A resin composition includes: a polyphenylene ether compound; a curing agent reactable with the polyphenylene ether compound; and an inorganic filler including a boron nitride filler, wherein a particle size distribution of the inorganic filler, which is measured by a laser diffraction-based particle size distribution measuring method, has at least two peaks in a particle diameter range of 0.8 to 30.0 μm, the peaks including at least one peak in a particle diameter range of 0.8 to 5.0 μm and at least one peak in a particle diameter range of 5.0 to 30.0 μm.

A composition includes particular amounts of a poly(phenylene ether); a poly(alkylene terephtalate); a hydrogenated block copolymer of an alkenyl aromatic monomer and a conjugated diene; a compatibilizing agent; an arc suppressant comprising a nitrogen-containing compound, a phosphorus-containing compound, or a combination thereof; glass fiber, a mineral filler; and poly(tetrafluoroethylene). The composition can be particularly useful for use in molded circuit breakers.

A composition includes particular amounts of a poly(phenylene ether); a poly(alkylene terephtalate); a hydrogenated block copolymer of an alkenyl aromatic monomer and a conjugated diene; a compatibilizing agent; an arc suppressant comprising a nitrogen-containing compound, a phosphorus-containing compound, or a combination thereof; glass fiber, a mineral filler; and poly(tetrafluoroethylene). The composition can be particularly useful for use in molded circuit breakers.

Provided are a polymer film having excellent adhesiveness with a substrate, and a laminate using the polymer film. The polymer film contains a polymer having a dielectric loss tangent of 0.005 or less and a compound having a functional group, in which a concentration of the compound having a functional group is higher on at least one surface of the polymer film than inside of the polymer film.

A resin composition is provided. The resin composition comprises: (A) a compound having a structure of formula (I),

##STR00001## wherein R.sub.1 is an organic group; and (B) a vinyl-containing elastomer, wherein the weight ratio of the compound having the structure of formula (I) to the vinyl-containing elastomer is 20:1 to 1:1.

A polymer blend, including: (i) a poly(aryl ether ketone); (ii) a polysiloxane; and (iii) a block copolymer containing polysiloxane blocks. A process for manufacturing the polymer blend, the use of the polymer blend for the manufacture of parts, notably in the petroleum, cabling, aeronautical, motor vehicle, electronics, electrotechnical, composite, additive manufacturing and medical device sectors and also a part at least partially manufactured from said blend.

A resin composition includes 80 parts by weight to 160 parts by weight of a vinyl-containing resin, 0.1 part by weight to 1.0 part by weight of a first compound and 0.1 part by weight to 2.0 parts by weight of a second compound; wherein the vinyl-containing resin includes a vinyl-containing polyphenylene ether resin, a maleimide resin, a bis(vinylphenyl)ethane, a triallyl isocyanurate, a vinyl-containing polyolefin resin or a combination thereof, the first compound includes a structure of Formula (1) to Formula (3) or a combination thereof, and the second compound includes a structure of Formula (4) to Formula (6) or a combination thereof. Moreover, an article may be made from the resin composition, including a prepreg, a resin film, a laminate or a printed circuit board.

A core/shell polymer material suitable for three-dimensional printing is provided. The core/shell polymer material may include at least one amorphous polymer as a core particle and at least one semicrystalline polymer as a shell material surrounding the core particle.

A thermoplastic resin composition including 100 parts by weight of a base resin including 50-95% by weight of a polyarylene ether resin (a-1) and 5-50% by weight of a polystyrene resin (a-2); 8.5-16 parts by weight of two or more types of organophosphorus flame retardants (b) having different phosphorus contents; 0.5-3 parts by weight of organoclay (c); 0.5-3.5 parts by weight of pulverized mica (d); 1-4 parts by weight of an alkaline earth metal sulfate (e); and 1-5 parts by weight of a polyfunctional reactant (f), a method of preparing the thermoplastic resin composition, and a molded article including the thermoplastic resin composition. The thermoplastic resin composition has excellent mechanical properties, such as impact strength and tensile strength, heat resistance, electrical insulation, and flame retardancy.

A core/shell polymer material suitable for three-dimensional printing is provided. The core/shell polymer material may include at least one amorphous polymer as a core particle and at least one semicrystalline polymer as a shell material surrounding the core particle.