Provided is a curable composition that is soluble in various solvents (organic solvents other than highly toxic organic solvents, for example, cyclohexanone) while maintaining excellent low dielectric properties, wherein a film obtained by curing the curable composition has excellent mechanical properties. A curable composition, comprising: a polyphenylene ether having a functional group including an unsaturated carbon bond, which is obtained from raw material phenols including phenols satisfying at least condition 1 (having a hydrogen atom at an ortho position and a para position), and having a slope calculated by a conformation plot of less than 0.6; and at least one of a compound containing at least one maleimide group in one molecule, a triazine-based compound containing at least one thiol group, and crosslinked polystyrene particles.

Disclosed are a resin composition comprising 20 to 50 mass % of a polyphenylene ether-based resin (a), 0.1 to 9 mass % of a polyphenylene ether-based resin modified with an unsaturated carboxylic acid or acid anhydride thereof (b), 15 to 50 mass % of a homopolystyrene (c), 1 to 25 mass % of one or more selected from the group consisting of a hydrogenated block copolymer (d-1) and a rubber-modified polystyrene (d-2), and 5 to 35 mass % of glass fibers (e) which are surface-treated, a resin composition comprising 20 to 50 mass % of a polyphenylene ether-based resin (a), 15 to 50 mass % of a homopolystyrene (c), 5 to 35 mass % of glass fibers (e), and 0.01 to 1 mass % of compounds (f), a method of producing the same, a molded article, and a mechanical component and housing.

Disclosed are a resin composition comprising 20 to 50 mass % of a polyphenylene ether-based resin (a), 0.1 to 9 mass % of a polyphenylene ether-based resin modified with an unsaturated carboxylic acid or acid anhydride thereof (b), 15 to 50 mass % of a homopolystyrene (c), 1 to 25 mass % of one or more selected from the group consisting of a hydrogenated block copolymer (d-1) and a rubber-modified polystyrene (d-2), and 5 to 35 mass % of glass fibers (e) which are surface-treated, a resin composition comprising 20 to 50 mass % of a polyphenylene ether-based resin (a), 15 to 50 mass % of a homopolystyrene (c), 5 to 35 mass % of glass fibers (e), and 0.01 to 1 mass % of compounds (f), a method of producing the same, a molded article, and a mechanical component and housing.

A resin composition includes a prepolymer and an additive, wherein: the prepolymer is prepared from a mixture subjected to a prepolymerization reaction, and the mixture includes 100 parts by weight of a maleimide resin, 15 to 30 parts by weight of a siloxane compound and 4 to 16 parts by weight of a diamine compound; the maleimide resin includes bisphenol A diphenyl ether bismaleimide, 3,3′-dimethyl-5,5′-diethyl-4,4′-diphenylmethane bismaleimide or a combination thereof; the siloxane compound includes a compound of Formula (I), wherein n is an integer of 5 to 40; and the diamine compound includes a compound of Formula (II) or Formula (III). The resin composition is made by using a preparation method. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following properties can be improved, including dissipation factor, X-axis coefficient of thermal expansion, copper foil peeling strength, varnish precipitation property and resin compatibility.

##STR00001##

A resin composition includes a prepolymer and an additive, wherein: the prepolymer is prepared from a mixture subjected to a prepolymerization reaction, and the mixture includes 100 parts by weight of a maleimide resin, 15 to 30 parts by weight of a siloxane compound and 4 to 16 parts by weight of a diamine compound; the maleimide resin includes bisphenol A diphenyl ether bismaleimide, 3,3′-dimethyl-5,5′-diethyl-4,4′-diphenylmethane bismaleimide or a combination thereof; the siloxane compound includes a compound of Formula (I), wherein n is an integer of 5 to 40; and the diamine compound includes a compound of Formula (II) or Formula (III). The resin composition is made by using a preparation method. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following properties can be improved, including dissipation factor, X-axis coefficient of thermal expansion, copper foil peeling strength, varnish precipitation property and resin compatibility.

##STR00001##

A resin composition includes 100 parts by weight of a vinyl-containing polyphenylene ether resin; 2 parts by weight to 50 parts by weight of any compound having a structure of Formula (1) or a combination thereof; and 20 parts by weight to 80 parts by weight of a polyolefin resin; the polyolefin resin includes styrene-butadiene-divinylbenzene terpolymer, styrene-butadiene-maleic anhydride terpolymer, styrene-butadiene copolymer, hydrogenated styrene-butadiene copolymer, polybutadiene, maleic anhydride-butadiene copolymer or a combination thereof. Moreover, an article may be made from the resin composition, including a prepreg, a resin film, a laminate or a printed circuit board.

##STR00001##

A resin composition includes 100 parts by weight of a vinyl-containing polyphenylene ether resin; 2 parts by weight to 50 parts by weight of any compound having a structure of Formula (1) or a combination thereof; and 20 parts by weight to 80 parts by weight of a polyolefin resin; the polyolefin resin includes styrene-butadiene-divinylbenzene terpolymer, styrene-butadiene-maleic anhydride terpolymer, styrene-butadiene copolymer, hydrogenated styrene-butadiene copolymer, polybutadiene, maleic anhydride-butadiene copolymer or a combination thereof. Moreover, an article may be made from the resin composition, including a prepreg, a resin film, a laminate or a printed circuit board.

##STR00001##

A styrene resin having a syndiotactic structure, with an endothermic amount in a range of 175 to 260° C. of less than 30% based on the total endothermic amount, and a styrene resin composition containing 50 to 95% by mass of a thermoplastic resin composition and 5 to 50% by mass of a glass filler, the thermoplastic resin composition containing 100 parts by mass containing 80 to 100% by mass of a styrene resin having a syndiotactic structure and 0 to 20% by mass of a rubbery elastic material, 0.2 to 2.0 parts by mass of at least one kind of an antioxidant selected from a phenol-based antioxidant and a sulfur antioxidant, 1.5 to 5.0 parts by mass of at least one kind of a compound selected from a polyphenylene ether or a modified polyphenylene ether, and at least one kind selected from a nucleating agent or a release agent.

A styrene resin having a syndiotactic structure, with an endothermic amount in a range of 175 to 260° C. of less than 30% based on the total endothermic amount, and a styrene resin composition containing 50 to 95% by mass of a thermoplastic resin composition and 5 to 50% by mass of a glass filler, the thermoplastic resin composition containing 100 parts by mass containing 80 to 100% by mass of a styrene resin having a syndiotactic structure and 0 to 20% by mass of a rubbery elastic material, 0.2 to 2.0 parts by mass of at least one kind of an antioxidant selected from a phenol-based antioxidant and a sulfur antioxidant, 1.5 to 5.0 parts by mass of at least one kind of a compound selected from a polyphenylene ether or a modified polyphenylene ether, and at least one kind selected from a nucleating agent or a release agent.

The present application provides a resin component, and a prepreg and a circuit material using the same. The resin component comprises unsaturated polyphenylene ether resin, polyolefin resin, terpene resin and an initiator. When the total weight of the unsaturated polyphenylene ether resin, polyolefin resin and terpene resin is defined as 100 parts by weight, the terpene resin is in an amount of 3-40 parts by weight. The polyolefin resin is one or a combination of at least two selected from the group consisting of unsaturated polybutadiene resin, SBS resin and styrene butadiene resin. The present application discloses that the resulting resin composition has good film-forming properties, adhesion and dielectric properties through the coordination of unsaturated polyphenylene ether resin, unsaturated polyphenylene ether resin, polyolefin resin and terpene resin, and the circuit boards using the same have higher interlayer peel strength and lower dielectric loss.