A laminated molded article includes a molded product formed from a resin composition and a metal thin-film layer. The composition contains a polyphenylene ether resin (A) and an amorphous -olefin copolymer (B). The resin (A) includes 95 to 99.95 mass % of a polyphenylene ether (i) and 0.05 to 5 mass % of a compound (ii) being at least one compound selected from the group consisting of: an organophosphorus compound having, in molecules thereof, a chemical structure represented by formula (I) or (II) (R in formula (II) is a trivalent saturated hydrocarbon group having a carbon number of 1 to 8 or a trivalent aromatic hydrocarbon group having a carbon number of 6 to 12); and a phosphonic acid, phosphonic acid ester, phosphinic acid, phosphinic acid ester, monocarboxylic acid, sulfonic acid, sulfinic acid, or carbonate other than the organophosphorus compound, relative to 100 mass %, in total, of components (i) and (ii).

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A laminated molded article includes a molded product formed from a resin composition and a metal thin-film layer. The composition contains a polyphenylene ether resin (A) and an amorphous -olefin copolymer (B). The resin (A) includes 95 to 99.95 mass % of a polyphenylene ether (i) and 0.05 to 5 mass % of a compound (ii) being at least one compound selected from the group consisting of: an organophosphorus compound having, in molecules thereof, a chemical structure represented by formula (I) or (II) (R in formula (II) is a trivalent saturated hydrocarbon group having a carbon number of 1 to 8 or a trivalent aromatic hydrocarbon group having a carbon number of 6 to 12); and a phosphonic acid, phosphonic acid ester, phosphinic acid, phosphinic acid ester, monocarboxylic acid, sulfonic acid, sulfinic acid, or carbonate other than the organophosphorus compound, relative to 100 mass %, in total, of components (i) and (ii).

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Provided is a polyphenylene ether resin composition having excellent mechanical properties, such as tensile, flexural, and impact strength, high flame retardance, and adequate molding fluidity, and that is sufficiently resistant to use as a thin molded article for an electric/electronic device cooling fan, etc. The polyphenylene ether resin composition contains at least 90 mass % of a polyphenylene ether (A), a styrene resin (B), glass fiber (C), and an organophosphorus flame retardant (D) in terms of total mass of (A) to (D). Taking this total mass as 100 mass %, contents of the polyphenylene ether (A), styrene resin (B), glass fiber (C), and organophosphorus flame retardant (D) are 25-75 mass %, 0-5 mass %, 20-50 mass %, and 5-20 mass %, respectively, and taking mass of the organophosphorus flame retardant (D) as 100 mass %, content of at least one compound selected from the group consisting of triphenyl phosphate and a phosphazene is at least 70 mass %.

Disclosed is a resin composition including: a resin mixture (a) containing a polyphenylene ether resin and atactic homopolystyrene in an amount of above 50 mass % and below 94 mass %; a hydrogenated block copolymer (b) obtained by hydrogenating at least part of a block copolymer containing polymer blocks A and B in an amount of 1 to 20 mass %; a functional group-containing compound (c) having a specific functional group in an amount of 0.01 to 0.5 mass %; and a surface-treated inorganic filler (d) in an amount of 5 mass % or more and less than 30 mass %, in which the resin composition does not substantially contain a polymer having a hydrogenation ratio of less than 98% in a conjugated diene compound portion, the component (a-1) has a weight average molecular weight of less than 70,000, and the component (b) has a number average molecular weight of 150,000 to 300,000.

Disclosed is a resin composition including: a resin mixture (a) containing a polyphenylene ether resin and atactic homopolystyrene in an amount of above 50 mass % and below 94 mass %; a hydrogenated block copolymer (b) obtained by hydrogenating at least part of a block copolymer containing polymer blocks A and B in an amount of 1 to 20 mass %; a functional group-containing compound (c) having a specific functional group in an amount of 0.01 to 0.5 mass %; and a surface-treated inorganic filler (d) in an amount of 5 mass % or more and less than 30 mass %, in which the resin composition does not substantially contain a polymer having a hydrogenation ratio of less than 98% in a conjugated diene compound portion, the component (a-1) has a weight average molecular weight of less than 70,000, and the component (b) has a number average molecular weight of 150,000 to 300,000.

A lined pipe or fitting includes an outer layer containing high density polyethylene, and an inner layer containing a blend of poly(phenylene ether), polystyrene, and, optionally, a hydrogenated block copolymer. Relative to corresponding pipes and fittings made from high density polyethylene alone, the lined pipes and fittings exhibit improved resistance to chlorine and chlorine derivatives.

A lined pipe or fitting includes an outer layer containing high density polyethylene, and an inner layer containing a blend of poly(phenylene ether), polystyrene, and, optionally, a hydrogenated block copolymer. Relative to corresponding pipes and fittings made from high density polyethylene alone, the lined pipes and fittings exhibit improved resistance to chlorine and chlorine derivatives.

A resin composition that has an excellent balance between thermal creep resistance and toughness and from which a molded product with favorable appearance can be obtained is provided. The resin composition includes: 100 parts by mass in total of (A) polypropylene-based resin and (B) polyphenylene ether resin; 1 parts to 20 parts by mass of (C) an admixture; and 0.01 parts to 0.5 parts by mass of (D) one or more compounds selected from the group consisting of a higher fatty acid, a higher fatty acid metal salt, and a higher fatty acid ester, wherein when the resin composition is dissolved in chloroform, a proportion X.sub.D(B+C) of the component (D) present in a whole fraction of 100 mass % dissolved in the chloroform is 0.13 mass % to 0.80 mass %.

A resin composition that has an excellent balance between thermal creep resistance and toughness and from which a molded product with favorable appearance can be obtained is provided. The resin composition includes: 100 parts by mass in total of (A) polypropylene-based resin and (B) polyphenylene ether resin; 1 parts to 20 parts by mass of (C) an admixture; and 0.01 parts to 0.5 parts by mass of (D) one or more compounds selected from the group consisting of a higher fatty acid, a higher fatty acid metal salt, and a higher fatty acid ester, wherein when the resin composition is dissolved in chloroform, a proportion X.sub.D(B+C) of the component (D) present in a whole fraction of 100 mass % dissolved in the chloroform is 0.13 mass % to 0.80 mass %.

A resin composition is provided. The resin composition comprises the following components: (a) a thermal-curable resin system, which has a dielectric loss (Df) of not higher than 0.008 at 10 GHz and comprises a bismaleimide resin of the following formula (I),

##STR00001## wherein M1 and the Z1 groups are as defined in the specification; and (b) an organic compound of the following formula (II) or formula (III),

##STR00002## wherein R, R11 to R19 and R21 to R28 are as defined in the specification, and wherein the amount of the organic compound (b) ranges from 1 wt % to 30 wt % based on the total weight of the resin system (a) and the organic compound (b).