A polymer composition that contains a polyaryletherketone and a liquid crystalline polymer that includes repeating units derived from naphthenic hydroxycarboxylic acids, naphthenic dicarboxylic acids, or a combination thereof in an amount of about 15 mol. % or less of the polymer is provided. The composition optionally contains reinforcing fibers (e.g., glass fibers) in an amount of no more than about 10 wt. %.

It is intended to provide a polyphenylene ether resin composition that has favorable fluidity in molding while ensuring sufficiently high heat resistance and/or favorable mechanical properties. The present invention provides a polyphenylene ether resin composition comprising: 50% by mass or more and 99% by mass or less of a polyphenylene ether resin (A) having a reduced viscosity of 0.33 dl/g or more and 0.46 dl/g or less measured in an amount of 0.5 g/dl at 30° C. using a chloroform solvent; 0% by mass or more and 49% by mass or less of a polystyrene resin (B); and 1% by mass or more and 15% by mass or less of a styrene-acrylonitrile resin (C) having an acrylonitrile content of 16% by mass or more and 45% by mass or less.

It is intended to provide a polyphenylene ether resin composition that has favorable fluidity in molding while ensuring sufficiently high heat resistance and/or favorable mechanical properties. The present invention provides a polyphenylene ether resin composition comprising: 50% by mass or more and 99% by mass or less of a polyphenylene ether resin (A) having a reduced viscosity of 0.33 dl/g or more and 0.46 dl/g or less measured in an amount of 0.5 g/dl at 30° C. using a chloroform solvent; 0% by mass or more and 49% by mass or less of a polystyrene resin (B); and 1% by mass or more and 15% by mass or less of a styrene-acrylonitrile resin (C) having an acrylonitrile content of 16% by mass or more and 45% by mass or less.

A blend comprising: (i) a polymeric material (A) having a repeat unit of formula

—O—Ph—O—Ph—CO—Ph—  I

and a repeat unit of formula

—O—Ph—Ph—O—Ph—CO—Ph—  II

wherein Ph represents a phenylene moiety; and (ii) a polymeric material (B) having a repeat unit of formula (XX)

##STR00001##

wherein t1 and w1 independently represent 0 or 1 and v1 represents 0, 1 or 2.

A blend comprising: (i) a polymeric material (A) having a repeat unit of formula

—O—Ph—O—Ph—CO—Ph—  I

and a repeat unit of formula

—O—Ph—Ph—O—Ph—CO—Ph—  II

wherein Ph represents a phenylene moiety; and (ii) a polymeric material (B) having a repeat unit of formula (XX)

##STR00001##

wherein t1 and w1 independently represent 0 or 1 and v1 represents 0, 1 or 2.

A resin composition, comprising the following components: (a) a thermal-curable resin system, which has a dielectric loss (DO of not higher than 0.006 at 10 GHz; and (b) a metal hypophosphite of formula (I),

##STR00001## wherein a, R, and M.sup.a+ are as defined in the specification, and wherein the amount of the metal hypophosphite (b) is 1 wt % to 30 wt % based on the total weight of the resin system (a) and the metal hypophosphite (b).

A resin composition, comprising the following components: (a) a thermal-curable resin system, which has a dielectric loss (DO of not higher than 0.006 at 10 GHz; and (b) a metal hypophosphite of formula (I),

##STR00001## wherein a, R, and M.sup.a+ are as defined in the specification, and wherein the amount of the metal hypophosphite (b) is 1 wt % to 30 wt % based on the total weight of the resin system (a) and the metal hypophosphite (b).

The present invention relates to a thermoplastic molding composition comprising: A mixture of at least one polyamide A1, at least one polyphenylene ether A2 and optionally a compatibilizer A3 and optionally an olefinic and/or vinylaromatic polymer A4; B 10 to 60% by weight of glass filler, the glass composition of which comprises at least 10% by weight of boron oxide and at most 15% by weight for the sum of magnesium oxide and calcium oxide; C 1 to 8% by weight of LDS additive; D 0 to 5% by weight of additives other than components A, B and C;
wherein 80 to 100% by weight of mixture A consists of a mixture M of components A1, A2 and A3 and 0 to 20% by weight of component A4, in each case based on the sum of components M and A4, and wherein the sum of components M and A4 gives 100% by weight of mixture A, and wherein 36 to 92% by weight of mixture M is of component A2, from 8 to 60% by weight of component A1 and from 0 to 4% by weight of component A3, based in each case on the sum of components A1 to A3, and the sum of components A1 to A3 being 100% by weight of the mixture M, and the sum of components A to D being 100% by weight of the molding composition.

Disclosed herein are thermoplastic composition comprising (a) about 15 wt % to about 95 wt % polymer component comprising: (i) either about 20 wt % to about 85 wt % poly(p-phenylene oxide) and about 10 wt % to about 65 wt % flow promoter or about 70 wt % to 100 wt % polypropylene, said polypropylene being homopolymer and/or copolymer; and (ii) greater than about 0 wt % to about 30 wt % impact modifier; (b) about 2 wt % to about 50 wt % of a laser activatable additive having a core-shell structure, wherein the core comprises an inorganic filler and the shell comprises a laser activatable component; and (c) about 3 wt % to about 70 wt % inorganic fillers.

Disclosed herein are thermoplastic composition comprising (a) about 15 wt % to about 95 wt % polymer component comprising: (i) either about 20 wt % to about 85 wt % poly(p-phenylene oxide) and about 10 wt % to about 65 wt % flow promoter or about 70 wt % to 100 wt % polypropylene, said polypropylene being homopolymer and/or copolymer; and (ii) greater than about 0 wt % to about 30 wt % impact modifier; (b) about 2 wt % to about 50 wt % of a laser activatable additive having a core-shell structure, wherein the core comprises an inorganic filler and the shell comprises a laser activatable component; and (c) about 3 wt % to about 70 wt % inorganic fillers.