A laminated molded article includes a molded product formed from a resin composition and a metal thin-film layer. The composition contains a polyphenylene ether resin (A) and an amorphous -olefin copolymer (B). The resin (A) includes 95 to 99.95 mass % of a polyphenylene ether (i) and 0.05 to 5 mass % of a compound (ii) being at least one compound selected from the group consisting of: an organophosphorus compound having, in molecules thereof, a chemical structure represented by formula (I) or (II) (R in formula (II) is a trivalent saturated hydrocarbon group having a carbon number of 1 to 8 or a trivalent aromatic hydrocarbon group having a carbon number of 6 to 12); and a phosphonic acid, phosphonic acid ester, phosphinic acid, phosphinic acid ester, monocarboxylic acid, sulfonic acid, sulfinic acid, or carbonate other than the organophosphorus compound, relative to 100 mass %, in total, of components (i) and (ii).

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Provided is a pellet that contains a polyphenylene ether resin in a high concentration, is highly suitable for use as a modifier for imparting creep resistance, and has excellent post-molding external appearance. The pellet contains 80 mass % to 99 mass % of a polyphenylene ether resin (I) and 1 mass % to 20 mass % of a hydrogenated block copolymer (II) that is an at least partially hydrogenated product of a block copolymer including a polymer block P of mainly a vinyl aromatic compound and a polymer block Q of mainly a conjugated diene compound in which the total of 1,2-vinyl bond content and 3,4-vinyl bond content is 50% to 95%. No black spot contaminants having a major diameter of greater than 0.7 mm are present on front and rear surfaces of four plates of 90.0 mm50.0 mm2.0 mm in size obtained through molding of the pellet.

Provided is a pellet that contains a polyphenylene ether resin in a high concentration, is highly suitable for use as a modifier for imparting creep resistance, and has excellent post-molding external appearance. The pellet contains 80 mass % to 99 mass % of a polyphenylene ether resin (I) and 1 mass % to 20 mass % of a hydrogenated block copolymer (II) that is an at least partially hydrogenated product of a block copolymer including a polymer block P of mainly a vinyl aromatic compound and a polymer block Q of mainly a conjugated diene compound in which the total of 1,2-vinyl bond content and 3,4-vinyl bond content is 50% to 95%. No black spot contaminants having a major diameter of greater than 0.7 mm are present on front and rear surfaces of four plates of 90.0 mm50.0 mm2.0 mm in size obtained through molding of the pellet.

A method for forming a blended material for use as a deposition material in a fused filament fabrication (FFF) printer is provided. A semi-crystalline material and an amorphous material are physically mixed at an appropriate ratio. The mixed material is then heated to a temperature that is above the melting point of the semi-crystalline material and above the glass transition temperature of the amorphous material to form a blended material. The blended material is then extruded through an extruder die for use in the FFF printer.

Disclosed are fluorinated vinyl polymer resin compositions, and prepregs and laminate materials containing the same. The fluorinated vinyl polymer resin composition includes a fluorine-substituted vinyl polymer resin and a functional polymer, where the fluorine-substituted vinyl polymer resin has the chemical structure:

##STR00001## where the maximum particle size is less than about 100 microns, at least one of the substituents R.sub.1, R.sub.2, R.sub.3, and R.sub.4 includes a fluorine atom, and where n is greater than about 100. The fluorinated vinyl polymer resin composition can be incorporated in prepreg and laminate materials.

Disclosed are fluorinated vinyl polymer resin compositions, and prepregs and laminate materials containing the same. The fluorinated vinyl polymer resin composition includes a fluorine-substituted vinyl polymer resin and a functional polymer, where the fluorine-substituted vinyl polymer resin has the chemical structure:

##STR00001## where the maximum particle size is less than about 100 microns, at least one of the substituents R.sub.1, R.sub.2, R.sub.3, and R.sub.4 includes a fluorine atom, and where n is greater than about 100. The fluorinated vinyl polymer resin composition can be incorporated in prepreg and laminate materials.

Disclosed is a composition comprising from about 15 wt. % to about 80 wt. % of a thermoplastic resin, wherein the thermoplastic resin comprises a polyphenylene sulfide or a polyether ketone or a combination thereof; and from about 10 wt. % to 80 wt. % of a ceramic filler, wherein the ceramic filler comprises (a) an oxide of titanium, barium, calcium, magnesium, or copper, or strontium or a combination thereof, or (b) a titanate of calcium, magnesium, titanium, or copper or a combination thereof, and wherein the ceramic filler has a particle size of from about 0.1 m to about 10 m, wherein the composition exhibits a dielectric constant greater than 4, wherein the composition exhibits a dissipation factor less than 0.005 at 1.9 GHz, and wherein the combined weight percent value of all components does not exceed 100 wt. %, and all weight percent values are based on the total weight of the composition.

A poly(phenylene ether)-based composition exhibiting improved resistance to decomposition after repeated exposure to high voltages is prepared by melt-blending specific amounts of a poly(phenylene ether), an organophosphate ester flame retardant, and a surface energy reducing agent. The composition includes no more than 30 weight percent of mineral filler. Also described is an injection molded article prepared from the composition.

A poly(phenylene ether)-based composition exhibiting improved resistance to decomposition after repeated exposure to high voltages is prepared by melt-blending specific amounts of a poly(phenylene ether), an organophosphate ester flame retardant, and a surface energy reducing agent. The composition includes no more than 30 weight percent of mineral filler. Also described is an injection molded article prepared from the composition.

The present invention aims to provide resin particles that have excellent heat resistance and that, when used as base particles of conductive particles, are applicable to mounting by thermocompression bonding at low pressure to produce a connection structure having excellent connection reliability. The present invention also aims to provide conductive particles, a conductive material, and a connection structure each including the resin particles. Provided are resin particles having a 5% weight loss temperature of 350 C. or higher, a 10% K value at 25 C. of 100 N/mm.sup.2 or more and 2,500 N/mm.sup.2 or less, and a 30% K value at 25 C. of 100 N/mm.sup.2 or more and 1,500 N/mm.sup.2 or less.