more compounds selected from the group consisting of a higher fatty acid, a higher fatty acid metal salt, and a higher fatty acid ester. A proportion X.sub.D(B+C) of the component (D) present in a whole fraction of 100 mass % dissolved in the chloroform is 0.13 mass % to 0.80 mass %. The method includes a step of melt-kneading the whole component (B), the whole component (C), and 15 mass % to 100 mass % of the component (D) to obtain kneaded material, and a step of adding the whole component (A) and the rest of the component (D).

A composition for injection molding includes specific amounts of a poly(phenylene ether), a first hydrogenated triblock copolymer, a second hydrogenated triblock copolymer, a polypropylene, a polybutene, an ethylene/1-octene copolymer, and a flame retardant. At least one of the first and second hydrogenated triblock copolymers has a pre-hydrogenation vinyl content of 50 to 100 mole percent, based on moles of incorporated polybutadiene. Injection molded articles prepared from the composition include cable connectors and their parts.

A resin composition and an article made therefrom are provided. The resin composition includes: (A) 100 parts by weight of an unsaturated bond-containing polyphenylene ether resin; (B) 20 parts by weight to 150 parts by weight of a copolymer, the copolymer having a structural unit formed by a monomer of Formula (1) and a structural unit formed by a monomer of Formula (2), and the content of the structural unit formed by the monomer of Formula (2) in the copolymer is 55 wt % to 90 wt %; and (C) 10 parts by weight to 40 parts by weight of an unsaturated bond-containing crosslinking agent. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following properties can be improved, including glass transition temperature, Z-axis ratio of thermal expansion, multi-layer board heat resistance, interconnect stress test, dissipation factor aging rate, temperature coefficient of dielectric constant, temperature coefficient of dissipation factor and branch-like pattern at laminate edges.

A composition includes specific amounts of a poly(phenylene ether), a hydrogenated block copolymer of an alkenyl aromatic monomer and a conjugated diene, a polypropylene, a low molecular weight polybutene, a flame retardant, an ultraviolet absorbing agent, and a poly(alkylene oxide). The composition is useful as an insulation or jacketing material for wires and cables.

A resin composition is provided. The resin composition comprises the following components: (a) a thermal-curable resin system, which has a dielectric loss (Df) of not higher than 0.008 at 10 GHz and comprises a bismaleimide resin of the following formula (I),

##STR00001## wherein M1 and the Z1 groups are as defined in the specification; and (b) an organic compound of the following formula (II) or formula (III),

##STR00002## wherein R, R11 to R19 and R21 to R28 are as defined in the specification, and wherein the amount of the organic compound (b) ranges from 1 wt % to 30 wt % based on the total weight of the resin system (a) and the organic compound (b).